32 nm 1:1 line and space patterning by resist reflow process (Englisch)

In: Optical Microlithography, 21   ;  69244S/1-69244S/9  ;  2008

Wie erhalte ich diesen Titel?

Making a sub-32 nm line and space pattern is the most important issue in semiconductor process. Specially, it is important to make line and space pattern when the device type is NAND flash memory because the unit cell is mostly composed of line and space pattern. Double patterning method is regarded as the most promising technology for sub-32 nm half-pitch node. However, double patterning method is expensive for the production and heavy data split is required. In order to make cheaper and easier patterning, we suggest a resist reflow process (RRP) method for 32 nm 1:1 line and space pattern. It is easier to make 1:3 pitch than 1:1 pitch line and space in terms of aerial image, and RRP can make 1:3 pitch aerial image to 1:1 resist image. We used home-made RRP simulation based on Navier-Stokes equation including surface tension effect. Solid-E is used for optical simulation, and e-beam lithography is used for the experiment to check the concept.

Inhaltsverzeichnis Konferenzband

Die Inhaltsverzeichnisse werden automatisch erzeugt und basieren auf den im Index des TIB-Portals verfügbaren Einzelnachweisen der enthaltenen Beiträge. Die Anzeige der Inhaltsverzeichnisse kann daher unvollständig oder lückenhaft sein.

69240A
Double patterning combined with shrink technique to extend ArF lithography for contact holes to 22nm node and beyond
Miao, Xiangqun / Huli, Lior / Chen, Hao / Xu, Xumou / Woo, Hyungje / Bencher, Chris / Shu, Jen / Ngai, Chris / Borst, Christopher | 2008
69240B
Negative and iterated spacer lithography processes for low variability and ultra-dense integration
Carlson, Andrew / Liu, Tsu-Jae King | 2008
69240C
Double patterning of contact array with carbon polymer
Jung, Woo-Yung / Sim, Guee-Hwang / Kim, Sang-Min / Kim, Choi-Dong / Jeon, Sung-Min / Kim, Keunjun / Park, Sang-Wook / Lee, Byung-Seok / Park, Sung-Ki / Cho, Hoon-Hee et al. | 2008
69240D
PDL oxide enabled pitch doubling
Shamma, Nader / Chou, Wen-Ben / Kalinovski, Ilia / Schlosser, Don / Mountsier, Tom / Mui, Collin / Tarafdar, Raihan / van Schravendijk, Bart | 2008
69240E
Pixelated phase mask as novel lithography RET
Borodovsky, Yan / Cheng, Wen-Hao / Schenker, Richard / Singh, Vivek | 2008
69240F
Mask optimization for arbitrary patterns with 2D-TCC resolution enhancement technique
Kawashima, Miyoko / Yamazoe, Kenji / Sekine, Yoshiyuki / Hakko, Manabu / Ohta, Masakatsu / Honda, Tokuyuki | 2008
69240H
Comparative study of binary intensity mask and attenuated phase shift mask using hyper-NA immersion lithography for sub-45nm era
Eom, Tae-Seung / Park, Jun-Taek / Kang, Jung-Hyun / Park, Sarohan / Koo, Sunyoung / Kim, Jin-Soo / Lee, Byoung-Hoon / Lim, Chang-Moon / Kim, HyeongSoo / Moon, Seung-Chan | 2008
69240I
Integration of pixelated phase masks for full-chip random logic layers
Schenker, Richard / Bollepalli, Srinivas / Hu, Bin / Toh, Kenny / Singh, Vivek / Yung, Karmen / Cheng, Wen-hao / Borodovsky, Yan | 2008
69240J
Applications of TM polarized illumination
Smith, Bruce / Zhou, Jianming / Xie, Peng | 2008
69240K
Enabling technology scaling with "in production" lithography processes
Jhaveri, Tejas / Strojwas, Andrzej / Pileggi, Larry / Rovner, Vyachelav | 2008
69240L
Hyper-NA imaging of 45nm node random CH layouts using inverse lithography
Hendrickx, E. / Tritchkov, A. / Sakajiri, K. / Granik, Y. / Kempsell, M. / Vandenberghe, G. | 2008
69240M
Patterning strategy and performance of 1.3NA tool for 32nm node lithography
Mimotogi, Shoji / Satake, Masaki / Kitamura, Yosuke / Takahata, Kazuhiro / Kodera, Katsuyoshi / Fujise, Hiroharu / Ema, Tatsuhiko / Sho, Koutaro / Ishigo, Kazutaka / Kono, Takuya et al. | 2008
69240O
Post-decomposition assessment of double patterning layouts
Rubinstein, Juliet / Neureuther, Andrew R. | 2008
69240P
Alternative process schemes for double patterning that eliminate the intermediate etch step
Maenhoudt, M. / Gronheid, R. / Stepanenko, N. / Matsuda, T. / Vangoidsenhoven, D. | 2008
69240Q
Double patterning down to k1=0.15 with bilayer resist
Noelscher, Christoph / Jauzion-Graverolle, Franck / Heller, Marcel / Markert, Matthias / Hong, Bee-Kim / Egger, Ulrich / Temmler, Dietmar | 2008
69240R
Double patterning requirements for optical lithography and prospects for optical extension without double patterning
Hazelton, Andrew J. / Wakamoto, Shinji / Hirukawa, Shigeru / McCallum, Martin / Magome, Nobutaka / Ishikawa, Jun / Lapeyre, Céline / Guilmeau, Isabelle / Barnola, Sébastien / Gaugiran, Stéphanie | 2008
69240S
Making a trillion pixels dance
Singh, Vivek / Hu, Bin / Toh, Kenny / Bollepalli, Srinivas / Wagner, Stephan / Borodovsky, Yan | 2008
69240T
Validation of inverse lithography technology (ILT) and its adaptive SRAF at advanced technology nodes
Pang, Linyong / Dai, Grace / Cecil, Tom / Dam, Thuc / Cui, Ying / Hu, Peter / Chen, Dongxue / Baik, Ki-Ho / Peng, Danping | 2008
69240U
General imaging of advanced 3D mask objects based on the fully-vectorial extended Nijboer-Zernike (ENZ) theory
van Haver, Sven / Janssen, Olaf T. A. / Braat, Joseph J. M. / Janssen, Augustus J. E. M. / Urbach, H. Paul / Pereira, Silvania F. | 2008
69240V
Radiometric consistency in source specifications for lithography
Rosenbluth, Alan E. / Tirapu Azpiroz, Jaione / Lai, Kafai / Tian, Kehan / Melville, David O.S. / Totzeck, Michael / Blahnik, Vladan / Koolen, Armand / Flagello, Donis | 2008
69240W
Coupled-dipole modelling for 3D mask simulation
Temchenko, Vlad / Lim, Chinteong / Wallis, Dave / Schneider, Jens / Niehoff, Martin | 2008
69240X
Generalized inverse problem for partially coherent projection lithography
Davids, Paul S. / Bollepalli, Srinivas B. | 2008
69240Y
Massively-parallel FDTD simulations to address mask electromagnetic effects in hyper-NA immersion lithography
Tirapu Azpiroz, Jaione / Burr, Geoffrey W. / Rosenbluth, Alan E. / Hibbs, Michael | 2008
69240Z
Polarization characteristics of state-of-art lithography optics reconstructed from on-body measurement
Fujii, Toru / Kogo, Jun / Suzuki, Kosuke / Sawada, Masayasu | 2008
69241A
The rapid introduction of immersion lithography for NAND flash: challenges and experience
Wu, Chan-Tsun / Lin, Hung Ming / Wu, Wei-Ming / Chan, Meng-Hsun / Lin, Benjamin S. / Lin, Kuan-Heng / Hazelton, Andrew J. / Ohhashi, Toshio / Nakano, Katsushi / Iriuchijima, Yasuhiro et al. | 2008
69241B
Immersion defect performance and particle control method for 45nm mass production
Chibana, Takahito / Kobayashi, Masamichi / Nakano, Hitoshi / Arakawa, Mikio / Matsuoka, Yoichi / Kawasaki, Youji / Tanabe, Masayuki / Oda, Hirohisa | 2008
69241C
Development of a computational lithography roadmap
Chen, J. Fung / Liu, Hua-Yu / Laidig, Thomas / Zuniga, Christian / Cao, Yu / Socha, Robert | 2008
69241D
Analysis of OPC optical model accuracy with detailed scanner information
Zavyalova, Lena / Lucas, Kevin / Zhang, Qiaolin / Fan, Yongfa / Sethi, Satyendra / Song, Hua / Tyminski, Jacek | 2008
69241E
Hybrid Hopkins-Abbe method for modeling oblique angle mask effects in OPC
Adam, Konstantinos / Lam, Michael C. | 2008
69241F
Robust PPC and DFM methodology for exposure tool variations
Kotani, Toshiya / Nakajima, Fumiharu / Mashita, Hiromitsu / Sato, Kazuya / Tanaka, Satoshi / Inoue, Soichi | 2008
69241G
Fabrication of defect-free full-field pixelated phase mask
Cheng, Wen-Hao / Farnsworth, Jeff / Kwok, Wai / Jamieson, Andrew / Wilcox, Nathan / Vernon, Matt / Yung, Karmen / Liu, Yi-Ping / Kim, Jun / Frendberg, Eric et al. | 2008
69241H
Advanced OPC and 2D verification for tip engineering using aggressive illuminations
Zhang, X. / Lukanc, T. / Yang, H. / Ward, B. | 2008
69241I
Optimization procedure of exposure tools with polarization aberrations
Arai, Tadashi / Yamada, Akihiro / Mori, Kenichiro / Osaki, Yoshinori / Yoshihara, Toshiyuki / Hasegawa, Yasuo | 2008
69241J
Proposal for determining exposure latitude requirements
Levinson, Harry J. / Ma, Yuansheng / Koenig, Marcel / La Fontaine, Bruno / Seltmann, Rolf | 2008
69241K
Influence of shot noise on CDU with DUV, EUV, and E-beam
Pan, Zhih-Yu / Chen, Chun-Kuang / Gau, Tsai-Sheng / Lin, Burn J. | 2008
69241L
Determining DOF requirements needed to meet technology process assumptions
Gabor, Allen / Brendler, Andrew / Liegl, Bernhard / Brodsky, Colin / Lembach, Gerhard / Mansfield, Scott / Mishra, Shailendra / Brunner, Timothy / Wiltshire, Timothy / Menon, Vinayan et al. | 2008
69241M
Extending scatterometry to the measurements of sub 40 nm features, double patterning structures, and 3D OPC patterns
Kritsun, Oleg / La Fontaine, Bruno / Liu, Yongdong / Saravanan, Chandra S. | 2008
69241N
Recent performance results of Nikon immersion lithography tools
Hazelton, Andrew J. / Shiraishi, Kenichi / Wakamoto, Shinji / Ishii, Yuuki / Okumura, Masahiko / Magome, Nobutaka / Suzuki, Hiroyuki | 2008
69241O
Performance of the FPA-7000AS7 1.35 NA immersion exposure system for 45-nm mass production
Yoshimura, Keiji / Nakano, Hitoshi / Hata, Hideo / Deguchi, Nobuyoshi / Kobayashi, Masamichi / Ebihara, Takeaki / Kawanobe, Yoshio / Kanda, Tsuneo | 2008
69241P
Latest developments on immersion exposure systems
Mulkens, Jan / de Klerk, Jos / Leenders, Martijn / de Jong, Fred / Cromwijk, Jan W. | 2008
69241Q
Tool-to-tool optical proximity effect matching
Van Look, L. / Bekaert, Joost / De Bisschop, Peter / Van de Kerkhove, Jeroen / Vandenberghe, Geert / Schreel, Koen / Menger, Jasper / Schiffelers, Guido / Knols, Edwin / Willekers, Rob | 2008
69241R
XLR 600i: recirculating ring ArF light source for double patterning immersion lithography
Fleurov, Vladimir / Rokitski, Slava / Bergstedt, Robert / Ye, Hong / O’Brien, Kevin / Jacques, Robert / Trintchouk, Fedor / Figueroa, Efrain / Cacouris, Theodore / Brown, Daniel et al. | 2008
69241S
An intelligent imaging system for ArF scanner
Matsuyama, Tomoyuki / Ohmura, Yasuhiro / Nakashima, Toshiharu / Uehara, Yusaku / Ogata, Taro / Nishinaga, Hisashi / Ikezawa, Hironori / Toki, Tsuyoshi / Rokitski, Slava / Bonafede, James | 2008
69241T
In-situpolarimetry of illumination for 193-nm lithography
Nomura, Hiroshi / Furutono, Yohko | 2008
69241U
Understanding illumination effects for control of optical proximity effects (OPE)
Flagello, Donis G. / Geh, Bernd / Socha, Robert / Liu, Peng / Cao, Yu / Stas, Roland / Natt, Oliver / Zimmermann, Jörg | 2008
69241V
Thermal aberration control in projection lens
Nakashima, Toshiharu / Ohmura, Yasuhiro / Ogata, Taro / Uehara, Yusaku / Nishinaga, Hisashi / Matsuyama, Tomoyuki | 2008
69241W
Imaging performance optimization for hyper-NA scanner systems in high volume production
van de Kerkhof, Mark / van Setten, Eelco / Engelen, Andre / Plachecki, Vincent / Liu, Hua-yu / Schmitt-Weaver, Emil / Rooijakkers, Wilbert / Simon, Klaus | 2008
69241X
Monitoring polarization at 193nm high-numerical aperture with phase shift masks: experimental results and industrial outlook
McIntyre, Gregory / Tu, Richard | 2008
69241Y
A comprehensive comparison between double patterning and double patterning with spacer on sub-50nm product implementation
Tseng, C. F. / Yang, C. C. / Yang, Elvis / Yang, T. H. / Chen, K. C. / Lu, C. Y. | 2008
69241Z
100 nm half-pitch double exposure KrF lithography using binary masks
Geisler, S. / Bauer, J. / Haak, U. / Stolarek, D. / Schulz, K. / Wolf, H. / Meier, W. / Trojahn, M. / Matthus, E. | 2008
69242A
An analysis of double exposure lithography options
Lee, Saul / Byers, Jeffrey / Jen, Kane / Zimmerman, Paul / Rice, Bryan / Turro, Nicholas J. / Willson, C. Grant | 2008
69242B
Double printing through the use of ion implantation
Samarakone, Nandasiri / Yick, Paul / Zawadzki, Mary / Choi, Sang-Jun | 2008
69242C
30nm half-pitch metal patterning using Moti CD shrink technique and double patterning
Versluijs, Janko / De Marneffe, J.-F. / Goossens, Danny / Op de Beeck, Maaike / Vandeweyer, Tom / Wiaux, Vincent / Struyf, Herbert / Maenhoudt, Mireille / Brouri, Mohand / Vertommen, Johan et al. | 2008
69242D
Enabling 35nm double patterning contact imaging using a novel CD shrink process
Yamada, Yoshiaki / Crouse, Michael M. / Dunn, Shannon / Kawasaki, Tetsu / Shimura, Satoru / Nishimura, Eiichi / Tanaka, Yoshitsugu / Galloway, Judy / Pierson, Bill / Routh, Robert | 2008
69242F
Prediction of imaging performance of immersion lithography using high refractive index fluid
Sato, Takashi / Itoh, Masamitsu / Mimotogi, Akiko / Mimotogi, Shoji / Sato, Kazuya / Tanaka, Satoshi | 2008
69242G
Contrast management of 193i interferometry to be close to scanners contrast conditions
Lagrange, Alexandre / Bandelier, Philippe / Charpin, Christelle / Lartigue, Olivier | 2008
69242H
Immersion exposure system using high-index materials
Sakai, Keita / Iwasaki, Yuichi / Mori, Sunao / Yamada, Akihiro / Ogusu, Makoto / Yamashita, Keiji / Nishikawara, Tomofumi / Tanaka, Takatoshi / Hasegawa, Noriyasu / Hara, Shin-ichi et al. | 2008
69242I
Continuing 193nm optical lithography for 32nm imaging and beyond
Piscani, Emil C. / Ashworth, Dominic / Byers, Jeff / Van Peski, Chris / Zimmerman, Paul / Rice, Bryan J. | 2008
69242J
Novel refractive optics enable multipole off-axis illumination
Bizjak, T. / Mitra, T. / Hauschild, D. / Aschke, L. | 2008
69242K
45nm node logic device OPE matching between exposure tools through laser bandwidth tuning
Yoshimochi, Kazuyuki / Tamura, Takao / Nagahara, Seiji / Uchiyama, Takayuki / Farrar, Nigel / Oga, Toshihiro / Bonafede, James | 2008
69242L
Fluoride single crystals for the next generation lithography
Nawata, Teruhiko / Inui, Yoji / Mabuchi, Toshiro / Mochizuki, Naoto / Masada, Isao / Nishijima, Eiichi / Sato, Hiroki / Fukuda, Tsuguo | 2008
69242O
An improved process for manufacturing diffractive optical elements (DOEs) for off-axis illumination systems
Leonard, Jerry / Carriere, James / Stack, Jared / Jones, Rich / Himel, Marc / Childers, John / Welch, Kevin | 2008
69242P
A novel photo-thermal setup for determination of absorptance losses and wavefront deformations in DUV optics
Mann, K. / Bayer, A. / Leinhos, U. / Miege, T. / Schäfer, B. | 2008
69242Q
Performance demonstration of significant availability improvement in lithography light sources using GLX control system
O'Brien, Kevin / Dunstan, Wayne J. / Riggs, Daniel / Ratnam, Aravind / Jacques, Robert / Besaucele, Herve / Brown, Daniel / Zhang, Kevin / Farrar, Nigel | 2008
69242R
Reliable high power injection locked 6 kHz 60W laser for ArF immersion lithography
Kumazaki, Takahito / Suzuki, Toru / Tanaka, Satoshi / Nohdomi, Ryoichi / Yoshino, Masaya / Matsumoto, Shinichi / Kawasuji, Yasufumi / Umeda, Hiroshi / Nagano, Hitoshi / Kakizaki, Kouji et al. | 2008
69242S
High-power and high-energy stability injection lock laser light source for double exposure or double patterning ArF immersion lithography
Yoshino, Masaya / Nakarai, Hiroaki / Ohta, Takeshi / Nagano, Hitoshi / Umeda, Hiroshi / Kawasuji, Yasufumi / Abe, Toru / Nohdomi, Ryoichi / Suzuki, Toru / Tanaka, Satoshi et al. | 2008
69242T
Uniaxial crystal last optical element for second- and third-generation immersion lithography
Sirat, Gabriel Y. / Goldstein, Michael | 2008
69242U
Impact of optimization conditions on the result at optimizing illumination and mask
Tsujita, Koichiro / Mikami, Koji / Ishii, Hiroyuki / Suzuki, Akiyoshi | 2008
69242V
Understanding and application of constructive, destructive SRAF
Chin, Fook L. / Lukanc, Todd P. | 2008
69242W
90nm node contact hole patterning through applying model based OPC in KrF lithography
Jeon, Young-Doo / Lee, Sang-Uk / Choi, Jaeyoung / Kim, Jeahee / Han, Jaewon | 2008
69242X
Manufacturing implementation of 32nm SRAM using ArF immersion with RET
Lee, Sho-Shen / Wu, Cheng-Han / Huang, Yongfa / Huang, Chien-Hui / Huang, Hung-Chin / Huang, George KC / Yu, Chun-Chi / Hsu, Michael / Shieh, Simon / Hsu, Stephen et al. | 2008
69242Y
Random 65nm..45nm C/H printing using optimized illumination source and CD sizing by post processing
Finders, Jo / Van der Heijden, Eddy / Janssen, Gert-Jan / Vangheluwe, Rik / Shibata, Tsuysohi / Naitou, Ryouichirou / Kosugi, Hitoshi / Sugimachi, Hisanori | 2008
69242Z
Study of SRAF placement for contact at 45 nm and 32 nm node
Farys, V. / Robert, F. / Martinelli, C. / Trouiller, Y. / Sundermann, F. / Gardin, C. / Planchot, J. / Kerrien, G. / Vautrin, F. / Saied, M. et al. | 2008
69243A
60nm half pitch contact layer printing: exploring the limits at 1.35NA lithography
Bekaert, Joost / Hendrickx, Eric / Vandenberghe, Geert | 2008
69243B
Combined mask and illumination scheme optimization for robust contact patterning on 45nm technology node flash memory devices
Vaglio Pret, Alessandro / Capetti, Gianfranco / Bollin, Maddalena / Cotti, Gina / De Simone, Danilo / Cantù, Pietro / Vaccaro, Alessandro / Soma, Laura | 2008
69243C
32 nm logic patterning options with immersion lithography
Lai, K. / Burns, S. / Halle, S. / Zhuang, L. / Colburn, M. / Allen, S. / Babcock, C. / Baum, Z. / Burkhardt, M. / Dai, V. et al. | 2008
69243D
Consideration of VT5 etch-based OPC modeling
Lim, ChinTeong / Temchenko, Vlad / Kaiser, Dieter / Meusel, Ingo / Schmidt, Sebastian / Schneider, Jens / Niehoff, Martin | 2008
69243E
Optimized OPC approach for process window improvement
Wang, Ching-Heng / Liu, Qingwei / Zhang, Liguo | 2008
69243G
The comparison of OPC performance and run time for dense versus sparse solutions
Abdo, Amr / Stobert, Ian / Viswanathan, Ramya / Burns, Ryan / Herold, Klaus / Kallingal, Chidam / Meiring, Jason / Oberschmidt, James / Mansfield, Scott | 2008
69243H
Advanced mask process modeling for 45-nm and 32-nm nodes
Tejnil, Edita / Hu, Yuanfang / Sahouria, Emile / Schulze, Steffen / Tian, Ming Jing / Guo, Eric | 2008
69243I
An efficient and robust mask model for lithography simulation
Zhu, Zhenhai / Schmidt, Frank | 2008
69243J
Reticle CD error calibrated OPC model generation
Kim, Youngmi / Choi, Jae-Young / Kim, Jong-Doo / Kim, Jeahee / Han, Jae-Won | 2008
69243K
Modeling of focus blur in the context of optical proximity correction
Zhang, Qiaolin / Song, Hua / Lucas, Kevin / Shiely, James | 2008
69243L
Full chip compensation for local-flare-induced CD error using OPC/DRC method
Choi, Jae-Young / Shim, Yeon-Ah / Yun, Kyung-Hee / Kim, Jong-Doo / Kim, Jae-Hee / Han, Jae-Won | 2008
69243M
Development of layout split algorithms and printability evaluation for double patterning technology
Chiou, Tsann-Bim / Socha, Robert / Chen, Hong / Chen, Luoqi / Hsu, Stephen / Nikolsky, Peter / van Oosten, Anton / Chen, Alek C. | 2008
69243N
Optical proximity correction with principal component regression
Gao, Peiran / Gu, Allan / Zakhor, Avideh | 2008
69243O
OPC optimization for double dipole lithography and its application on 45nm node with dry exposure
Park, Se-Jin / Seo, Jae-Kyung / Li, ChengHe / Liu, Daisy / An, Petros / Kang, Xiao-Hui / Guo, Eric | 2008
69243P
Novel method for optimizing lithography exposure conditions using full-chip post-OPC simulation
Sturtevant, John / Jayaram, Srividya / Hong, Le / Drozdov, Alexandre | 2008
69243Q
Optical proximity correction for elongated contact-hole printing
Kim, Young-Chang / Kim, Sangwook / Suh, Sungsoo / Cheon, Yongjin / Lee, Sukjoo / Lee, Junghyeon / Choi, Seong-Woon / Han, Woosung / Lee, Sooryong / Koo, Kyoil | 2008
69243R
Study of the mask topography effect on the OPC modeling of hole patterns
Shim, Seong-bo / Kim, Young-chang / Lee, Suk-joo / Choi, Seong-woon / Han, Woo-sung | 2008
69243S
Evaluation of OPC test patterns using parameter sensitivity
Ward, Brian S. | 2008
69243T
Pellicle effect on OPC modeling
Luo, Boren / Chang, Chi-Kang / Wang, W. L. / Huang, W. C. / Wu, Timothy / Lai, C. W. / Liu, R. G. / Lin, H. T. / Chen, K. S. / Ku, Y. C. | 2008
69243U
OPC model calibration considerations for data variance
Bahnas, Mohamed / Al-Imam, Mohamed | 2008
69243V
Pattern centric OPC flow: a special RET flow with fast turn-around-time
Wang, Tom / Wu, Joanne / Liu, Qingwei / Zhang, Gary / Wang, Benny / Su, Bo / Cheng, Guojie | 2008
69243W
Extreme mask corrections: technology and benefits
Granik, Yuri / Cobb, Nick / Medvedev, Dmitry | 2008
69243X
Variable loading kernels for OPC modeling
Tsai, S. L. / Lo, Fred / Yang, Elvis / Yang, T. H. / Chen, K. C. / Lu, C. Y. | 2008
69243Y
Impact of medium and long range effects on poly gate patterning
Tagliavini, Manuel / Annoni, Elisabetta / Cantù, Pietro / Capetti, Gianfranco / Catarisano, Chiara / Colombo, Roberto / Magri, Giovanni / Ravasio, Marcello / Zanderigo, Federica | 2008
69243Z
Design of automatic controllers for model-based OPC with optimal resist threshold determination for improving correction convergence
Su, Yi-Sheng / Ng, Philip C. W. / Tsai, Kuen-Yu / Chen, Yung-Yaw | 2008
69244A
Reflection control in hyper-NA immersion lithography
Zhu, Zhimin / Piscani, Emil / Edwards, Kevin / Smith, Brian | 2008
69244B
Resolution enhancement techniques in 65 nm node nested-hole patterning
Lee, Hyesung / Choi, Jaeyoung / Kim, Jeahee / Han, Jaewon / Kim, Keun-Young | 2008
69244C
32nm overlay improvement capabilities
Eichelberger, Brad / Huang, Kevin / O'Brien, Kelly / Tien, David / Tsai, Frank / Minvielle, Anna / Singh, Lovejeet / Schefske, Jeffrey | 2008
69244E
22nm half-pitch patterning by CVD spacer self alignment double patterning (SADP)
Bencher, Chris / Chen, Yongmei / Dai, Huixiong / Montgomery, Warren / Huli, Lior | 2008
69244F
Reflectivity-induced variation in implant layer lithography
Bailey, Todd C. / McIntyre, Greg / Zhang, Bidan / Deschner, Ryan P. / Mehta, Sohan / Song, Won / Lee, Hyung-Rae / Hue, Yu / Brodsky, MaryJane | 2008
69244G
Investigation of mechanism of pattern deformation on TiN substrate and O2 plasma effect without BARC
Moon, Juhyoung / Yun, Young-Je / Yang, Taek-seung / Choi, Kwangseon / Kim, Jeahee / Han, Jaewon | 2008
69244H
Rigorous modeling and analysis of impact produced by microstructures in mask on wafer pattern fidelity
Pundaleva, Irina / Chalykh, Roman / Lee, MyoungSoo / Kim, HeeBom / Kim, ByungGook / Cho, HanKu | 2008
69244I
The flash memory battle: How low can we go?
van Setten, Eelco / Wismans, Onno / Grim, Kees / Finders, Jo / Dusa, Mircea / Birkner, Robert / Richter, Rigo / Scherübl, Thomas | 2008
69244J
Measuring layer-specific depth-of-focus requirements
Liegl, Bernhard / Gabor, Allen / Brodsky, Colin / Cotte, John / Krishnan, Mahadevaiyer | 2008
69244K
Effects of laser bandwidth on tool to tool CD matching
Hsueh, Bo-Yun / Wu, Hung-Yi / Jang, Louis / Yeh, Met / Yang, Chen-Chin / Huang, George K.C. / Yu, Chun-Chi / Chang, Allen | 2008
69244M
Improving lithography intra wafer CD for C045 implant layers using STI thickness feed forward?
Massin, Jean / Orlando, Bastien / Gatefait, Maxime / Chapon, Jean-Damien / Le-Gratiet, Bertrand / Minghetti, Blandine / Goirand, Pierre-Jérôme | 2008
69244N
More on practical solutions to eliminate reticle haze and extend reticle life in the production environment: specially designed RSPs, internal POD purifiers, and XCDA purged reticle stockers
Goodwin, William / Welch, Matt / Laquidara, Bruce / Kishkovich, Oleg / Habecker, A. | 2008
69244O
Monitoring defects at wafer's edge for improved immersion lithography performance
Robinson, Chris / Bright, Jeff / Corliss, Dan / Guse, Mike / Lang, Bob / Mack, George | 2008
69244P
Modeling the work piece charging during e-beam lithography
Alles, Benjamin / Cotte, Eric / Simeon, Bernd / Wandel, Timo | 2008
69244Q
SEM-contour based mask modeling
Vasek, Jim / Tejnil, Edita / Kusnadi, Ir / Lindman, Ofer / Menadeva, Ovadya / Peltinov, Ram | 2008
69244R
Integration of high-speed surface-channel charge coupled devices into an SOI CMOS process using strong phase shift lithography
Knecht, Jeffrey / Bolkhovsky, Vladimir / Sage, Jay / Tyrrell, Brian / Wheeler, Bruce / Wynn, Charles | 2008
69244S
32 nm 1:1 line and space patterning by resist reflow process
Park, Joon-Min / Jeong, Heejun / An, Ilsin / Oh, Hye-Keun | 2008
69244T
Optimum dose variation caused by post exposure bake temperature difference inside photoresist over different sublayers and thickness
Kang, Young-Min / An, Ilsin / Kim, Do Wan / Oh, Hye-Keun | 2008
69244V
The analysis of optical lithography at 2-dimensional dense structure
Park, Chanha / Eom, Tae-Seung / Shin, Hyejin / Yang, Kiho / Choi, Jinyoung / Kim, Jinsoo / Kim, Hyeongsoo / Yim, Donggyu / Kim, Jinwoong | 2008
69244W
Image contrast contributions to immersion lithography defect formation and process yield
Rathsack, Ben / Hooge, Josh / Scheer, Steven / Nafus, Kathleen / Hatakeyama, Shinichi / Kouichi, Hontake / Kitano, Junichi / Van Den Heuval, Dieter / Leray, Philippe / Hendrickx, Eric et al. | 2008
69244X
Demonstration of production readiness of an immersion lithography cell
Beccalli, Alberto / Canestrari, Paolo / Goeke, Mark / Kanaoka, Masashi / Kandraschow, Helmut / Kuroda, Takuya / De Simone, Danilo / Piacentini, Paolo / Padovani, Miriam / Piazza, Paolo et al. | 2008
69244Y
High-speed microlithography aerial image simulation without four-dimensional singular-value decomposition
Chen, Charlie Chung-Ping | 2008
69244Z
Coupled eigenmode theory applied to thick mask modeling of TM polarized imaging
Allen, Gary / Davids, Paul | 2008
692401
Front Matter: Volume 6924
| 2008
692402
If it moves, simulate it!
Neureuther, Andrew | 2008
692403
Interactions of double patterning technology with wafer processing, OPC and design flows
Lucas, Kevin / Cork, Chris / Miloslavsky, Alex / Luk-Pat, Gerry / Barnes, Levi / Hapli, John / Lewellen, John / Rollins, Greg / Wiaux, Vincent / Verhaegen, Staf | 2008
692404
Toward 3nm overlay and critical dimension uniformity: an integrated error budget for double patterning lithography (Keynote Paper) [6924-03]
Arnold, W.H. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
692404
Toward 3nm overlay and critical dimension uniformity: an integrated error budget for double patterning lithography
Arnold, William H. | 2008
692406
A study of CD budget in spacer patterning technology [6924-05]
Mukai, H. / Shiobara, E. / Takahashi, S. / Hashimoto, K. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
692406
A study of CD budget in spacer patterning technology
Mukai, Hidefumi / Shiobara, Eishi / Takahashi, Shinya / Hashimoto, Kohji | 2008
692408
Double patterning for 32nm and below: an update
Finders, Jo / Dusa, Mircea / Vleeming, Bert / Megens, Henry / Hepp, Birgitt / Maenhoudt, Mireille / Cheng, Shaunee / Vandeweyer, Tom | 2008
692409
Split and design guidelines for double patterning
Wiaux, Vincent / Verhaegen, Staf / Cheng, Shaunee / Iwamoto, Fumio / Jaenen, Patrick / Maenhoudt, Mireille / Matsuda, Takashi / Postnikov, Sergei / Vandenberghe, Geert | 2008
692410
Extended Nijboer-Zernike (ENZ) based mask imaging: efficient coupling of electromagnetic field solvers and the ENZ imaging algorithm
Janssen, Olaf T. A. / van Haver, Sven / Janssen, Augustus J. E. M. / Braat, Joseph J. M. / Urbach, H. Paul / Pereira, Silvania F. | 2008
692411
Evaluating the accuracy of a calibrated rigorous physical resist model under various process and illumination conditions
Robertson, Stewart A. / Kim, Byung-Sung / Choi, Woon-Hyuk / Kim, Yoo-Hyon / Biafore, John J. / Smith, Mark D. | 2008
692412
High refractive index materials design for the next generation ArF immersion lithography
Furukawa, Taiichi / Kishida, Takanori / Yasuda, Kyouyuu / Shimokawa, Tsutomu / Liu, Zhi / Slezak, Mark / Hieda, Katsuhiko | 2008
692413
Studies of high index immersion lithography [6924-38]
Ohmura, Y. / Nagasaka, H. / Matsuyama, T. / Nakashima, T. / Kobayashi, T. / Ueda, M. / Owa, S. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
692413
Studies of high index immersion lithography
Ohmura, Yasuhiro / Nagasaka, Hiroyuki / Matsuyama, Tomoyuki / Nakashima, Toshiharu / Kobayashi, Teruki / Ueda, Motoi / Owa, Soichi | 2008
692415
High-n immersion lithography
Sewell, Harry / Mulkens, Jan / Graeupner, Paul / McCafferty, Diane / Markoya, Louis / Donders, Sjoerd / Cortie, Rogier / Meijers, Ralph / Evangelista, Fabrizio / Samarakone, Nandarisi | 2008
692416
High-index immersion lithography: preventing lens photocontamination and identifying optical behavior of LuAG
Liberman, V. / Rothschild, M. / Palmacci, S. T. / Bristol, R. / Byers, J. / Turro, N. J. / Lei, X. / O'Connor, N. / Zimmerman, P. A. | 2008
692417
High-index immersion fluids enabling cost-effective single-exposure lithography for 32 nm half pitches
French, Roger H. / Tran, Hoang V. / Adelman, Doug J. / Rogado, Nyrissa S. / Kaku, Mureo / Mocella, Michael / Chen, Charles Y. / Hendrickx, Eric / Van Roey, Freida / Bernfeld, Adam S. et al. | 2008
692418
Immersion defectivity study with volume production immersion lithography tool for 45 nm node and below
Nakano, Katsushi / Nagaoka, Shiro / Yoshida, Masato / Iriuchijima, Yasuhiro / Fujiwara, Tomoharu / Shiraishi, Kenichi / Owa, Soichi | 2008
692419
Focus, dynamics, and defectivity performance at wafer edge in immersion lithography
Tamura, Takao / Onoda, Naka / Fujita, Masafumi / Uchiyama, Takayuki | 2008
692420
Double patterning using dual spin-on Si containing layers with multilayer hard mask process
Terai, Mamoru / Ishibashi, Takeo / Shinohara, Masaaki / Yonekura, Kazumasa / Hagiwara, Takuya / Hanawa, Tetsuro / Kumada, Teruhiko | 2008
692421
45nm and 32nm half-pitch patterning with 193nm dry lithography and double patterning
Dai, Huixiong / Bencher, Chris / Chen, Yongmei / Woo, Hyungje / Ngai, Chris / Xu, Xumou | 2008
692422
A new OPC method for double patterning technology
Pan, Yijie / Zhang, Hongbo / Chen, Ye | 2008
692423
Study of ELS technology for random logic LSI toward 32-nm node
Setta, Yuji / Morishita, Kazumasa / Kobayashi, Katsuyoshi / Chijimatsu, Tatsuo / Asai, Satoru | 2008
692424
Double patterning in lithography for 65nm node with oxidation process
Jeong, Eunsoo / Kim, Jeahee / Choi, Kwangsun / Lee, Minkon / Lee, Doosung / Kim, Myungsoo / Park, Chansik | 2008
692425
Precise CD control techniques for double patterning and sidewall transfer
Nishimura, Eiichi / Kushibiki, Masato / Yatsuda, Koichi | 2008
692426
Fabrication of contact/via holes for 32-nm technology device using cost-effective RIE CD shrink process and double patterning technique [6924-77]
Kushibiki, M. / Nishimura, E. / Yatsuda, K. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
692426
Fabrication of contact/via holes for 32-nm technology device using cost-effective RIE CD shrink process and double patterning technique
Kushibiki, Masato / Nishimura, Eiichi / Yatsuda, Koichi | 2008
692428
Double patterning overlay and CD budget for 32 nm technology node
Iessi, Umberto / Loi, Sara / Salerno, Antonio / Rigolli, Pierluigi / De Chiara, Elio / Turco, Catia / Colombo, Roberto / Polli, Marco / Mani, Antonio | 2008
692429
Double exposure double etch for dense SRAM: a designer's dream
Sarma, Chandra / Gabor, Allen / Halle, Scott / Haffner, Henning / Herold, Klaus / Tsou, Len / Wang, Helen / Zhuang, Haoren | 2008
692430
Automated method of detecting SRAF and sidelobe printing with automated CD-SEM recipes
Coles, Mary / Choi, Yong Seok / Yang, Kyoungmo / Parker, Cindy / Self, Andy | 2008
692431
Novel lithography rule check for full-chip side lobe detection
Wu, T. S. / Yang, Elvis / Yang, T. H. / Chen, K. C. / Lu, C. Y. | 2008
692432
Quasi-iso-focal hole pattern formation by Checker-Board PSM (CB-PSM)
Nakao, S. / Maejima, S. / Minamide, A. / Saitoh, H. / Hanawa, T. / Suko, K. | 2008
692433
Optimum biasing for 45 nm node chromeless and attenuated phase shift mask
Kang, Young-Min / Oh, Hye-Keun | 2008
692434
Improvement of the common DoF across field for hole-structure process layers
Hou, Shu Huei / Huang, Edgar / Tseng, Aroma / Yeh, Met / Lin, Bill / Yu, Chun Chi / Lin, Eason | 2008
692435
Customized illumination shapes for 193nm immersion lithography
Ling, Moh Lung / Chua, Gek Soon / Lin, Qunying / Tay, Cho Jui / Quan, Chenggen | 2008
692436
Binary and attenuated PSM mask evaluation for sub 50nm device development perspective
Moon, James / Nam, Byoung-Sub / Jeong, Joo-Hong / Kong, Dong-Ho / Nam, Byung-Ho / Yim, Dong Gyu | 2008
692437
Highly reliable detection and correction of pinched areas for high transmission phase shift mask
Chen, Chih Li / Liao, Chun-Cheng / Chou, Pin-Jan / Shih, Chiang Lin / Shih, Steven | 2008
692438
Evaluation of inverse lithography technology for 55nm-node memory device
Cho, Byung-ug / Ko, Sung-woo / Choi, Jae-seung / Kim, Cheol-Kyun / Yang, Hyun-jo / Yim, DongGyu / Kim, David / Gleason, Bob / Baik, KiHo / Cui, Ying et al. | 2008
692439
Extension of low k1 lithography processes with KrF for 90nm technology node
Jun, Sungho / Jeong, Eunsoo / Yun, Youngje / Choi, Kwangseon / Kim, Jeahee / Han, Jaewon | 2008
692442
OPC modeling setup with considering flare effect [6924-153]
Kim, J. / Choi, J. / Han, J. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
692442
OPC modeling setup with considering flare effect
Kim, Jong-doo / Choi, Jae-young / Kim, Jea-hee / Han, Jae-won | 2008
692445
Fitness and runtime correlation of compact model complexity
Drozdov, Alexander N. / Kempsell, Monica L. / Granik, Yuri | 2008
692446
AltPSM contact hole application at DRAM 4xnm nodes with dry 193nm lithography
Noelscher, Christoph / Henkel, Thomas / Jauzion-Graverolle, Franck / Hennig, Mario / Morgana, Nicolo / Schlief, Ralph / Moukara, Molela / Koehle, Roderick / Neubauer, Ralf | 2008
692447
An approach for nanometer trench and hole formation
Wang, Zhongyan / Sun, Ming / Peng, Xilin / Boonstra, Thomas | 2008
692448
Multi-patterning overlay control
Ausschnitt, C. P. / Dasari, P. | 2008
692449
Resist bias measured in Iso-focal structure
Li, Jianliang / Wang, Chunqing / Kazarian, Aram / Yan, Qiliang / Melvin, Lawrence S. | 2008
692450
A rigorous finite-element domain decomposition method for electromagnetic near field simulations
Zschiedrich, Lin / Burger, Sven / Schädle, Achim / Schmidt, Frank | 2008
692451
Influence of pellicle on hyper-NA imaging
Sato, Kazuya / Nagai, Satoshi / Shinichiro, Nakagawa / Sato, Takashi / Itoh, Masamitsu | 2008
692452
Rigorous electromagnetic field simulation of two-beam interference exposures for the exploration of double patterning and double exposure scenarios
Erdmann, Andreas / Evanschitzky, Peter / Fühner, Tim / Schnattinger, Thomas / Xu, Cheng-Bai / Szmanda, Chuck | 2008
692453
A simulation study on the impact of lithographic process variations on CMOS device performance
Fühner, Tim / Kampen, Christian / Kodrasi, Ina / Burenkov, Alexander / Erdmann, Andreas | 2008
Polarization characteristics of state-of-art lithography optics reconstructed from on-body measurement [6924-34]
Fujii, T. / Kogo, J. / Suzuki, K. / Sawada, M. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
Focus, dynamics, and defectivity performance at wafer edge in immersion lithography [6924-44]
Tamura, T. / Onoda, N. / Fujita, M. / Uchiyama, T. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
An improved process for manufacturing diffractive optical elements (DOEs) for off-axis illumination systems [6924-97]
Leonard, J. / Carriere, J. / Stack, J. / Jones, R. / Himel, M. / Childers, J. / Welch, K. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
The flash memory battle: How low can we go? [6924-174]
van Setten, E. / Wismans, O. / Grim, K. / Finders, J. / Dusa, M. / Birkner, R. / Richter, R. / Scherubl, T. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
Double patterning for 32nm and below: an update [6924-07]
Finders, J. / Dusa, M. / Vleeming, B. / Megens, H. / Hepp, B. / Maenhoudt, M. / Cheng, S. / Vandeweyer, T. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
Immersion defect performance and particle control method for 45nm mass production [6924-46]
Chibana, T. / Kobayashi, M. / Nakano, H. / Arakawa, M. / Matsuoka, Y. / Kawasaki, Y. / Tanabe, M. / Oda, H. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
Evaluation of OPC test patterns using parameter sensitivity [6924-140]
Ward, B.S. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
Extended Nijboer-Zernike (ENZ) based mask imaging: efficient coupling of electromagnetic field solvers and the ENZ imaging algorithm [6924-35]
Janssen, O.T.A. / van Haver, S. / Janssen, A.J.E.M. / Braat, J.J.M. / Urbach, H.P. / Pereira, S.F. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
Optimization procedure of exposure tools with polarization aberrations [6924-53]
Arai, T. / Yamada, A. / Mori, K. / Osaki, Y. / Yoshihara, T. / Hasegawa, Y. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
Double patterning using dual spin-on Si containing layers with multilayer hard mask process [6924-71]
Terai, M. / Ishibashi, T. / Shinohara, M. / Yonekura, K. / Hagiwara, T. / Hanawa, T. / Kumada, T. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
An efficient and robust mask model for lithography simulation [6924-126]
Zhu, Z. / Schmidt, F. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
Mask optimization for arbitrary patterns with 2D-TCC resolution enhancement technique [6924-14]
Kawashima, M. / Yamazoe, K. / Sekine, Y. / Hakko, M. / Ohta, M. / Honda, T. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
Influence of shot noise on CDU with DUV, EUV, and E-beam [6924-55]
Pan, Z.-Y. / Chen, C.-K. / Gau, T.-S. / Lin, B.J. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
Recent performance results of Nikon immersion lithography tools [6924-58]
Hazelton, A.J. / Shiraishi, K. / Wakamoto, S. / Ishii, Y. / Okumura, M. / Magome, N. / Suzuki, H. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
Pattern centric OPC flow: a special RET flow with fast turn-around-time [6924-146]
Wang, T. / Wu, J. / Liu, Q. / Zhang, G. / Wang, B. / Su, B. / Cheng, G. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
A simulation study on the impact of lithographic process variations on CMOS device performance [6924-197]
Fuhner, T. / Kampen, C. / Kodrasi, I. / Burenkov, A. / Erdmann, A. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
Making a trillion pixels dance [6924-27]
Singh, V. / Hu, B. / Toh, K. / Bollepalli, S. / Wagner, S. / Borodovsky, Y. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
Robust PPC and DFM methodology for exposure tool variations [6924-50]
Kotani, T. / Nakajima, F. / Mashita, H. / Sato, K. / Tanaka, S. / Inoue, S. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
An analysis of double exposure lithography options [6924-81]
Lee, S. / Byers, J. / Jen, K. / Zimmerman, P. / Rice, B. / Turro, N.J. / Willson, C.G. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
Validation of inverse lithography technology (ILT) and its adaptive SRAF at advanced technology nodes [6924-28]
Pang, L. / Dai, G. / Cecil, T. / Dam, T. / Cui, Y. / Hu, P. / Chen, D. / Baik, K.-H. / Peng, D. / Society of Photo-optical Instrumentation Engineers et al. | 2008
Double patterning combined with shrink technique to extend ArF lithography for contact holes to 22nm node and beyond [6924-09]
Miao, X. / Huli, L. / Chen, H. / Xu, X. / Woo, H. / Bencher, C. / Shu, J. / Ngai, C. / Borst, C. / Society of Photo-optical Instrumentation Engineers et al. | 2008
Applications of TM polarized illumination [6924-18]
Smith, B. / Zhou, J. / Xie, P. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
Imaging performance optimization for hyper-NA scanner systems in high volume production [6924-67]
van de Kerkhof, M. / van Setten, E. / Engelen, A. / Plachecki, V. / Liu, H. / Schmitt-Weaver, E. / Rooijakkers, W. / Simon, K. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
Understanding illumination effects for control of optical proximity effects (OPE) [6924-65]
Flagello, D.G. / Geh, B. / Socha, R. / Liu, P. / Cao, Y. / Stas, R. / Natt, O. / Zimmermann, J. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
Double patterning in lithography for 65nm node with oxidation process [6924-75]
Jeong, E. / Kim, J. / Choi, K. / Lee, M. / Lee, D. / Kim, M. / Park, C. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
Extreme mask corrections: technology and benefits [6924-147]
Granik, Y. / Cobb, N. / Medvedev, D. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
Resist bias measured in Iso-focal structure [6924-162]
Li, J. / Wang, C. / Kazarian, A. / Yan, Q. / Melvin, L.S. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
The comparison of OPC performance and run time for dense versus sparse solutions [6924-124]
Abdo, A. / Stobert, I. / Viswanathan, R. / Burns, R. / Herold, K. / Kallingal, C. / Meiring, J. / Oberschmidt, J. / Mansfield, S. / Society of Photo-optical Instrumentation Engineers et al. | 2008
Improvement of the common DoF across field for hole-structure process layers [6924-113]
Hou, S.H. / Huang, E. / Tseng, A. / Yeh, M. / Lin, B. / Yu, C.C. / Lin, E. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
Fluoride single crystals for the next generation lithography [6924-93]
Nawata, T. / Inui, Y. / Mabuchi, T. / Mochizuki, N. / Masada, I. / Nishijima, E. / Sato, H. / Fukuda, T. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
Manufacturing implementation of 32nm SRAM using ArF immersion with RET [6924-105]
Lee, S.-S. / Wu, C.-H. / Huang, Y. / Huang, C.-H. / Huang, H.-C. / Huang, G.K.C. / Yu, C.-C. / Hsu, M. / Shieh, S. / Hsu, S. et al. | 2008
Combined mask and illumination scheme optimization for robust contact patterning on 45nm technology node flash memory devices [6924-120]
Pret, A.V. / Capetti, G. / Bollin, M. / Cotti, G. / De Simone, D. / Cantu, P. / Vaccaro, A. / Soma, L. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
More on practical solutions to eliminate reticle haze and extend reticle life in the production environment: specially designed RSPs, internal POD purifiers, and XCDA purged reticle stockers [6924-180]
Goodwin, W. / Welch, M. / Laquidara, B. / Kishkovich, O. / Habecker, A. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
Image contrast contributions to immersion lithography defect formation and process yield [6924-189]
Rathsack, B. / Hooge, J. / Scheer, S. / Nafus, K. / Hatakeyama, S. / Kouichi, H. / Kitano, J. / Van Den Heuval, D. / Leray, P. / Hendrickx, E. et al. | 2008
XLR 600i: recirculating ring ArF light source for double patterning immersion lithography [6924-62]
Fleurov, V. / Rokitski, S. / Bergstedt, R. / Ye, H. / O Brien, K. / Jacques, R. / Trintchouk, F. / Figueroa, E. / Cacouris, T. / Brown, D. et al. | 2008
Modeling of focus blur in the context of optical proximity correction [6924-129]
Zhang, Q. / Song, H. / Lucas, K. / Shiely, J. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
32 nm logic patterning options with immersion lithography [6924-200]
Lai, K. / Burns, S. / Halle, S. / Zhuang, L. / Colburn, M. / Allen, S. / Babcock, C. / Baum, Z. / Burkhardt, M. / Dai, V. et al. | 2008
Double patterning requirements for optical lithography and prospects for optical extension without double patterning [6924-26]
Hazelton, A.J. / Wakamoto, S. / Hirukawa, S. / McCallum, M. / Magome, N. / Ishikawa, J. / Lapeyre, C. / Guilmeau, I. / Barnola, S. / Gaugiran, S. et al. | 2008
Coupled-dipole modelling for 3D mask simulation [6924-31]
Temchenko, V. / Lim, C. / Wallis, D. / Schneider, J. / Niehoff, M. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
45nm node logic device OPE matching between exposure tools through laser bandwidth tuning [6924-92]
Yoshimochi, K. / Tamura, T. / Nagahara, S. / Uchiyama, T. / Farrar, N. / Oga, T. / Bonafede, J. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
Analysis of OPC optical model accuracy with detailed scanner information [6924-48]
Zavyalova, L. / Lucas, K. / Zhang, Q. / Fan, Y. / Sethi, S. / Song, H. / Tyminski, J. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
Precise CD control techniques for double patterning and sidewall transfer [6924-76]
Nishimura, E. / Kushibiki, M. / Yatsuda, K. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
Evaluating the accuracy of a calibrated rigorous physical resist model under various process and illumination conditions [6924-36]
Robertson, S.A. / Kim, B.-S. / Choi, W.-H. / Kim, Y.-H. / Biafore, J.J. / Smith, M.D. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
Negative and iterated spacer lithography processes for low variability and ultra-dense integration [6924-10]
Carlson, A. / Liu, T.-J.K. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
Study of SRAF placement for contact at 45 nm and 32 nm node [6924-107]
Farys, V. / Robert, F. / Martinelli, C. / Trouiller, Y. / Sundermann, F. / Gardin, C. / Planchot, J. / Kerrien, G. / Vautrin, F. / Saied, M. et al. | 2008
Optimized OPC approach for process window improvement [6924-122]
Wang, C.-H. / Liu, Q. / Zhang, L. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
Tool-to-tool optical proximity effect matching [6924-61]
Van Look, L. / Bekaert, J. / De Bisschop, P. / Van de Kerkhove, J. / Vandenberghe, G. / Schreel, K. / Menger, J. / Schiffelers, G. / Knols, E. / Willekers, R. et al. | 2008
Latest developments on immersion exposure systems [6924-60]
Mulkens, J. / de Klerk, J. / Leenders, M. / de Jong, F. / Cromwijk, J.W. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
Reticle CD error calibrated OPC model generation [6924-127]
Kim, Y. / Choi, J.-Y. / Kim, J.-D. / Kim, J. / Han, J.-W. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
Extending scatterometry to the measurements of sub 40 nm features, double patterning structures, and 3D OPC patterns [6924-57]
Kritsun, O. / La Fontaine, B. / Liu, Y. / Saravanan, C.S. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
Rigorous electromagnetic field simulation of two-beam interference exposures for the exploration of double patterning and double exposure scenarios [6924-196]
Erdmann, A. / Evanschitzky, P. / Fuhner, T. / Schnattinger, T. / Xu, C.-B. / Szmanda, C. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
The rapid introduction of immersion lithography for NAND flash: challenges and experience [6924-45]
Wu, C.-T. / Lin, H.M. / Wu, W.-M. / Chan, M.-H. / Lin, B.S.-M. / Lin, K.-H. / Hazelton, A.J. / Ohhashi, T. / Nakano, K. / Iriuchijima, Y. et al. | 2008
Split and design guidelines for double patterning [6924-08]
Wiaux, V. / Verhaegen, S. / Cheng, S. / Iwamoto, F. / Jaenen, P. / Maenhoudt, M. / Matsuda, T. / Postnikov, S. / Vandenberghe, G. / Society of Photo-optical Instrumentation Engineers et al. | 2008
Alternative process schemes for double patterning that eliminate the intermediate etch step [6924-24]
Maenhoudt, M. / Gronheid, R. / Stepanenko, N. / Matsuda, T. / Vangoidsenhoven, D. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
Proposal for determining exposure latitude requirements [6924-54]
Levinson, H.J. / Ma, Y. / Koenig, M. / La Fontaine, B. / Seltmann, R. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
A comprehensive comparison between double patterning and double patterning with spacer on sub-50nm product implementation [6924-69]
Tseng, C.F. / Yang, C.C. / Yang, E. / Yang, T.H. / Chen, K.C. / Lu, C.Y. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
Development of layout split algorithms and printability evaluation for double patterning technology [6924-131]
Chiou, T.-B. / Socha, R. / Chen, H. / Chen, L. / Hsu, S. / Nikolsky, P. / van Oosten, A. / Chen, A.C. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
Thermal aberration control in projection lens [6924-66]
Nakashima, T. / Ohmura, Y. / Ogata, T. / Uehara, Y. / Nishinaga, H. / Matsuyama, T. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
Continuing 193nm optical lithography for 32nm imaging and beyond [6924-90]
Piscani, E.C. / Ashworth, D. / Byers, J. / Van Peski, C. / Zimmerman, P. / Rice, B.J. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
Integration of pixelated phase masks for full-chip random logic layers [6924-17]
Schenker, R. / Bollepalli, S. / Hu, B. / Toh, K. / Singh, V. / Yung, K. / Cheng, W. / Borodovsky, Y. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
Optical proximity correction for elongated contact-hole printing [6924-138]
Kim, Y.-C. / Kim, S. / Suh, S. / Cheon, Y. / Lee, S. / Lee, J. / Choi, S.-W. / Han, W. / Koo, K. / Society of Photo-optical Instrumentation Engineers et al. | 2008
Patterning strategy and performance of 1.3NA tool for 32nm node lithography [6924-21]
Mimotogi, S. / Satake, M. / Kitamura, Y. / Takahata, K. / Kodera, K. / Fujise, H. / Ema, T. / Sho, K. / Ishigo, K. / Kono, T. et al. | 2008
100 nm half-pitch double exposure KrF lithography using binary masks [6924-70]
Geisler, S. / Bauer, J. / Haak, U. / Stolarek, D. / Schulz, K. / Wolf, H. / Meier, W. / Trojahn, M. / Matthus, E. / Society of Photo-optical Instrumentation Engineers et al. | 2008
Study of ELS technology for random logic LSI toward 32-nm node [6924-74]
Setta, Y. / Morishita, K. / Kobayashi, K. / Chijimatsu, T. / Asai, S. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
Customized illumination shapes for 193nm immersion lithography [6924-114]
Ling, M.L. / Chua, G.S. / Lin, Q. / Tay, C.J. / Quan, C. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
Novel refractive optics enable multipole off-axis illumination [6924-91]
Bizjak, T. / Mitra, T. / Hauschild, D. / Aschke, L. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
SEM-contour based mask modeling [6924-183]
Vasek, J. / Tejnil, E. / Kusnadi, I. / Lindman, O. / Menadeva, O. / Peltinov, R. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
Variable loading kernels for OPC modeling [6924-148]
Tsai, S.L. / Lo, F. / Yang, E. / Yang, T.H. / Chen, K.C. / Lu, C.Y. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
Performance of the FPA-7000AS7 1.35 NA immersion exposure system for 45-nm mass production [6924-59]
Yoshimura, K. / Nakano, H. / Hata, H. / Deguchi, N. / Kobayashi, M. / Ebihara, T. / Kawanobe, Y. / Kanda, T. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
Optimum biasing for 45 nm node chromeless and attenuated phase shift mask [6924-112]
Kang, Y.-M. / Oh, H.-K. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
Pellicle effect on OPC modeling [6924-142]
Luo, B. / Chang, C.-K. / Wang, W.L. / Huang, W.C. / Wu, T. / Lai, C.W. / Liu, R.G. / Lin, H.T. / Chen, K.S. / Ku, Y.C. et al. | 2008
Post-decomposition assessment of double patterning layout [6924-23]
Rubinstein, J. / Neureuther, A.R. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
Multi-patterning overlay control [6924-161]
Ausschnitt, C.P. / Dasari, P. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
22nm half-pitch patterning by CVD spacer self alignment double patterning (SADP) [6924-169]
Bencher, C. / Chen, Y. / Dai, H. / Montgomery, W. / Huli, L. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
Effects of laser bandwidth on tool to tool CD matching [6924-176]
Hsueh, B.-Y. / Wu, H.-Y. / Jang, L. / Yeh, M. / Yang, C.-C. / Huang, G.K.C. / Yu, C.-C. / Chang, A. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
Uniaxial crystal last optical element for second- and third-generation immersion lithography [6924-201]
Sirat, G.Y. / Goldstein, M. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
Consideration of VT5 etch-based OPC modeling [6924-121]
Lim, C.T. / Temchenko, V. / Kaiser, D. / Meusel, I. / Schmidt, S. / Schneider, J. / Niehoff, M. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
Reliable high power injection locked 6 kHz 60W laser for ArF immersion lithography [6924-198]
Kumazaki, T. / Suzuki, T. / Tanaka, S. / Nohdomi, R. / Yoshino, M. / Matsumoto, S. / Kawasuji, Y. / Umeda, H. / Nagano, H. / Kakizaki, K. et al. | 2008
Highly reliable detection and correction of pinched areas for high transmission phase shift mask [6924-116]
Chen, C.L. / Liao, C.-C. / Chou, P.-J. / Shih, C.L. / Shih, S. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
Monitoring polarization at 193nm high-numerical aperture with phase shift masks: experimental results and industrial outlook [6924-68]
McIntyre, G. / Tu, R. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
32 nm 1:1 line and space patterning by resist reflow process [6924-185]
Park, J.-M. / Jeong, H. / An, I. / Oh, H.-K. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
Pixelated phase mask as novel lithography RET [6924-13]
Borodovsky, Y. / Cheng, W.-H. / Schenker, R. / Singh, V. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
Novel lithography rule check for full-chip side lobe detection [6924-110]
Wu, T.S. / Yang, E. / Yang, T.H. / Chen, K.C. / Lu, C.Y. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
Interactions of double patterning technology with wafer processing, OPC and design flows (Keynote Paper) [6924-02]
Lucas, K. / Cork, C. / Miloslavsky, A. / Luk-Pat, G. / Barnes, L. / Hapli, J. / Lewellen, J. / Rollins, G. / Wiaux, V. / Verhaegen, S. et al. | 2008
Massively-parallel FDTD simulations to address mask electromagnetic effects in hyper-NA immersion lithography [6924-33]
Azpiroz, J.T. / Burr, G.W. / Rosenbluth, A.E. / Hibbs, M. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
Fabrication of defect-free full-field pixelated phase mask [6924-51]
Cheng, W.-H. / Farnsworth, J. / Kwok, W. / Jamieson, A. / Wilcox, N. / Vernon, M. / Yung, K. / Liu, Y.-P. / Kim, J. / Frendberg, E. et al. | 2008
High refractive index materials design for the next generation ArF immersion lithography [6924-37]
Furukawa, T. / Kishida, T. / Yasuda, K. / Shimokawa, T. / Liu, Z. / Slezak, M. / Hieda, K. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
Automated method of detecting SRAF and sidelobe printing with automated CD-SEM recipes [6924-109]
Coles, M. / Choi, Y.S. / Yang, K. / Parker, C. / Self, A. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
Double printing through the use of ion implantation [6924-82]
Samarakone, N. / Yick, P. / Zawadzki, M. / Choi, S.-J. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
High-power and high-energy stability injection lock laser light source for double exposure or double patterning ArF immersion lithography [6924-199]
Yoshino, M. / Nakarai, H. / Ohta, T. / Nagano, H. / Umeda, H. / Kawasuji, Y. / Abe, T. / Nohdomi, R. / Suzuki, T. / Tanaka, S. et al. | 2008
Influence of pellicle on hyper-NA imaging [6924-195]
Sato, K. / Nagai, S. / Shinichiro, N. / Sato, T. / Itoh, M. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
Generalized inverse problem for partially coherent projection lithography [6924-32]
Davids, P.S. / Bollepalli, S.B. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
30nm half-pitch metal patterning using Moti CD shrink technique and double patterning [6924-83]
Versluijs, J. / De Marneffe, J.-F. / Goossens, D. / de Beeck, M.O. / Vandeweyer, T. / Wiaux, V. / Struyf, H. / Maenhoudt, M. / Brouri, M. / Vertommen, J. et al. | 2008
Quasi-iso-focal hole pattern formation by Checker-Board PSM (CB-PSM) [6924-111]
Nakao, S. / Maejima, S. / Minamide, A. / Saitoh, H. / Hanawa, T. / Suko, K. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
Enabling 35nm double patterning contact imaging using a novel CD shrink process [6924-84]
Yamada, Y. / Crouse, M.M. / Dunn, S. / Kawasaki, T. / Shimura, S. / Nishimura, E. / Tanaka, Y. / Galloway, J. / Pierson, B. / Routh, R. et al. | 2008
Impact of optimization conditions on the result at optimizing illumination and mask [6924-101]
Tsujita, K. / Mikami, K. / Ishii, H. / Suzuki, A. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
Rigorous modeling and analysis of impact produced by microstructures in mask on wafer pattern fidelity [6924-173]
Pundaleva, I. / Chalykh, R. / Lee, M. / Kim, H. / Kim, B. / Cho, H. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
Enabling technology scaling with ``in production'' lithography processes [6924-19]
Jhaveri, T. / Strojwas, A. / Pileggi, L. / Rovner, V. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
Double exposure double etch for dense SRAM: a designer's dream [6924-80]
Sarma, C. / Gabor, A. / Halle, S. / Haffner, H. / Herold, K. / Tsou, L. / Wang, H. / Zhuang, H. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
If it moves, simulate it! (Keynote Paper) [6924-01]
Neureuther, A. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
Radiometric consistency in source specifications for lithography [6924-30]
Rosenbluth, A.E. / Azpiroz, J.T. / Lai, K. / Tian, K. / Melville, D.O.S. / Totzeck, M. / Blahnik, V. / Koolen, A. / Flagello, D. / Society of Photo-optical Instrumentation Engineers et al. | 2008
Random 65nm..45nm C/H printing using optimized illumination source and CD sizing by post processing [6924-106]
Finders, J. / Van der Heijden, E. / Janssen, G.-J. / Vangheluwe, R. / Shibata, T. / Naitou, R. / Kosugi, H. / Sugimachi, H. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
A rigorous finite-element domain decomposition method for electromagnetic near field simulations [6924-193]
Zschiedrich, L. / Burger, S. / Schadle, A. / Schmidt, F. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
Impact of medium and long range effects on poly gate patterning [6924-149]
Tagliavini, M. / Annoni, E. / Cantu, P. / Capetti, G. / Catarisano, C. / Colombo, R. / Magri, G. / Ravasio, M. / Zanderigo, F. / Society of Photo-optical Instrumentation Engineers et al. | 2008
High-speed microlithography aerial image simulation without four-dimensional singular-value decomposition [6924-191]
Chen, C.C.-P. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
Determining DOF requirements needed to meet technology process assumptions [6924-56]
Gabor, A. / Brendler, A. / Liegl, B. / Brodsky, C. / Lembach, G. / Mansfield, S. / Mishra, S. / Brunner, T. / Wiltshire, T. / Menon, V. et al. | 2008
Demonstration of production readiness of an immersion lithography cell [6924-190]
Beccalli, A. / Canestrari, P. / Goeke, M. / Kanaoka, M. / Kandraschow, H. / Kuroda, T. / De Simone, D. / Piacentini, P. / Padovani, M. / Piazza, P. et al. | 2008
Double patterning overlay and CD budget for 32 nm technology node [6924-79]
Iessi, U. / Loi, S. / Salerno, A. / Rigolli, P. / De Chiara, E. / Turco, C. / Colombo, R. / Polli, M. / Mani, A. / Society of Photo-optical Instrumentation Engineers et al. | 2008
Double patterning of contact array with carbon polymer [6924-11]
Jung, W.-Y. / Sim, G.-H. / Kim, S.-M. / Kim, C.-D. / Jeon, S.-M. / Kim, K. / Park, S.-W. / Lee, B.-S. / Park, S.-K. / Cho, H.-H. et al. | 2008
Contrast management of 193i interferometry to be close to scanners contrast conditions [6924-88]
Lagrange, A. / Bandelier, P. / Charpin, C. / Lartigue, O. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
Novel method for optimizing lithography exposure conditions using full-chip post-OPC simulation [6924-136]
Sturtevant, J. / Jayaram, S. / Hong, L. / Drozdov, A. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
The analysis of optical lithography at 2-dimensional dense structure [6924-188]
Park, C. / Eom, T.-S. / Shin, H. / Yang, K. / Choi, J. / Kim, J. / Kim, H. / Yim, D. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
Optical proximity correction with principal component regression [6924-133]
Gao, P. / Gu, A. / Zakhor, A. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
An approach for nanometer trench and hole formation [6924-160]
Wang, Z. / Sun, M. / Peng, X. / Boonstra, T. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
32nm overlay improvement capabilities [6924-166]
Eichelberger, B. / Huang, K. / O Brien, K. / Tien, D. / Tsai, F. / Minvielle, A. / Singh, L. / Schefske, J. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
General imaging of advanced 3D mask objects based on the fully-vectorial extended Nijboer-Zernike (ENZ) theory [6924-29]
van Haver, S. / Janssen, O.T.A. / Braat, J.J.M. / Janssen, A.J.E.M. / Urbach, H.P. / Pereira, S.F. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
Evaluation of inverse lithography technology for 55nm-node memory device [6924-117]
Cho, B. / Ko, S. / Choi, J. / Kim, C.-K. / Yang, H. / Yim, D. / Kim, D. / Gleason, B. / Baik, K. / Cui, Y. et al. | 2008
OPC optimization for double dipole lithography and its application on 45nm node with dry exposure [6924-135]
Park, S.-J. / Seo, J.-K. / Li, C. / Liu, D. / An, P. / Kang, X.-H. / Guo, E. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
Reflection control in hyper-NA immersion lithography [6924-163]
Zhu, Z. / Piscani, E. / Edwards, K. / Smith, B. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
Improving lithography intra wafer CD for C045 implant layers using STI thickness feed forward? [6924-179]
Massin, J. / Orlando, B. / Gatefait, M. / Chapon, J.-D. / Le-Gratiet, B. / Minghetti, B. / Goirand, P.-J. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
Double patterning down to k1=0.15 with bilayer resist [6924-25]
Noelscher, C. / Jauzion-Graverolle, F. / Heller, M. / Markert, M. / Hong, B.-K. / Egger, U. / Temmler, D. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
High-index immersion lithography: preventing lens photocontamination and identifying optical behavior of LuAG [6924-41]
Liberman, V. / Rothschild, M. / Palmacci, S.T. / Bristol, R. / Byers, J. / Turro, N.J. / Lei, X. / O Connor, N. / Zimmerman, P.A. / Society of Photo-optical Instrumentation Engineers et al. | 2008
Advanced mask process modeling for 45-nm and 32-nm nodes [6924-125]
Tejnil, E. / Hu, Y. / Sahouria, E. / Schulze, S. / Tian, M.J. / Guo, E. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
Integration of high-speed surface-channel charge coupled devices into an SOI CMOS process using strong phase shift lithography [6924-184]
Knecht, J. / Bolkhovsky, V. / Sage, J. / Tyrrell, B. / Wheeler, B. / Wynn, C. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
Understanding and application of constructive, destructive SRAF [6924-102]
Chin, F.L. / Lukanc, T.P. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
Monitoring defects at wafer's edge for improved immersion lithography performance [6924-181]
Robinson, C. / Bright, J. / Corliss, D. / Guse, M. / Lang, B. / Mack, G. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
A new OPC method for double patterning technology [6924-73]
Pan, Y. / Zhang, H. / Chen, Y. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
Extension of low k1 lithography processes with KrF for 90nm technology node [6924-118]
Jun, S. / Jeong, E. / Yun, Y. / Choi, K. / Kim, J. / Han, J. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
Fitness and runtime correlation of compact model complexity [6924-158]
Drozdov, A.N. / Kempsell, M.L. / Granik, Y. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
High-index immersion fluids enabling cost-effective single-exposure lithography for 32 nm half pitches [6924-42]
French, R.H. / Tran, H.V. / Adelman, D.J. / Rogado, N.S. / Kaku, M. / Mocella, M. / Chen, C.Y. / Hendrickx, E. / Van Roey, F. / Bernfeld, A.S. et al. | 2008
Performance demonstration of significant availability improvement in lithography light sources using GLX control system [6924-100]
O Brien, K. / Dunstan, W.J. / Riggs, D. / Ratnam, A. / Jacques, R. / Besaucele, H. / Brown, D. / Zhang, K. / Farrar, N. / Society of Photo-optical Instrumentation Engineers et al. | 2008
A novel photo-thermal setup for determination of absorptance losses and wavefront deformations in DUV optics [6924-98]
Mann, K. / Bayer, A. / Leinhos, U. / Miege, T. / Schafer, B. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
Binary and attenuated PSM mask evaluation for sub 50nm device development perspective [6924-115]
Moon, J. / Nam, B.-S. / Jeong, J.-H. / Kong, D.-H. / Nam, B.-H. / Yim, D.G. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
Reflectivity-induced variation in implant layer lithography [6924-171]
Bailey, T.C. / McIntyre, G. / Zhang, B. / Deschner, R.P. / Mehta, S. / Song, W. / Lee, H.-R. / Hue, Y. / Brodsky, M. / Society of Photo-optical Instrumentation Engineers et al. | 2008
Modeling the work piece charging during e-beam lithography [6924-182]
Alles, B. / Cotte, E. / Simeon, B. / Wandel, T. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
Study of the mask topography effect on the OPC modeling of hole patterns [6924-139]
Shim, S. / Kim, Y. / Lee, S. / Choi, S. / Han, W. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
Optimum dose variation caused by post exposure bake temperature difference inside photoresist over different sublayers and thickness [6924-186]
Kang, Y.-M. / An, I. / Kim, D.W. / Oh, H.-K. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
Coupled eigenmode theory applied to thick mask modeling of TM polarized imaging [6924-192]
Allen, G. / Davids, P. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
Investigation of mechanism of pattern deformation on TiN substrate and O2 plasma effect without BARC [6924-172]
Moon, J. / Yun, Y.-J. / Yang, T. / Choi, K. / Kim, J.-H. / Han, J. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
90nm node contact hole patterning through applying model based OPC in KrF lithography [6924-103]
Jeon, Y.-D. / Lee, S.-U. / Choi, J. / Kim, J. / Han, J. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
OPC model calibration considerations for data variance [6924-144]
Bahnas, M. / Al-Imam, M. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
Comparative study of binary intensity mask and attenuated phase shift mask using hyper-NA immersion lithography for sub-45nm era [6924-16]
Eom, T.-S. / Park, J.-T. / Kang, J.-H. / Park, S. / Koo, S. / Kim, J.-S. / Lee, B.-H. / Lim, C.-M. / Kim, H. / Moon, S.-C. et al. | 2008
Prediction of imaging performance of immersion lithography using high refractive index fluid [6924-86]
Sato, T. / Itoh, M. / Mimotogi, A. / Mimotogi, S. / Sato, K. / Tanaka, S. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
An intelligent imaging system for ArF scanner [6924-63]
Matsuyama, T. / Ohmura, Y. / Nakashima, T. / Uehara, Y. / Ogata, T. / Nishinaga, H. / Ikezawa, H. / Toki, T. / Rokitski, S. / Bonafede, J. et al. | 2008
In-situ polarimetry of illumination for 193-nm lithography [6924-64]
Nomura, H. / Furutono, Y. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
Measuring layer-specific depth-of-focus requirements [6924-175]
Liegl, B. / Gabor, A. / Brodsky, C. / Cotte, J. / Krishnan, M. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
AltPSM contact hole application at DRAM 4xnm nodes with dry 193nm lithography [6924-159]
Noelscher, C. / Henkel, T. / Jauzion-Graverolle, F. / Hennig, M. / Morgana, N. / Schlief, R. / Moukara, M. / Koehle, R. / Neubauer, R. / Society of Photo-optical Instrumentation Engineers et al. | 2008
Development of a computational lithography roadmap [6924-47]
Chen, J.F. / Liu, H.-Y. / Laidig, T. / Zuniga, C. / Cao, Y. / Socha, R. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
Design of automatic controllers for model-based OPC with optimal resist threshold determination for improving correction convergence [6924-150]
Su, Y.-S. / Ng, P.C.W. / Tsai, K.-Y. / Chen, Y.-Y. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
Immersion exposure system using high-index materials (Best Student Paper Award) [6924-89]
Sakai, K. / Iwasaki, Y. / Mori, S. / Yamada, A. / Ogusu, M. / Yamashita, K. / Nishikawara, T. / Tanaka, T. / Hasegawa, N. / Hara, S. et al. | 2008
Hyper-NA imaging of 45nm node random CH layouts using inverse lithography [6924-20]
Hendrickx, E. / Tritchkov, A. / Sakajiri, K. / Granik, Y. / Kempsell, M. / Vandenberghe, G. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
Hybrid Hopkins-Abbe method for modeling oblique angle mask effects in OPC [6924-49]
Adam, K. / Lam, M.C. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
Full chip compensation for local-flare-induced CD error using OPC/DRC method [6924-130]
Choi, J.-Y. / Shim, Y.-A. / Yun, K.-H. / Kim, J.-D. / Kim, J.-H. / Han, J.-W. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
Immersion defectivity study with volume production immersion lithography tool for 45 nm node and below [6924-43]
Nakano, K. / Nagaoka, S. / Yoshida, M. / Iriuchijima, Y. / Fujiwara, T. / Shiraishi, K. / Owa, S. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
60nm half pitch contact layer printing: exploring the limits at 1.35NA lithography [6924-119]
Bekaert, J. / Hendrickx, E. / Vandenberghe, G. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
High-n immersion lithography [6924-40]
Sewell, H. / Mulkens, J. / Graeupner, P. / McCafferty, D. / Markoya, L. / Donders, S. / Cortie, R. / Meijers, R. / Evangelista, F. / Samarakone, N. et al. | 2008
PDL oxide enabled pitch doubling [6924-12]
Shamma, N. / Chou, W.-B. / Kalinovski, I. / Schlosser, D. / Mountsier, T. / Mui, C. / Tarafdar, R. / van Schravendijk, B. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
Advanced OPC and 2D verification for tip engineering using aggressive illuminations [6924-52]
Zhang, X. / Lukanc, T. / Yang, H. / Ward, B. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
45nm and 32nm half-pitch patterning with 193nm dry lithography and double patterning [6924-72]
Dai, H. / Bencher, C. / Chen, Y. / Woo, H. / Ngai, C. / Xu, X. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008
Resolution enhancement techniques in 65 nm node nested-hole patterning [6924-164]
Lee, H. / Choi, J. / Kim, J. / Han, J.-W. / Kim, K.-Y. / Society of Photo-optical Instrumentation Engineers / International SEMATECH | 2008