Experimental studies of the temperature dependence of mechanical solder material properties using nanoindentation (Englisch)

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Microelectronic components are subjected to a continuous miniaturization process. These efforts of a modern electronic industry require quantitative knowledge of the solder material properties in order to guarantee the reliability of the joining process. Of particular interest are the values of Young's modulus and hardness. Corresponding to the small-size of microelectronic devices is required to use adequately sized specimens and miniature tests. In these studies nanoindentation is applied to determine the material properties of Sn91Zn9 and Sn42Bi58 solder alloys, and also of copper (for a first orientation) and fused silica, which is used for the indenter calibration. Moreover, the potential change of material properties at elevated temperatures is investigated for the materials mentioned. A hot stage add-on allows nanoindentation measurements up to +500°C in order to characterize the various materials in great detail. The melting points of the solder alloys are 199°C and 138°C for Sn91Zn9 and Sn42Bi58, respectively [1]. The prohibition of the lead containing eutectic SnPb solder alloy requires research work in lead-free materials. This paper describes the setup and the analysis of temperature-dependent material tests and presents first results for Young's modulus, hardness, and yield stress, which are compared to literature, at least as far as possible. Furthermore this paper has the goal to verify the measurement setup and the subsequent data evaluation.

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1
Developments in fine pitch copper wire bonding production
Chylak, Bob | 2009
1
[Front matter]
| 2009
1
EPTC 2009 program overview: 9th–11th December 2009
| 2009
7
An improvement method for the reliability of copper metallization process
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10
Optimization of ultrasound and bond force to reduce pad stress in thermosonic Cu ball bonding
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16
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21
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27
Improving package assembly process yield for complex high density flip chip applications
Solberg, Vern / Oganesian, Vage | 2009
27
Technical sessions
| 2009
31
High density indium bumping using electrodeposition enhanced by megasonic agitation
Tian, Yingtao / Liu, Changqing / Hutt, David / Stevens, Bob / Flynn, David / Desmulliez, Marc P.Y. | 2009
36
Improving reliability of lateral thermosonic flip-chip bonding with ACF
Ha, Chang-Wan / Kim, Kyung-Soo | 2009
40
Warpage improvement for large die flip chip package
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44
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49
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49
Abstract listings
| 2009
64
Experimental studies of the temperature dependence of mechanical solder material properties using nanoindentation
Muller, Wolfgang H. / Worrack, Holger | 2009
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758
Soft solder die attach in small outline discrete packages for both reliability and cost breakthrough
Amiruddin, Mohd Syahril / Tan, C E / Dhanapalan, P. | 2009
762
Assembly challenges for low modulus die attach material for MEMS devices
Lo, Calvin / Yoke, Ong Kar / Yong, C.C. / Seong, Lee Boon | 2009
768
Influence of plasma cleaning on silicon die back adhesion performance
Su, Yeqing / Wei, Xiao / Hu, Cindy / Jiang, Y. W. / Zi-Song, Poh | 2009
772
Mid-process through silicon vias technology using tungsten metallization: Process optimazation and electrical results
Pares, G. / Minoret, S. / Lugand, J F. / Huet, S. / Lapras, V. / Anciant, R. / Henry, D. / Sillon, N. / Dunne, B. | 2009
778
Effect of TSV interposer on the thermal performance of FCBGA package
Hoe, Yen Yi Germaine / Yue, Tang Gong / Damaruganath, Pinjala / Chong, Chai Tai / Lau, John H. / Xiaowu, Zhang / Vaidyanathan, Kripesh | 2009
787
Thin wafer handling and processing-results achieved and upcoming tasks in the field of 3D and TSV
Kettner, Paul / Burggraf, Jurgen / Kim, Bioh | 2009
790
Polymer filling of medium density through silicon via for 3D-packaging
Chausse, P. / Bouchoucha, M. / Henry, D. / Sillon, N. / Chapelon, L.L. | 2009
795
3D integration of image sensor SiP using TSV silicon interposer
Wolf, M. Juergen / Zoschke, K. / Klumpp, A. / Wieland, R. / Klein, M. / Nebrich, L. / Heinig, A. / Limansyah, I. / Weber, W. / Ehrmann, O. et al. | 2009
801
Prediction of hotspots on 3D packages due to joule heating in Through Silicon Vias (TSV)
Tan, S.P. / Zhang, X.W. / Pinjala, D. | 2009
807
Non-destructive electrical measurement of interconnect degradation in early states by the use of RF signals
Kruger, Michael / Eckert, Tilman / Nissen, Nils F. / Reichl, Herbert | 2009
812
Reliability based design optimization for fine pitch ball grid array: Modeling construction and DOE analysis
Xue, Ke / Wu, Jingshen / Chen, Haibin / Gai, Jingbo / Lam, Angus | 2009
818
Optimal design of passivation/UBM openings for reducing current crowding effect under electromigration of flip-chip solder joint
Chang, Y. W. / Chen, Chih | 2009
823
Reliability testing of TIM materials with thermal transient measurements
Vass-Varnai, Andras / Sarkany, Zoltan / Rencz, Marta | 2009
828
Ball impact response based on modeling techniques
Shinohara, Kazunori / Yu, Qiang / Fujita, Masato / Ishii, Hideaki / Ishikawa, Hisao | 2009
834
Semiconductor final test fixture design with microstructure alloy contacts using Finite Element Analysis
Lam, Z.Y. / Koay, H.W. / Amin, N. | 2009
838
Reliability evaluation of fatigue life for solder joints in chip components considering shape dispersion
Nishimura, Yuji / Yu, Qiang / Maruoka, Toshiaki | 2009
846
Laser grooving characterization for dicing defects reduction and its challenges
Shi, Koh Wen / Beng, Lau Teck / Yow, K.Y. | 2009
851
Reliability study of low cost alternative Ag bonding wire with various bond pad materials
Yoo, Kyung-Ah / Uhm, Chul / Kwon, Tae-Jin / Cho, Jong-Soo / Moon, Jeong-Tak | 2009
858
Plastic circuit reliability and design for recycling
Thiel, David V. / Neeli, Madhusudanrao / Raj, Sundra | 2009
863
Investigation of lead-free BGA solder joint reliability under 4-point bending using PWB strain-rate analysis
Song, Fubin / Newman, Keith / Yang, Chaoran / Lee, S. W. Ricky | 2009
869
Study of the rheological behaviours of Sn-Ag-Cu solder pastes and their correlation with printing performance
Mallik, S. / Thieme, J. / Bauer, R. / Ekere, N. N. / Seman, A. / Bhatti, R. / Durairaj, R. | 2009
875
Effect of cooling rate on Ag3Sn formation in Sn-Ag based lead-free solder
Lee, Hwa-Teng / Chen, Yin-Fa / Hong, Ting-Fu / Shih, Ku-Ta | 2009
879
Properties of conductive microstructures containing nano sized silver particles
Felba, Jan / Nitsch, Karol / Piasecki, Tomasz / Tesarski, Sebastian / Moscicki, Andrzej / Kinart, Andrzej / Bonfert, Detlef / Bock, Karlheinz | 2009
884
Development of negative profile of dry film resist for metal lift off process
Chew, Michelle / Ho, Soon Wee / Su, Nandar / Liao, Ebin / Rao, Vempati Srinivas / Premachandran, C S / Kumar, Rakesh / Damaruganath, Pinjala | 2009
889
Wafer dicing process optimization and characterization for C90 low-k wafer technology
Shi, Koh Wen / Yow, K.Y. / Rachel, Khoo / Calvin, Lo | 2009
893
Stretchable electronic systems: Realization and applications
Loher, Thomas / Seckel, Manuel / Vieroth, Rene / Dils, Christian / Kallmayer, Christine / Ostmann, Andreas / Aschenbrenner, Rolf / Reichl, Herbert | 2009
899
Inductors from wafer-level package process for high performance RF applications
Guruprasad, Badakere / Lin, Yaojian / Chelvam, M. Pandi / Yoon, Seung Wook / Liu, Kai / Frye, Robert C. | 2009
903
Encapsulation challenges for wafer level packaging
Th, Eric Kuah / Hao, J Y / Ding, J P / Li, Q F / Chan, W L / Ho, S C / Huang, H M / Jiang, Y J | 2009
909
Ultra thinning of wafer for embedded wafer packaging
Vincent, Lee Wen Sheng / Navas Khan, Johnson Kek / Chua, H S / Tsutsumi, Yoshihiro / Yew, L C / Wee, Ho Soon / Eipa, Myo / Vempati, Srinivas / Kripesh, V. / Sundaram, Venky | 2009
915
3D eWLB (embedded wafer level BGA) technology for 3D-packaging/3D-SiP (Systems-in-Package) applications
Yoon, Seung Wook / Bahr, A. / Baraton, X. / Marimuthu, Pandi Chelvam / Carson, Flynn | 2009
920
Laser micromachining of polycrystalline alumina and aluminium nitride to enable compact optoelectronic interconnects
Williams, Owain / Williams, Martin / Liu, Changqing / Webb, Patrick / Firth, Paul | 2009
926
Optimization of flexible substrate for automotive LED rear-lamp
Kim, Young-Woo / Kim, Min-Sung / Park, Sung-Mo / Kim, Jae-Pil / Song, Sang-Bin / Whang, Nam / Lim, Yeong-Seog | 2009
930
Photonic System-in-Package technologies using thin glass substrates
Brusberg, Lars / Schroder, Henning / Topper, Michael / Reichl, Herbert | 2009
936
Polymer optical waveguide fabrication using laser ablation
Zakariyah, Shefiu S. / Conway, Paul P. / Hutt, David A. / Selviah, David R. / Wang, Kai / Baghsiahi, Hadi / Rygate, Jeremy / Calver, Jonathan / Kandulski, Witold | 2009
942
Analysis on interfacial failures of ultra-fine pitch wire with low inter-metallic coverage
Shin, Ji-Won / Song, Min-Suk / Park, Yong-Sung / Kwon, Yong-Min / Moon, Jeong-Tak / Cho, Jong-Soo / Yoo, Kyung-Ah / Byun, Kwan-Yoo / Joh, Cheol-Ho / Do, Eun-Hye et al. | 2009
947
Thin films interfacial adhesion characterization by Cross-Sectional Nanoindentation: Application to pad structures
Gallois-Garreignot, S. / Chave, F. / Gonchond, J.P. / Gautheron, B. / Fiori, V. / Nelias, D. | 2009
953
Interfacial reaction and dissolution behavior of Cu substrate in molten Sn-3.8Ag-0.7Cu-nano Mo composite solder
Arafat, M.M. / Haseeb, A.S.M.A. | 2009
957
A numerical study of 3D interfacial delamination in PQFP packages
Ho, Siow Ling / Tay, Andrew A. O. | 2009
964
Assessment of thinned Si wafer warpage in 3D stacked wafers
Kim, Youngrae / Kang, Sung-Geun / Kim, Eun-kyung | 2009
968
Analysis of coupled simultaneous switching noise induced from power delivery network in adjacent switching circuit
Kim, Jongmin / Song, Ki-Jae / Yoo, Jongwoon / Nah, Wansoo | 2009
973
Fabrication of fully embedded board-level optical interconnects and optoelectronic printed circuit boards
Chang, C.C. / Chang, C.J. / Lau, John H. / Chang, Al / Tang, Tom / Chiang, Steve / Lee, Maurice / Tseng, T. J. / Wei, Tan Chee / Shiah, Lim Li et al. | 2009
977
In-depth characterization of die attach adhesive for low-k automotive device application
Hoon, Khoo Ly / Kheng, Au Yin | 2009
982
Versatility and flexibility from low outgassing silicones
Riegler, Bill / Velderrain, Michelle / Lim, T.Y. | 2009
986
Effect of reflow profile and thermal cycle ageing on the intermetallic formation and growth in lead-free soldering
Bernasko, P.K. / Mallik, S. / Ekere, N.N. / Seman, A. / Takyi, G. | 2009
991
A study on the thermal deformation and the mechanical properties due to curing process of the encapsulation resin
Sato, Hiroyuki / Yu, Qiang | 2009
996
Application of GR&R for productivity improvement
Low, S.M. / Lee, S.Y. / Yong, W.K. | 2009
1000
Electro-mechanical evaluation of Ag trace patterns by ink-jet printing
Quintero, J. A. / Mancosu, R. D. / de Oliveira, A. W. C. / Rolim, D. C. / da Silva, O. C. / Silva, J. M. | 2009