Mechanical behaviour of SAC-lead free solder alloys with regard to the size effect and the crystal orientation (Englisch)
- Neue Suche nach: Villain, Jürgen
- Neue Suche nach: Müller, Wolfgang
- Neue Suche nach: Saeed, Usman
- Neue Suche nach: Weippert, Christina
- Neue Suche nach: Corradi, Ulrike
- Neue Suche nach: Svetly, Artur
- Neue Suche nach: Villain, Jürgen
- Neue Suche nach: Müller, Wolfgang
- Neue Suche nach: Saeed, Usman
- Neue Suche nach: Weippert, Christina
- Neue Suche nach: Corradi, Ulrike
- Neue Suche nach: Svetly, Artur
In:
EMPC, European Microelectronics and Packaging Conference & Exhibition, 17
;
17.S2.9/1-17.S2.9/4
;
2009
-
ISBN:
- Aufsatz (Konferenz) / Datenträger
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Titel:Mechanical behaviour of SAC-lead free solder alloys with regard to the size effect and the crystal orientation
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Beteiligte:Villain, Jürgen ( Autor:in ) / Müller, Wolfgang ( Autor:in ) / Saeed, Usman ( Autor:in ) / Weippert, Christina ( Autor:in ) / Corradi, Ulrike ( Autor:in ) / Svetly, Artur ( Autor:in )
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Erschienen in:EMPC, European Microelectronics and Packaging Conference & Exhibition, 17 ; 17.S2.9/1-17.S2.9/4
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Verlag:
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Erscheinungsdatum:2009
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Format / Umfang:4 Seiten, 9 Bilder, 2 Tabellen, 4 Quellen
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ISBN:
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Medientyp:Aufsatz (Konferenz)
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Format:Datenträger
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Sprache:Englisch
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Schlagwörter:
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Datenquelle:
Inhaltsverzeichnis Konferenzband
Die Inhaltsverzeichnisse werden automatisch erzeugt und basieren auf den im Index des TIB-Portals verfügbaren Einzelnachweisen der enthaltenen Beiträge. Die Anzeige der Inhaltsverzeichnisse kann daher unvollständig oder lückenhaft sein.
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Fracture toughness assessment of ACF flip-chip packages under high moisture condition with moire interferometryPark, Jin-Hyoung / Jang, Jae-Won / Jang, Kyung-Woon / Paik, Kyung-Wook / Lee, Soon-Bok et al. | 2009
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Temporary adhesives for wafer bonding: Deep reactive ion etching applicationBelharet, Djaffar / Dubreuil, Pascal / Colin, David / Mazenq, Laurent / Granier, Hugues et al. | 2009
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WPLGA: New package family for medium pin count with design flexibilityMagni, Pierangelo / Graziosi, Giovanni / Villa, Claudio-Maria / Tiziani, Roberto / Gacusan, Rodolfo et al. | 2009
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System packaging & integration for a swallowable capsule using a direct access sensorJesudoss, Pio / Mathewson, Alan / Wright, William / McCaffrey, Colm / Ogurtsov, Vladimir / Twomey, Karen / Stam, Frank et al. | 2009
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Long term stability of polymer based resistors tested by noise, non-linearity and electro-ultrasonic spectroscopySedlakova, Vlasta / Tofel, Pavel / Sikula, Josef et al. | 2009
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Low energy consumption thick-film pressure sensorsBelavic, Darko / Zarnik, Marina Santo / Mozek, Matej / Kocjan, Sandi / Hrovat, Marko / Holc, Janez / Jerlah, Mitja / Macek, Srecko et al. | 2009
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Electrical modeling and analysis of the impact of slits on microstrip lines in thin film polymer layersNdip, Ivan / Topper, Michael / Becker, Karl-Friedrich / Hirte, Matthias / Eidner, Ines / Fischer, Thorsten / Curran, Brian / Bauer, Jorg / Scheel, Wolfgang / Guttowski, Stephan et al. | 2009
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Nanobond® assembly – a rapid, room temperature soldering processCaswell, Greg et al. | 2009
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Packaging of silicon photonic devices: Grating structures for high efficiency coupling and a solution for standard integrationGalan, J. V. / Griol, A. / Hurtado, J. / Sanchis, P. / Preve, G. B. / Hakansson, A. / Marti, J. et al. | 2009
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Design and fabrication of corrosion and humidity sensors for performance evaluation of chip scale hermetic packages for biomedical implantable devicesSaeidi, Nooshin / Demosthenous, Andreas / Donaldson, Nick / Alderman, John et al. | 2009
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Thermal design considerations on wire-bond packagesMach, M. / Muller, J. et al. | 2009
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Kirkendall voiding in Au ball bond interconnects on Al chip metallization in the temperature range from 100 deg C - 200 deg C after optimized intermetallic coverageSchneider-Ramelow, M. / Schmitz, S. / Schuch, B. / Grübl, W. et al. | 2009
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Au-Sn SLID bonding: Fluxless bonding with high temperature stability, to above 350 deg CAasmundtveit, Knut E. / Wang, Kaiying / Hoivik, Nils / Graff, Joachim M. / Elfving, Anders et al. | 2009