Embedded Resistors in Printed Wiring Boards (Englisch)
- Neue Suche nach: Perala, K.
- Neue Suche nach: Institute of Electrical and Electronics Engineers
- Neue Suche nach: Perala, K.
- Neue Suche nach: Institute of Electrical and Electronics Engineers
In:
International advanced packaging materials symposium
;
220-229
;
2004
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ISBN:
- Aufsatz (Konferenz) / Print
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Titel:Embedded Resistors in Printed Wiring Boards
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Beteiligte:Perala, K. ( Autor:in ) / Institute of Electrical and Electronics Engineers
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Kongress:9th, International advanced packaging materials symposium ; 2004 ; Atlanta, GA
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Erschienen in:
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Verlag:
- Neue Suche nach: IEEE
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Erscheinungsdatum:01.01.2004
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Format / Umfang:10 pages
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Anmerkungen:IEEE cat. no. 04TH8742
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ISBN:
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Medientyp:Aufsatz (Konferenz)
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Format:Print
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Sprache:Englisch
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Schlagwörter:
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Datenquelle:
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Inhaltsverzeichnis Konferenzband
Die Inhaltsverzeichnisse werden automatisch erzeugt und basieren auf den im Index des TIB-Portals verfügbaren Einzelnachweisen der enthaltenen Beiträge. Die Anzeige der Inhaltsverzeichnisse kann daher unvollständig oder lückenhaft sein.
- 1
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Development of isotropic conductive adhesives with improved conductivityYi Li, / Kyoung-sik Moon, / Haiying Li, / Wong, C.P. et al. | 2004
- 7
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Display driver packaging: ACF reaching the limits?Savolainen, P. et al. | 2004
- 11
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Recent advances of interconnection technologies using anisotropic conductive films in flat panel display applicationsWatanabe, I. / Fujinawa, T. / Arifuku, M. / Fujii, M. / Yasushi, G. et al. | 2004
- 17
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Electromigration of Sn-9Zn solder in contact with CuKwang-Lung Lin, / Yen-Hsiang Fang, et al. | 2004
- 21
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The dimensional stability of optoelectronic adhesivesPearson, R.A. / Connelly, G. et al. | 2004
- 25
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Effects of substrate metallization on the degradation of flip chip interconnects under electromigrationWu, J.D. / Lee, C.W. / Zheng, P.J. / Li, S. et al. | 2004
- 31
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- 38
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- 38
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Process and design analysis for ultra fine-pitched wiresweep elimination in advanced copper heat spreader BGAChungpaiboonpatana, S. / Shi, F.G. / Li, G.P. et al. | 2004
- 45
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Physical properties and thermocycling performance of electrically conductive adhesives (ECAs) modified by flexible moleculesHaiying Li, / Kyoung-Sik Moon, / Yi Li, / Lianhua Fan, / Jianwen Xu, / Wong, C.P. et al. | 2004
- 51
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Packaging of Cu/low-k IC devices: a novel surface passivation and direct fine-pitched gold wirebond ball interconnects analysisChungpaiboonpatana, S. / Shi, F.G. / Lip, G.P. et al. | 2004
- 57
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Influence of materials data on the performance modelling in the design of MEMS packagesFischer, S. / Wilde, J. / Deier, E. / Zukowski, E. et al. | 2004
- 57
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Influence of Materials Data on the Performance Modeling in the Design of MEMS PackagesWilde, J. / Deier, E. / Fischer, S. / Zukowski, E. / Institute of Electrical and Electronics Engineers et al. | 2004
- 63
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Packaging of devices for topside cooling by replacing air-bridges with Su-8 polymer bridges [MESFET example]Wright, J.I. / Fillion, R. / Meyer, L. / Shaddock, D. et al. | 2004
- 63
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Packaging of Devices for Topside Cooling by Replacing Air-Bridges With Su-8 Polymer BridgesWright, J. / Fillion, R. / Meyer, L. / Shaddock, D. / Institute of Electrical and Electronics Engineers et al. | 2004
- 69
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Material synthesis routes for thin film bonding interfaces in reworkable and bumpless nano-interconnectsAggarwal, A.O. / Raj, P.M. / Abothu, I.R. / Ravi, D. / Sacks, M.D. / Tay, A.A.O. / Tummala, R.R. et al. | 2004
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Material Synthesis Routes for Thin Film Bonding Interfaces in Repairable and Bumpless Nano-InterconnectsAggarwal, A. O. / Raj, P. M. / Abothu, I. R. / Doraiswami, R. / Sacks, M. D. / Tay, A. / Tummala, R. R. / Institute of Electrical and Electronics Engineers et al. | 2004
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- 95
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Multi-walled Carbon Nanotube Composite (Au+MWCNT) for Electrical Interconnection and Reduction of Microelectronic CorrosionPike, R. T. / Dellmo, R. / Wade, J. / Newland, S. / Hyland, G. / Newton, C. M. / Institute of Electrical and Electronics Engineers et al. | 2004
- 100
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Epoxy-based optically transparent nanocomposites for photonic packagingYan Zhou, / Shi, F.G. et al. | 2004
- 103
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3-dimensional nano fabrication process of quartzTaniguchi, J. / Iida, M. / Miyazawa, T. / Miyamoto, I. et al. | 2004
- 107
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Fast hybrid electromagnetic/statistical approach for design and optimization of RF systems and packagesBushyager, N. / Staiculescu, D. / Martin, L. / Lee, J.-H. / Vasiloglou, N. / Tentzeris, M.M. et al. | 2004
- 112
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Dielectric characteristics of complex composite systems containing interphase regionsTodd, M. / Shi, F. et al. | 2004
- 118
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A novel technique for lead-free soldering process using variable frequency microwave (VFM)Kyoung-sik Moon, / Yi Li, / Jianwen Xu, / Wong, C.P. et al. | 2004
- 118
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A Novel Technique for Lead-Free Soldering Using Variable Frequency Microwave (VFM)Moon, K.-s. / Li, Y. / Xu, J. / Wong, C. P. / Institute of Electrical and Electronics Engineers et al. | 2004
- 126
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Electrical property of conductive adhesives during temperature/humidity agingKyoung-sik Moon, / Yi Li, / Wong, C.P. et al. | 2004
- 132
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Fundamental research on surface modification of nano-size silica for underfill applicationsYangyang Sun, / Zhuqing Zhang, / Wong, C.P. et al. | 2004
- 139
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Formation of self assembled monolayer (SAM) on metal surfaces for high performance anisotropically conductive adhesivesYi Li, / Kyoung-sik Moon, / Wong, C.P. et al. | 2004
- 145
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A micromechanics model for electrical conduction in isotropically conductive adhesives during curingBin Su, / Jianmin Qu, et al. | 2004
- 152
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Molecular dynamics study on coalescence of silver (Ag) nanoparticles and their deposition on gold (Au) substratesHai Dong, / Kyoung-sik Moon, / Wong, C.P. et al. | 2004
- 158
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Effects of the low loss polymers on the dielectric behavior of novel aluminum-filled high-k nano-compositesJianwen Xu, / Wong, C.P. et al. | 2004
- 158
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Effects of the Low Loss Polymers on the Dielectric Behavior of Novel Aluminum-filled High-K Nno-CompositesXu, J. / Wong, C. P. / Institute of Electrical and Electronics Engineers et al. | 2004
- 171
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Magnetic nanocomposite for high Q embedded inductorHai Dong, / Fuhan Liu, / Wong, C.P. / Qing Song, / Zhang, Z.J. et al. | 2004
- 175
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- 175
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Formation and Dielectric Properties of a Novel Polymer-Metal NanocompositeLi, Y. / Pothukuchi, S. / Wong, C. P. / Institute of Electrical and Electronics Engineers et al. | 2004
- 182
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High aspect ratio metal-polymer composite structures for nano interconnectsAggarwal, A.O. / Raj, P.M. / Tummala, R.R. et al. | 2004
- 187
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Effective elastic modulus of nano-particlesDingreville, R. / Jiamnin Qu, / Cherkaoui, M. et al. | 2004
- 193
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Effects of nano-sized particles on electrical and thermal conductivities of polymer compositesLianhua Fan, / Bin Su, / Jianmin Qu, / Wong, C.P. et al. | 2004
- 200
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Formulation of different shapes of nanoparticles and their incorporation into polymersPothukuchi, S. / Yi Li, / Wong, C.P. et al. | 2004
- 204
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Influence of Thermal Treatment on Conductivity of PEDT FilmsLi, J. / Fan, L. / Wong, C. P. / Institute of Electrical and Electronics Engineers et al. | 2004
- 204
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Influence of thermal treatment on the conductivity of PEDT filmsJun Li, / Lianhua Fan, / Wong, C.P. et al. | 2004
- 208
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Study and characterizations on the post cure behavior of underfillZhuqing Zhang, / Wong, C.P. et al. | 2004
- 208
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Study and Characterizations on the Post Cure Behavior of UnderfillsZhang, Z. / Wong, C. P. / Institute of Electrical and Electronics Engineers et al. | 2004
- 215
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Application of Au-Sn eutectic bonding in hermetic RF MEMS wafer level packagingWoonbae Kim, / Qian Wang, / Kyudong Jung, / Junsik Hwang, / Changyoul Moon, et al. | 2004
- 220
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Embedded resistors in printed wiring boardsPerala, K. et al. | 2004
- 230
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Tuning of electric artworks of printed circuit boards to reduce warpageHutapea, P. / Grenestedt, J.L. et al. | 2004
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A new method to measure dielectric constant and dissipation factor of printed circuit board laminate material in function of temperature and frequencyHeinola, J.-M. / Latti, K.-P. / Silventoinen, P. / Strom, J.-P. / Kettunen, M. et al. | 2004
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A method to evaluate effects of moisture absorption on dielectric constant and dissipation factor of printed circuit board materialsHeinola, J.-M. / Latti, K.-P. / Silventoinen, P. / Strom, J.-P. / Kettunen, M. et al. | 2004
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A Method to Evaluate Effects of Moisture Absorption on Dielectric Constant and Dissipation Factor of Printed Circuit Board MaterialHeinola, J.-M. / Latti, K.-P. / Silventoinen, P. / Strom, J.-P. / Kettunen, M. / Institute of Electrical and Electronics Engineers et al. | 2004
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Novel board material technology for next-generation packagingKumbhat, N. / Hegde, S. / Markondeya Raj, P. / Pucha, R.V. / Doraiswami, R. / Hayes, S. / Atmur, S. / Bhattacharya, S. / Sitaraman, S.K. / Tummala, R.R. et al. | 2004
- 253
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Influence of nanosilica on composite underfill properties in flip chip packagingYangyang Sun, / Zhuqing Zhang, / Wong, C.P. et al. | 2004
- 260
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Initiation and propagation of delaminations at the underfill/passivation interface in flip-chip assembliesPearson, R.A. / McAdams, B.J. et al. | 2004
- 264
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- 267
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GHz flip chip interconnect experimentsBoustedt, K. / Karnfelt, C. et al. | 2004
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Void free processing of flip chip on board assemblies using no-flow underfillsColella, M. / Baldwin, D. et al. | 2004
- ii
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2004 9th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces| 2004
- iii
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2004 9th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces Table of Contents & Program| 2004
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2004 Proceedings. 9th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces (IEEE Cat. No.04TH8742)| 2004