A 300-mm Silicon Photonics Platform for Large-Scale Device Integration (Englisch)
- Neue Suche nach: Horikawa, T.
- Neue Suche nach: Shimura, D.
- Neue Suche nach: Okayama, H.
- Neue Suche nach: Seok-Hwan, J.
- Neue Suche nach: Takahashi, H.
- Neue Suche nach: Ushida, J.
- Neue Suche nach: Sobu, Y.
- Neue Suche nach: Shiina, A.
- Neue Suche nach: Tokushima, M.
- Neue Suche nach: Kinoshita, K.
- Neue Suche nach: Horikawa, T.
- Neue Suche nach: Shimura, D.
- Neue Suche nach: Okayama, H.
- Neue Suche nach: Seok-Hwan, J.
- Neue Suche nach: Takahashi, H.
- Neue Suche nach: Ushida, J.
- Neue Suche nach: Sobu, Y.
- Neue Suche nach: Shiina, A.
- Neue Suche nach: Tokushima, M.
- Neue Suche nach: Kinoshita, K.
In:
IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS
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24
, 4
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1-15
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2018
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ISSN:
- Aufsatz (Zeitschrift) / Print
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Titel:A 300-mm Silicon Photonics Platform for Large-Scale Device Integration
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Beteiligte:Horikawa, T. ( Autor:in ) / Shimura, D. ( Autor:in ) / Okayama, H. ( Autor:in ) / Seok-Hwan, J. ( Autor:in ) / Takahashi, H. ( Autor:in ) / Ushida, J. ( Autor:in ) / Sobu, Y. ( Autor:in ) / Shiina, A. ( Autor:in ) / Tokushima, M. ( Autor:in ) / Kinoshita, K. ( Autor:in )
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Erschienen in:IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS ; 24, 4 ; 1-15
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Verlag:
- Neue Suche nach: Institute of Electrical and Electronics Engineers (IEEE)
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Erscheinungsdatum:01.01.2018
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Format / Umfang:15 pages
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ISSN:
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Medientyp:Aufsatz (Zeitschrift)
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Format:Print
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Sprache:Englisch
- Neue Suche nach: 537.5
- Weitere Informationen zu Dewey Decimal Classification
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Klassifikation:
DDC: 537.5 -
Datenquelle:
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