Quantitative description of micro-structural changes in lead-free solder alloys (Englisch)

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Inhaltsverzeichnis Konferenzband

Die Inhaltsverzeichnisse werden automatisch erzeugt und basieren auf den im Index des TIB-Portals verfügbaren Einzelnachweisen der enthaltenen Beiträge. Die Anzeige der Inhaltsverzeichnisse kann daher unvollständig oder lückenhaft sein.

435
Elastoplastic harmonic analysis of board-level swept sine vibration tests
Yeh, Chang-lin / Lai, Yi-shao | 2006
203
Effect of electric current on the mechanical properties and interfacial microstructure of Ni-P/Sn-3.5Ag and Ni/Sn-3.5Ag solder joints
Kumar, Aditya / Chen, Zhong / Wong, C. / Mhaisalkar, S. / Kripesh, Vaidhyanathan | 2006
773
Impact of hygroswelling and vapor pressure on delamination
Zhao, Shufeng / Chen, Xu / Yao, Jinzhong | 2006
544
Design and fabrication of single mode rib waveguides using sol-gel derived organic-inorganic hybrid materials
Xiao, Zhang / Zhiqiang, Zhao / Min, Qian / Xianting, Zeng / Plante, Patrik | 2006
560
Nanoindentation study of sputtered Al-Cu thin films for interconnect applications
Kumar, Amit / Jayaganthan, R. / Chandra, Ramesh / Chawla, Vipin / Tay, A.A.O. | 2006
35
Design rules for post-CMOS through silicon vias in an industrial environment
Warnat, Stephan / Marenco, Norman / Kähler, Dirk / Reinert, Wolfgang | 2006
1
Characterization of low temperature processing and high density integrated capacitor on organic substrate
Fan, W. / Lok, B. / Lu, Albert / Wai, L. | 2006
739
Non-destructive inspection of electro-mechanical systems using micro X-ray computed tomography (proposal of CT reconstruction methods for eliminating metal artifacts)
Koseki, Michihiko / Hashimoto, Shuhei / Sato, Shinpei / Kimura, Hitoshi / Inou, Norio | 2006
766
Mechanical characterization of microelectronics embedded in flexible and stretchable substrate
Wang, L. / T.zoumpoulidis, / Bartek, M. / Polyakov, A. / Jansen, K.M.B. / Ernst, L.J. | 2006
585
Effect of electromigration temperature on dominant migration and hillock phases of eutectic SnPb alloys
Yoon, Min-seung / Lee, Yong-duk / Kim, Oh-han / Joo, Young-chang / Park, Young-bae | 2006
531
Bondability, moldability, and reliability of very-long, multi-height Au bonding wires
Tok, C.W. / Rulloda, O. / Calpito, D.R.M. / Wulff, F.W. / Pasamanero, E. | 2006
1
Embedded wafer level ball grid array (eWLB)
Brunnbauer, M. / Fürgut, E. / Beer, G. / Meyer, T. | 2006
390
Quantitative description of micro-structural changes in lead-free solder alloys
Muller, Wolfgang / Bohme, Thomas | 2006
643
High-frequency characterization of embedded active components in printed circuit boards
Cauwe, Maarten / Baets, Johan / Calster, Andre | 2006
831
Spray coating of photoresist for realizing through-wafer interconnects
Pham, Nga / Bulcke, Mathieu / Moor, Piet | 2006
1
Short time die attach characterization of LED for in-line testing application
Szabo, P. / Rencz, M. / Farkas, G. / Poppe, A. | 2007
302
Board level solder joint life prediction of fine pitch large IC
Chong, C.W. / Zhang, Xiaowu / Chai, T.C. | 2006
6
Shape matching-assisted self-assembly of microchips on a silicon substrate
Yan, L.L. / Lin, Y.L. / Ong, Y.Y. / Liao, E.B. / Kripesh, V. | 2006
10
Comparison study from sputtering, sol-gel, and ALD processes developing embedded thin film capacitors
Ahn, Jinyong / Lee, Joseph / Kim, Joonsung / Yoo, Jegwang / Ryu, Changsup | 2006
15
Overview and emerging challenges in mechanical dicing of silicon wafers
Ganesh, V.P. / Lee, Charles | 2006
22
Development of vertical and tapered via etch for 3D through wafer interconnect technology
Tezcan, Deniz / Munck, Koen / Pham, Nga / Luhn, Ole / Aarts, Arno / Moor, Piet / Baert, Kris / Hoof, Chris | 2006
29
Mechanical and microstructure characterization of high aspect ratio electroplated through-wafer copper interconnects
Dixit, Pradeep / Xu, Luhua / Miao, Jianmin / Pang, John / Pang, H.L. / Witarsa, David / Lim, Peggy / Backus, Petra | 2006
40
BCB (Benzocylcobutene) process integration for the RF passive device
Li, H. / Tang, M. / Guo, L. / Lo, G. | 2006
46
Investigation of ink-jet printing of self-assembled monolayers for copper circuit patterning
Ebbens, Stephen / Hutt, David / Liu, Changqing | 2006
53
Characterization of viscoelastic behaviour of a molding compound with application to delamination analysis in IC packages
Hu, Gojun / Tay, Andrew / Zhang, Yongwei / Zhu, Wenhui / Chew, Spencer | 2006
60
Moisture absorption mechanism in epoxy molding compounds used in IC encapsulation
Premkumar, Jeromerajan / Srikanth, Narasimalu | 2006
63
Investigation of mechanical properties of black diamond tm (low-K) thin films for Cu/low-k interconnect applications
Sekhar, V. / Balakumar, S. / Chai, T. / Tay, Andrew | 2006
70
A new EBG structure for < 5 GHz SSN suppression in < 10mm x 10mm high density mixed-signal SIP
Song, Eunseok / Lee, Heeseok | 2006
76
High-speed differential interconnection design for flip-chip BGA packages
Yuan, W.L. / Kuah, H.P. / Wang, C.K. / Sun, Anthony / Zhu, W.H. / Tan, H.B. / Muhamad, A.D. | 2006
82
A compact and low cost multilayered balun designed for SiP applications
Ying, Lim / Rotaru, Mihai | 2006
85
Design of LTCC-based ultra-wideband transmitter SiP using CMOS impulse generator
Yoon, Changwook / Lee, Junwoo / Kim, Myunghoi / Park, Youngjin / Park, Hyunjeong / Lee, Hyein / Kim, Joungho | 2006
90
60-GHz-band transmission module for 3-dimensional system-in-package
Masuda, Kohei / Takeuchi, Futoshi / Hamada, Yasuhiro / Maruhashi, Kenichi / Oguma, Hiroshi / Kameda, Suguru / Nakase, Hiroyuki / Takagi, Tadashi / Tsubouchi, Kazuo | 2006
96
Packaging technologies for mobile platforms
Mangrum, Marc | 2006
103
Development of a FC/WB stacked die SiP with 100um pitch F2F micro-bump interconnection
Ng, Catherine / Lam, Chua / Lee, Charles | 2006
109
Design and evaluation of 4 channel full-duplex transceiver modules for optical communication applications
Kuruveettil, Haridas / Ramana, Pamidighantam / Rotaru, Mihai / Zhiqiang, Zhao / Chazelas, Jean | 2006
114
FE-investigation of the stress/strain and fracture mechanics properties of intermetallic phase regions in leadfree solder interconnects
Mullera, Wolfgang / Hannach, Taoufiq / Albrechtb, H.-j. | 2006
121
Experimental and numerical assessment of board-level temperature cycling performance for PBGA, FBGA and CSP
Sun, Wei / Zhu, W. / Che, F. / Wang, C. / Sun, Anthony / Tan, H. | 2006
127
Modelling the behavior of solder joints for wafer level SiP
Strusevich, N. / Stoyanov, S. / Liu, D. / Bailey, C. / Richardson, A. / Dumas, N. / Yannou, J.M. / Georgel, V. | 2006
133
Optimization of flip chip interconnect reliability using a variable compliance interconnect design
Tay, Andrew / Sun, Wei | 2006
138
Epoxy adhesive and process enhancement on delamination related IC and packaging reliability problems: An evaluation study I
Chang, S. / Loh, E. / Khoo, E. / Lim, S. / Yuwaraja, M. / Chong, S.L. | 2006
143
Effects of metal surface finish on the anisotropic conductive adhesives (ACAs) joints
Kim, Hyoung-joon / Paik, Kyung-wook | 2006
150
Behavior of whisker growth on tin plated Fe-42%Ni substrates
Iwane, Y. / Morizono, Y. / Ohno, Y. / Kuwano, N. | 2006
154
Effect of plasma treated ITO substrate on inkjet printing of conductive ink
Lok, B.K. / Ng, P.Y. / Hu, X. / Low, H.P. | 2006
161
A numerical approach towards the correlation between ball impact test and drop reliability
Yeh, Chang-Lin / Lai, Yi-Shao | 2006
168
Improvement of drop reliability in OSP/Cu pad finished packages
Kim, Pyoung-wan / Kim, Bo-seong / Ahn, Eun-chul / Chung, Tae-gyeong | 2006
174
Improvement of mechanical impact resistance of BGA packages with Pb-free solder bumps
Zhao, X. / Caers, J.F.J.M. / Vries, J.W.C. / Kloosterman, J. / Wong, E. / Rajoo, R. | 2006
179
Ball impact responses and failure analysis of wafer-level chip-scale packages
Lai, Yi-Shao / Yeh, ChangLlin / Chang, Hsiao-Chuan / Kao, Chin-Li | 2006
185
Microstructures and characteristics of micro bump connection after ultrasonic flip-chip bonding
Sugimoto, Tetsuya / Morizono, Yasuhiro / Ohno, Yasuhide | 2006
190
Kinetics of intermetallic growth between lead-free solders and silver-palladium metallizations
Sharma, Gaurav / Kripesh, Vaidyanathan | 2006
196
Eutectic Sn/Pb solder bump cracking issue of large-die flip chip ball grid array (FCBGA) package with electroless Ni/immersion au (ENIG) build-up substrate
Xiong, Zheng / Osenbach, John / Chua, Kok | 2006
211
Solid state growth kinetics of complex intermetallics in the Pb-free ball grid array (BGA) solder joint for MEMS packaging
Alam, M. / Dan, Yang / Wu, B. / Chan, Y. / Rufer, L. / Bailey, C. | 2006
214
Thermo-mechanical modelling of power electronics module structures
Tilford, T. / Lu, H. / Bailey, C. | 2006
220
A hybrid equivalent-layer model for analysis of solder joint reliability of ultra-fine pitch packages
Zhao, B. / Tay, A.A.O. / Prakash, Thamburaja | 2006
227
Application of finite element analysis on flip chip ball grid array package with 65nm Cu/low-κ device
Yeo, Alfred / Min, Tan / Lee, Charles | 2006
233
Underfill selection for reducing Cu/low-K delamination risk of flip-chip assembly
Wang, Tong / Lai, Yi-shao / Wang, Meng-jen | 2006
237
Structural design for Cu/low-K larger die flip chip package
Biswas, Kalyan / Liu, Shiguo / Zhang, Xiaowu / Chai, Tc / Chong, Ser-Choong | 2006
243
Simulation of forces acting on tiny chips during fluidic self-assembly
Tay, Andrew / Li, Hua / Gao, Xiangyang / Chen, Jeremy / Kripesh, V. | 2006
249
Flexible soldering cells for small batch productions
Monfared, R.P. / West, A.A. / Vera, D.A. / Conway, P.P. | 2006
255
Surface mountable low cost packaging for RFID device
Lim, Samuel / Chong, Ser / Guo, Lihui / Hnin, Wai | 2006
260
Dicing of optical wafer level packages
Tangaha, Dennis / Bieck, Florian | 2006
265
Thermal induced warpage characterization for printed circuit boards with shadow moire system
Ying, Ming / Chia, Yew / Mohtar, Arman / Yin, Tiang / Chuah, Sai | 2006
271
Stretchable electronic systems
Loher, Thomas / Manessis, Dion / Heinrich, Ralf / Schmied, Benno / Vanfleteren, Jan / Debaets, Johan / Ostmann, Andreas / Reichl, Herbert | 2006
277
Optimization of gold wire bonding on electroless nickel immersion gold for high temperature applications
Ng, Beng / Ganesh, V.P. / Lee, Charles | 2006
283
Ductile-to-brittle transition strain rate
Darveaux, Robert / Reichman, Corey | 2006
290
Micro- and nano-DIC deformation analysis for electronic packaging applications
Sun, Yaofeng / Pang, John / Wei, Fan / Shi, Xunqing | 2006
297
Deformation and fatigue behaviour of AuSn interconnects
Wittler, Olaf / Walter, Hans / Dudek, Rainer / Faust, Wolfgang / Jun, Wei / Michel, Bernd | 2006
307
Extra thin profile land grid array package solder joint reliability assessment
Wong, Pak / Ying, Ming / Tengh, Alfred / Mohtar, Arman / Chia, Yew | 2006
313
Cyclic bend fatigue reliability investigation for Sn-Ag-Cu solder joints
Che, F.X. / Pang, H.L.J. / Zhu, W.H. / Sun, Anthony | 2006
318
Pressure dependence in peripheral bonding in gold-gold thermocompression
Ang, X.F. / Zhang, G.G. / Wei, J. / Chen, Z. / Wong, C.C. | 2006
324
Evaluating fine-pitch chip-on-flex with non-conductive film by using multi-points compliant bump structure
Huang, Yu-wei / Lu, Su-tsai / Chen, Tai-hong | 2006
330
High temperature performance study of gold wire bonding on a palladium bonding pad
Sasangka, Wardhana / Tan, A. | 2006
336
Process and materials considerations for Pb-free flip chip packaging of 65nm Cu/low-k device
Min, Tan / Kheng, Soh / Lim, Sharon / Lee, Charles | 2006
340
Electronics warming and optimization study subject to low temperature environments
Khalkhali, Hamed / Gombosev, Marinela | 2006
346
Transient analysis and experimental validation of thermal-fluidic fields on TFT-LCD TV panels
Chu, Chung-yi / Pan, Min-chun | 2006
353
An experimental study of air and mist cooling of microchannels on IC chips
Tay, Andrew / Ang, Simon / Lwin, L. | 2006
360
Short time die attach characterization of leds for in-line testing application
Szabo, P. / Rencz, M. / Farkas, G. / Poppe, A. | 2006
367
A novel optoelectronic ferrule and easy ribbon fiber splicer for cost-effective optical interconnection
Sakurai, Wataru / Ohtsuka, Kenichiro / Tamura, Mitsuaki / Saito, Kazuhito / Numata, Hideo / Hamasaki, Hiroshi / Furuyama, Hideto / Takubo, Chiaki | 2006
373
Test electronics for a multi-gbps optical packet switching network
Gray, C.E. / Liboiron-Ladouceur, O. / Keezer, D.C. / Bergman, K. | 2006
379
Process development for yellow phosphor coating on blue light emitting diodes (LEDs) for white light illumination
Lee, K. / Lee, S.W. | 2006
385
Effect of minor doping elements on lead free solder joint quality
Jiang, Don-son / Wang, Yu-po / Hsiao, C.S. | 2006
398
Tin whisker formation on a lead-free solder alloy studied by transmission electron microscopy
Sosiati, H. / Kuwano, N. / Hata, S. / Iwane, Y. / Morizono, Y. / Ohno, Y. | 2006
404
Alloying effect of Ni, Co, and Sb in SAC solder for improved drop performance of chip scale packages with Cu OSP pad finish
Syed, Ahmer / Kim, Tae / Cho, Young / Kim, Chang / Yoo, Min | 2006
412
Application of submodeling technique to transient drop impact analysis of board-level stacked die packages
Hsu, Hsiang-chen / Hsu, Yu-chia / Lee, Hui-yu / Yeh, Chang-lin / Lai, Yi-shao | 2006
419
Joint failure prediction of BGAs via failure force mapping
Tan, L.B. / V.b.c.tan, / Zhang, Xiaowu / Lim, C.T. | 2006
428
Dynamic behavior of a populated circuit card assembly
Betman, Ronen / Altus, Eli | 2006
441
RF-MEMS wafer-level packaging using through-wafer via technology
Tian, J. / Iannacci, J. / Sosin, S. / Gaddi, R. / Bartek, M. | 2006
448
Study of a capillary force driven passive valve for a microfluidic package
Chew, Michelle / Teo, William / Xie, Ling / Premachandran, C.S. / Wong, Wai / Xu, Diao / Yao, Qiang | 2006
454
Particle flow characterization for a microfluidic device for cell-based assay
Teo, C.Y. / Ong, W.L. / Zhang, H.Y. / Yobas, L. | 2006
462
Organic sealant materials for quasi-hermetic sealing of MEMS sensor packages
Tai, A. / Karagozoglu, H. / Chuan, K.L | 2006
472
On the study of loop profiles in improving the sweep stiffness of wire bond
Kung, H.K. / Huang, C.H. / Chanyshev, A.I. | 2006
478
An advanced data acquisition system for microprocessor package thermal characterization
Tay, Desmond / Min, Liu / Mui, Y. | 2006
482
Improved thermal modeling techniques for bond wires in CFD
Satchidanandan, Shankar / Shidore, Sarang | 2006
487
On the thermal stability margins of high-leakage current packaged devices
Lee, Chang-chi / Groot, Johannes | 2006
492
Enabling SPICE-type modeling of the thermal properties of 3D-stacked ICs
Chen, Liu / Vandevelde, Bart / Swinnen, Bart / Beyne, Eric | 2006
500
Thermal characterization of multi-die packages
Poppe, Andras / Zhang, Yan / Farkas, Gabor / Wong, Hon / Wilson, John / Szabo, Peter | 2006
506
Wire bonding characterization for small MLP footprint
Lim, Ly / Kua, Hc / Chong, David | 2006
512
Novel approach to reflow oven design to control and optimise lead free soldering process
Vera, D. / Monfared, R. / West, A. / Conway, P.P. | 2006
518
Ultra-small 0201 passive device process optimization and it's effective inspection
Tengh, Alfred / Suan, Kwok / Mortar, Arman / Lwin, Aung / Kwang, Tan / Wing, Wong | 2006
525
Low profile CSP BGA warpage improvement
Zhijie, Wang / Wang, Sonder / Suying, Yao / Yin, B.G. / Xu, Y.J. / Leoni, Michael / Wei, Xiao | 2006
539
State dependent characterization and modelling of fast curing moulding compounds
Ernst, L.J. / Jansen, K.M.B. / Kumar, T.L.S.N. / Cheng, Qian | 2006
549
Multi-functional epoxy/SrTiO/sub 3/ ceramic powder embedded capacitor films(ECFs) for organic substrates
Lee, Sangyong / Hyun, Jin-gul / Chung, Chang / Paik, Kyung-wook | 2006
553
New materials and processes for the manufacturing of ceramics presenting colossal values of permittivity
Guillemet-Fritsch, S. / Lebey, T. / Valdez, Z. / Dinculescu, S. | 2006
565
Thermomigration in eutectic tin-lead flip chip solder joints
Yang, Dan / Alam, M. / Wu, B. / Chan, Y. | 2006
570
Effect of thermal and electromigration exposure on solder joint board level drop reliability
Xu, Luhua / Pang, John | 2006
576
The effect of stressing history in reliability characteristics
Chen, Po-ying / Kung, Heng-yu / Lai, Yi-shao / Yeh, Wen-kuan | 2006
582
An experimental investigation of current stressing on wafer-level chip-scale packages
Lai, Yi-shao / Kung, Heng-yu / Chen, Po-ying / Yeh, Wen-kuan | 2006
591
Exploring the ulthimo platform
Samber, Marc / Tak, Coen / Peels, Wil | 2006
597
A novel chip joint method for high temperature operated SiC power modules
Lang, Fengqun / Hayashi, Yusuke / Nakagawa, Hiroshi / Aoyagi, Masahiro / Ohashi, Hiromichi | 2006
604
C4NP - data for fine pitch to CSP flip chip solder bumping
Laine, Eric / Ruhmer, Klaus / Belanger, Luc / Turgeon, Michel / Perfecto, Eric / Longworth, Hai / Hawken, David | 2006
610
Investigation of relationship between ground bounce and common-mode radiation
Chua, Eng-kee / See, Kye-yak / Li, Er-ping / Chang, Weng-yew | 2006
615
Hot embossing on polymethyl methacrylate
Ng, Sum / Tjeung, Ricky / Wang, Zhenfeng | 2006
622
Reliability improvement of 90nm large flip chip low-k die via dicing and assembly process optimization
Chaware, Raghunandan / Hoang, Lan | 2006
627
Extracting dielectric constant of low-k thin film material for interposer of 3-D multilayer packaging
Pak, Jun / Kikuchi, Katsuya / Oosato, Hirotaka / Nakagawa, Hiroshi / Aoyagi, Masahiro | 2006
639
Evaluation of high frequency characteristics of ALIVH substrate for 60 GHz RF modules
Nakase, Hiroyuki / Fujii, Takashi / Oshima, Shoichi / Oguma, Hiroshi / Kameda, Suguru / Isota, Yoji / Tsubouchi, Kazuo | 2006
651
Electrical characterization of LDP-PBGA package substrate
Ryu, Carl / Kwak, Myoung-bo / Lee, Hee-seok / Yim, Sang-il | 2006
655
Processing and electrical characterization of co-sintered composite glass ceramics
Sunappan, V. / Vadiveloo, P.L. / Wai, L.L. / Fan, W. / Lu, C.W. | 2006
659
Database approach for storage and retrieval of test parameters for manufacturability
Snehalatha, L. / Arndt, Paul | 2006
665
Job release based on WIPLOAD control in semiconductor wafer fabrication
Qi, Chao / Sivakumar, Appa | 2006
671
Cycle time reduction at cluster tool in semiconductor wafer fabrication
Swe, Aye / Gupta, Amit / Sivakumar, Appa / Lendermann, Peter | 2006
678
Methods to achieve zero human error in semiconductors manufacturing
Chee, Tan / Sani, Amin / Yu, Puay | 2006
684
IN/INS shorting due to surface ESD
Llamas, Corazon | 2006
688
Experimental studies on polymer deformation and flow in micro hot embossing
Harsono, / Lu, H.J. / Liu, Y.C. / Lam, Y.C. / Shan, X.C. | 2006
694
Dynamic strength and strain rate sensitivity of 37 wt% Pb 63 wt% Su eutectic solders
Wang, B. / Zheng, J. / Lu, G. | 2006
701
High speed ball pull -- A predictor of brittle solder joints
Pandher, Ranjit / Boureghda, Monnir | 2006
708
Reflow profile optimization for lead-free (SAC) alloys in BGA applications
Pandher, Ranjit / Athavale, Saurabh | 2006
717
Effects of Ni particle addition on microstructure and properties of SnAg based composite solders
Liu, Peng / Guo, Fu | 2006
722
Whisker formation behavior on tin film plated in high magnetic field
Tsutsumi, Keisuke / Iwane, Yuichi / Morizono, Yasuhiro / Kozuka, Toshiyuki / Ohno, Yasuhide | 2006
726
Tin whisker mitigation study on alloy 42 pure tin plating
Sriyarunya, Anocha / Tondtan, Jiraporn | 2006
733
A quantitative study of die crack in leaded IC package
Ming, Xue / Frankie, Low | 2006
745
Reliability analysis of sandwich microdisplay packaging using an integrated interferometry system
Wong, Audrey / Sun, Yaofeng / Chorng, Sow / Fei, Su / Pang, John | 2006
752
Microelectronics failure analysis using laser ablation of composite materials in system in package
Schwindenhammer, P. / Poirier, P. / Descamps, P. | 2006
760
Electromigration effect on strain and mechanical property change in lead-free solder joints
Xu, Luhua / Pang, John / Ren, Fei / Zhang, Xi / Nah, Jae-woong / Tu, K.N. | 2006
781
Development of life prediction model for lead-free solder at chip resistor
Han, Changwoon / Song, Byeongsuk | 2006
787
Modeling adhesive failure in electronic packages
Chew, H.B. / Guo, T.F. / Cheng, L. | 2006
793
Novel comparative torsional analytical technique to predict mechanical reliability of emerging memory cards and packages
Wong, Jason / Jun, Hu / Yong, Leow / Chew, Spencer | 2006
800
SD-TSOP package thermal design validation and reliability performance evaluation
Ooi, Chun / Chiu, Chia-pin / Chan, Joo / Tiong We, Martin | 2006
806
Challenges and potentials with SiP using FC on LTCC
Noren, M. / Brunner, S. / Hoffmann, C. / Salz, W. / Block, C. | 2006
810
On the thermal characterization of an exposed top quad flat no-lead package
Ma, Y.Y. / Krishnamoorthi, S. / Wang, C.K. / Sun, Anthony / Zhu, W.H. / Tan, H.B. | 2006
815
FEA thermal investigation on plasma etching induced heating during wafer thinning process
Wong, Foo / Radimin, / Teo, Mary / Lee, Charles | 2006
820
Via interconnections for wafer level packaging: Impact of via shape on spray coating behavior
Shariff, Dzafir / Suthiwonsunthorn, Nathapong / Bieck, Florian | 2006
825
Development of coaxial shield via in silicon carrier for high frequency application
Ho, Soon / Rao, Vempati / Navas Khan, Oratti / Yoon, Seung / Kripesh, Vaidyanathan | 2006
837
Ultra thinning of wafer for embedded module
Wen Sheng, Vincent / Khan, Navas / Kripesh, / Seung, Yoon | 2006
843
A case-based reasoning approach for low volume, high added value electronics
Segura-velandia, Diana / West, Andrew / Conway, Paul / Whalley, David | 2006
849
Current density and hot spot prediction using electrical-thermal co-simulation for multi-layer IC packages
Chee-Hoe, Lin / Wui-Weng, Wong / Bao-Min, Liu | 2006
853
Improving signal integrity by optimal design of power/ground plane stack-up structure
Jin, Chia-yu / Chou, Chia-hsing / Li, Dian-rung / Chuang, Tsung-ying | 2006
860
Effect of power distribution network design on RF circuit performance for 900MHz RFID reader
Kim, Youngwon / Ryu, Chunghyun / Park, Jongbae / Kim, Joungho | 2006
866
Improved noise isolation design of UHF mobile radio frequency identification reader system in package
Shim, Yujeong / Park, Jongbae / Kim, Youngwon / Koo, Kyoungchoul / Kim, Joungho | 2006
871
Scalable PEEC-SPICE modelling for EMI analysis of power electronic packages and subsystems
Cottet, Didier / Paakkinen, Mikko | 2006
879
Effect of moisture on underfill interfacial adhesion and packages flexural strength in flip chip packaging
Endut, Zulkarnain / Ahmad, Ibrahim / Zaharim, Azami / Sukemi, Norazham | 2006
885
Mapping of solder mask covered interconnects on high density printed circuit board
Tan, Cher / Tay, Yan / Goh, Chun / Chai, Tai | 2006
889
Moisture effect on adhesive bonding strength characterized by crack opening method
Liao, E. / Li, B. / Chai, T. / Totong, K. / Lo, G. | 2006
894
Reliability of microelectronic packages with tin-plated copper leads under high humidity operating environment
Seng, Yeoh | 2006