Bondability, moldability, and reliability of very-long, multi-height Au bonding wires (Englisch)
- Neue Suche nach: Tok, C.W.
- Neue Suche nach: Rulloda, O.
- Neue Suche nach: Calpito, D.R.M.
- Neue Suche nach: Wulff, F.W.
- Neue Suche nach: Pasamanero, E.
- Neue Suche nach: Tok, C.W.
- Neue Suche nach: Rulloda, O.
- Neue Suche nach: Calpito, D.R.M.
- Neue Suche nach: Wulff, F.W.
- Neue Suche nach: Pasamanero, E.
In:
EPTC, Electronics Packaging Technology Conference, 8
;
1-8
;
2007
-
ISBN:
- Aufsatz (Konferenz) / Print
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Titel:Bondability, moldability, and reliability of very-long, multi-height Au bonding wires
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Beteiligte:Tok, C.W. ( Autor:in ) / Rulloda, O. ( Autor:in ) / Calpito, D.R.M. ( Autor:in ) / Wulff, F.W. ( Autor:in ) / Pasamanero, E. ( Autor:in )
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Erschienen in:
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Verlag:
- Neue Suche nach: IEEE Operations Center
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Erscheinungsort:Piscataway
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Erscheinungsdatum:2007
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Format / Umfang:8 Seiten, 4 Quellen
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ISBN:
-
Medientyp:Aufsatz (Konferenz)
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Format:Print
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Sprache:Englisch
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Schlagwörter:
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Datenquelle:
Inhaltsverzeichnis Konferenzband
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Via interconnections for wafer level packaging: Impact of via shape on spray coating behaviorShariff, Dzafir / Suthiwonsunthorn, Nathapong / Bieck, Florian et al. | 2006
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Development of coaxial shield via in silicon carrier for high frequency applicationHo, Soon / Rao, Vempati / Navas Khan, Oratti / Yoon, Seung / Kripesh, Vaidyanathan et al. | 2006
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Ultra thinning of wafer for embedded moduleWen Sheng, Vincent / Khan, Navas / Kripesh, / Seung, Yoon et al. | 2006
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A case-based reasoning approach for low volume, high added value electronicsSegura-velandia, Diana / West, Andrew / Conway, Paul / Whalley, David et al. | 2006
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Current density and hot spot prediction using electrical-thermal co-simulation for multi-layer IC packagesChee-Hoe, Lin / Wui-Weng, Wong / Bao-Min, Liu et al. | 2006
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Improving signal integrity by optimal design of power/ground plane stack-up structureJin, Chia-yu / Chou, Chia-hsing / Li, Dian-rung / Chuang, Tsung-ying et al. | 2006
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Effect of power distribution network design on RF circuit performance for 900MHz RFID readerKim, Youngwon / Ryu, Chunghyun / Park, Jongbae / Kim, Joungho et al. | 2006
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Improved noise isolation design of UHF mobile radio frequency identification reader system in packageShim, Yujeong / Park, Jongbae / Kim, Youngwon / Koo, Kyoungchoul / Kim, Joungho et al. | 2006
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Scalable PEEC-SPICE modelling for EMI analysis of power electronic packages and subsystemsCottet, Didier / Paakkinen, Mikko et al. | 2006
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Effect of moisture on underfill interfacial adhesion and packages flexural strength in flip chip packagingEndut, Zulkarnain / Ahmad, Ibrahim / Zaharim, Azami / Sukemi, Norazham et al. | 2006
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Mapping of solder mask covered interconnects on high density printed circuit boardTan, Cher / Tay, Yan / Goh, Chun / Chai, Tai et al. | 2006
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Moisture effect on adhesive bonding strength characterized by crack opening methodLiao, E. / Li, B. / Chai, T. / Totong, K. / Lo, G. et al. | 2006
- 894
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Reliability of microelectronic packages with tin-plated copper leads under high humidity operating environmentSeng, Yeoh et al. | 2006