TEM interfacial characteristics of thermosonic gold wire bonding on aluminium metallization (Englisch)
- Neue Suche nach: Xu, H.
- Neue Suche nach: Liu, C.
- Neue Suche nach: Silberschmidt, V.V.
- Neue Suche nach: Chen, Z.
- Neue Suche nach: Sivakumar, M.
- Neue Suche nach: Xu, H.
- Neue Suche nach: Liu, C.
- Neue Suche nach: Silberschmidt, V.V.
- Neue Suche nach: Chen, Z.
- Neue Suche nach: Sivakumar, M.
In:
EPTC, Electronics Packaging Technology Conference, 11
;
512-517
;
2009
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ISBN:
- Aufsatz (Konferenz) / Print
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Titel:TEM interfacial characteristics of thermosonic gold wire bonding on aluminium metallization
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Beteiligte:Xu, H. ( Autor:in ) / Liu, C. ( Autor:in ) / Silberschmidt, V.V. ( Autor:in ) / Chen, Z. ( Autor:in ) / Sivakumar, M. ( Autor:in )
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Erschienen in:
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Verlag:
- Neue Suche nach: IEEE Operations Center
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Erscheinungsort:Piscataway
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Erscheinungsdatum:2009
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Format / Umfang:6 Seiten, 14 Quellen
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ISBN:
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DOI:
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Medientyp:Aufsatz (Konferenz)
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Format:Print
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Sprache:Englisch
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Schlagwörter:
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Datenquelle:
Inhaltsverzeichnis Konferenzband
Die Inhaltsverzeichnisse werden automatisch erzeugt und basieren auf den im Index des TIB-Portals verfügbaren Einzelnachweisen der enthaltenen Beiträge. Die Anzeige der Inhaltsverzeichnisse kann daher unvollständig oder lückenhaft sein.
- 1
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[Front matter]| 2009
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EPTC 2009 program overview: 9th–11th December 2009| 2009
- 1
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Developments in fine pitch copper wire bonding productionChylak, Bob et al. | 2009
- 7
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An improvement method for the reliability of copper metallization processChen, Po-Ying / Wu, Po-Han / Ong, Woei Jye et al. | 2009
- 10
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Optimization of ultrasound and bond force to reduce pad stress in thermosonic Cu ball bondingShah, A. / Mayer, M. / Zhou, Y. / Persic, J. / Moon, J. T. et al. | 2009
- 16
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Cu wire bonding with Cu BSOB for SiP & stacked die application: Challenges & solutionsKumar, B. Senthil / Sivakumar, Mohandass / Wee, Chua Choon / Ming, Li / Yew, Keng / Song, James et al. | 2009
- 21
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The equivalent diameter of copper wire and gold wire based on the sweep stiffness evaluation in semiconductor packagingKung, Huang-Kuang / Chen, Hung-Shyong et al. | 2009
- 27
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Improving package assembly process yield for complex high density flip chip applicationsSolberg, Vern / Oganesian, Vage et al. | 2009
- 27
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Technical sessions| 2009
- 31
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High density indium bumping using electrodeposition enhanced by megasonic agitationTian, Yingtao / Liu, Changqing / Hutt, David / Stevens, Bob / Flynn, David / Desmulliez, Marc P.Y. et al. | 2009
- 36
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Improving reliability of lateral thermosonic flip-chip bonding with ACFHa, Chang-Wan / Kim, Kyung-Soo et al. | 2009
- 40
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Warpage improvement for large die flip chip packageXiong, Bingshou / Lee, Myung-June / Kao, Thomas et al. | 2009
- 44
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Assembly of large dies fine pitch Cu/low-k FCBGA package with through silicon via (TSV) interposerWai, Leong Ching / Zhang, Xiaowu / Chai, T C / Srinivas, Vempati Rao / Ho, David / Pinjala, D. / Myo, Eipa / Jong, M C / Lim, Sharon / Ong, Joe et al. | 2009
- 49
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Abstract listings| 2009
- 49
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Shock resistant and thermally reliable low Ag SAC solders doped with Mn Or CeLiu, Weiping / Lee, Ning-Cheng / Porras, Adriana / Ding, Min / Gallagher, Anthony / Huang, Austin / Chen, Scott / Lee, Jeffrey ChangBing et al. | 2009
- 64
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Experimental studies of the temperature dependence of mechanical solder material properties using nanoindentationMuller, Wolfgang H. / Worrack, Holger et al. | 2009
- 70
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X-ray computed tomography on miniaturized solder joints for nano packagingOppermann, Martin / Zerna, Thomas / Wolter, Klaus-Jurgen et al. | 2009
- 76
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Lead-free flux technology and influence on cleaningLee, Ning-Cheng et al. | 2009
- 82
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BGA lead-free C5 solder system improvement by Germanium addition to Sn3.5Ag and Sn-3.8Ag-0.7Cu solder alloyLeng, Eu Poh / Ling, Wong Tzu / Amin, Nowshad / Ahmad, Ibrahim / Han, Tay Yee / Chiao, Chin Wen / Haseeb, A.S.M.A. et al. | 2009
- 92
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Application of the latency insertion method to circuits with blackbox macromodel representationSchutt-Aine, Jose / Klokotov, Dmitri / Goh, Patrick / Tan, Jilin / Al-Hawari, Feras / Liu, Ping / Dai, Wenliang et al. | 2009
- 96
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Method for system-level signal and power integrity modeling of high-speed electronic packagesLiu, En-Xiao / Wei, Xingchang / OO, Zaw Zaw / Zhang, Yao-Jiang / Zhang, Wenzu / Li, Er-Ping et al. | 2009
- 102
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Designing a high speed system with amplitude and phase noise reduction effectsSong, Ki-Jae / Kim, Jongmin / Woo, Ki-Ryong / Park, Ilwon / Nah, Wansoo / Song, Young-Hee et al. | 2009
- 107
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Investigation to effectiveness of design factors for FPGA package PDN networksLee, Wai Ling / Low, Hoon Ngik / Shi, Hong et al. | 2009
- 113
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Author index| 2009
- 113
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An optimization system with parallel processing for reducing electromagnetic interference on electronic control unitOkazaki, Yuji / Uno, Takanori / Asai, Hideki et al. | 2009
- 119
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Direct liquid thermal management of 3D chip stacksBar-Cohen, A. / Geisler, K. J. L. / Rahim, E. et al. | 2009
- 123
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Affiliation index| 2009
- 131
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Compact thermal modeling of hot spots in advanced 3D-stacked ICsTorregiani, C. / Oprins, H. / Vandevelde, B. / Beyne, E. / De Wolf, I. et al. | 2009
- 137
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Thermal modeling and characterization of the embedded micro wafer level package (EMWLP) at the package- and system-levelHoe, Yen Yi Germaine / Gongyue, Tang / Sharma, Gaurav / Pinjala, Damaragunath / Rao, Vempati Srinivasa / Chinq, Jong Ming / Siang, Sharon Lim Pei / Kumar, Aditya / Wee, Ho Soon / Xiaowu, Zhang et al. | 2009
- 146
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Analysis and modeling of liquid cooled heat sinks with alternating honeycomb structureZhang, H.Y. / Mui, Y.C. / Tarin, Michael et al. | 2009
- 153
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Detection of degradation in die-attach materials by in-situ monitoring of thermal propertiesWittler, Olaf / Nejadari, Ali Mazloum / Michel, Bernd et al. | 2009
- 158
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The effect of driving waveforms on droplet formation in a piezoelectric inkjet nozzleShin, Pyungho / Sung, Jaeyong et al. | 2009
- 163
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Optimizing manufacturing process of printed electronicsSalam, B. / Gan, H.Y. / Lok, B.K / Albert, L C W et al. | 2009
- 168
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Fabrication techniques for an arrayed EIS biosensorTaing, Meng / Sweatman, Denis et al. | 2009
- 174
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Spatially selective patterning of zinc oxide precursor solution by inkjet printingLiang, Yen Nan / Lok, Boon Keng / Hu, Xiao et al. | 2009
- 180
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Design of a fully-enclosed disposable bio-micro fluidic cartridge with self-contained reagents for infectious diseases diagnostic applicationsXie, Ling / Chew, Michelle / Premachandran, C.S. / Zhang, Li / Rafei, Siti R.M. / Ji, Hong Miao / Rajoo, Ranjan / Tang, Kum Cheong / Chen, Yu / Teo, Keng Hwa et al. | 2009
- 185
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Development of thin film dielectric embedded 3D stacked packageHo, Soon Wee / Su, Nandar / Lim, Li Shiah / Ong, Siong Chiew / Lee, Wen Sheng / Rao, Vempati Srinivasa et al. | 2009
- 191
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Structure and process development of wafer level embedded SiP (System in Package) for mobile applicationsJung, Gi-Jo / Jeon, Byoung-Yool / Kang, In-Soo et al. | 2009
- 197
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Low temperature dielectric material for embedded micro wafer level packagingSu, Nandar / Rao, Vempati Srinivas / Wee, Ho Soon / Sharma, Gaurav / Ying, Lim Ying / Kumar, Aditya / Damaruganath, Pinjala et al. | 2009
- 202
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Challenges for extra large embedded wafer level ball grid array developmentLuan, Jing-en / Jin, Yonggang / Goh, Kim-yong / Ma, Yiyi / Hu, Guojun / Huang, Yaohuang / Baraton, Xavier et al. | 2009
- 208
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Characterization of DAF tape for embedded micro wafer level packagingPei-Siang, Sharon Lim / Sharma, Gaurav / Kumar, Aditya / Rao, Vempati Srinivasa / Sheng, Vincent Lee Wen et al. | 2009
- 215
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Dynamic visualizations of flow and meniscus for quadrilateral bump arrangement in capillary underfill processLee, Seok Hwan / Sung, Jaeyong et al. | 2009
- 220
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Bonding head design for thin waferLee, Changwoo / Lee, Jaehak / Ha, Tae Ho / Song, Junyeob et al. | 2009
- 225
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Minimization of tin whisker growth for ultra-low tin whisker applicationsSchetty, Rob / Sepp, William et al. | 2009
- 235
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Robust flexible high performance UHF RFID tag antennaAmin, Yasar / Hallstedt, Julius / Prokkola, Satu / Tenhunen, Hannu / Zheng, Li-Rong et al. | 2009
- 240
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A new package for textile integrated RFID tagsVieroth, Rene / Kallmayer, Christine / Aschenbrenner, Rolf / Reichl, Herbert et al. | 2009
- 244
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Development of high speed board level bend tester for drop impact applicationsLim, Shu Min / Chen, Zhong / Ng, Hun Shen / Tee, Tong Yan / Khoo, Choong Peng / Chng, Vincent / Liu, Fu Lin / Tsai, Kuo Tsing et al. | 2009
- 249
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Board level reliability of mixed solder interconnectsSriyarunya, Anocha / Tondtan, Jiraporn / Kittidecha, Witoon / Tukiman, Hasmani et al. | 2009
- 254
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The effect of leadframe finishing towards package delaminationFong, Lim et al. | 2009
- 260
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Integrated modelling for simulation in the electronics manufacturing domainQuintero, Lina A. M. Huertas / West, Andrew A. / Velandia, Diana M. Segura / Conway, Paul P. / Whalley, D. C. et al. | 2009
- 267
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Diamond bit cutting for processing high topography wafersAgarwal, R. / Pham, N. / Cotrin, R. / Andrei, A. / Ruythooren, W. / Iker, F. / Soussan, P. et al. | 2009
- 272
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Effect of strain rate and temperature on tensile flow behavior of SnAgCu nanocomposite soldersRao, B.S.S. Chandra / Kumar, K. Mohan / Zeng, K.Y. / Tay, A.A.O. / Kripesh, V. et al. | 2009
- 278
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Electrodeposition of Sn-Ag-Cu solder alloy for electronics interconnectionQin, Yi / Liu, Changqing / Wilcox, G.D. / Zhao, Kun / Wang, Changhai et al. | 2009
- 283
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Rate-dependent properties of Sn-Ag-Cu based lead free solder jointsSu, Yong'An / Tan, Long Bin / Tan, Vincent B.C. / Tee, Tong Yan et al. | 2009
- 292
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Effect of Ni-coated carbon nanotubes on interfacial intermetallic layer growthHan, Y.D. / Jing, H.Y. / Nai, S.M.L. / Xu, L.Y. / Tan, C.M. / Wei, J. et al. | 2009
- 296
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Fracture behavior of 96.5Sn3.0Ag0.5Cu solder joint under mixed-mode tensile and shear loading conditionsTan, Kok Ee / Pang, John H.L. et al. | 2009
- 301
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Performance characterization of flexible printed supercapacitorsGan, Hiong Yap / Chua, Cheng Hwee / Chan, Soon Mei / Lok, Boon Keng et al. | 2009
- 305
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Evaluation of ENEPIG substrate for handheld product applicationNg, Wayne Chee Weng / Marbella, Baterna Carlo / Koh, Ian Liang Kng et al. | 2009
- 311
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2-Metal-layer interposer for high-speed devicesHui, Chong Chin et al. | 2009
- 317
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Polysilicon interconnections (FEOL): Fabrication and characterizationAgarwal, Ajay / Murthy, Ramana B / Lee, Vincent / Viswanadam, Gautham et al. | 2009
- 321
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Effects of fine size lead-free solder ball on the interfacial reactions and joint reliabilityPark, Yong-Sung / Kwon, Yong-Min / Moon, Jeong-Tak / Lee, Young-Woo / Lee, Jae-Hong / Paik, Kyung-Wook et al. | 2009
- 325
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Cross-interaction effect in the Ni/Sn/Cu solder jointsTseng, H. W. / Wang, S. J. / Liu, C. Y. et al. | 2009
- 331
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Effect of intermetallic stabilization on the impact resistance of joints to BGA packagesSweatman, Keith / Suenaga, Shoichi / Miyaoka, M. / Nozu, Takashi / Nogita, Kazuhiro / Nishimura, Tetsuro et al. | 2009
- 336
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Effect of bonding and aging temperatures on bond strengths of Cu with 75Sn25In soldersSasangka, W.A. / Gan, C.L. / Thompson, C.V. / Choi, W.K. / Wei, J. et al. | 2009
- 342
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Effect of postcure and thermal aging on molding compound propertiesde Vreugd, J. / Monforte, A. Sanchez / Jansen, K.M.B. / Ernst, L.J. / Bohm, C. / Kessler, A. / Preu, H. et al. | 2009
- 348
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Preparation and properties of epoxy resin/silicone hybrids for electronic applicationsLee, Seon Suk / Song, G. S. / Lee, D. W. / Kim, H. N. / Kang, K. H. / Lee, Dai Soo et al. | 2009
- 352
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Mold process development of C90 LowK and ultra-finepitch BGA for robust reliability performanceIbrahim, Ruzaini / Low, Boon-Yew / Poh, Zi-Song et al. | 2009
- 357
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How to fabricate specimens for silicon-to-molding compound interface adhesion measurementsSchlottig, Gerd / Pape, Heinz / Xiao, An / Wunderle, Bernhard / Ernst, Leo et al. | 2009
- 363
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Reliability of Cu wire bonding on active area for automotive applicationsThomas, Sven / Reynoso, Dexter et al. | 2009
- 369
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Achieving high workability in high-end package by controlling microstructure of 4N Cu wireKim, S.H. / Park, J.W. / Kim, N.K. / Park, H.W. / Moon, J.T. et al. | 2009
- 374
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Factors affecting the long term stability of Cu / Al ball bonds subjected to standard and extended HTSVath, Charles J. / Gunasekaran, M. / Malliah, Ramkumar et al. | 2009
- 381
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Research on strength descent of wire bonding in the packingDezheng, Zhang / Shengxiang, Bao / Lili, Ma / Dechun, Lv et al. | 2009
- 384
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Shape effect of passivation opening on the electric behavior in flip-chip SnAg solder joints under electromigrationPeng, Hsin-Ying / Chen, Chih et al. | 2009
- 389
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Electrochemical migration study of fine pitch lead free micro bump interconnectYu, Da-Quan / Chai, Tai Chong / Thew, Meei Ling / Ong, Yue Ying et al. | 2009
- 395
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Evaluating the effects of electromigration by using adjustable solder joints of concave shapeJaeschke, Johannes / Kleff, Jessica / Muller, Wolfgang H. / Nissen, Nils F. / Reichl, Herbert et al. | 2009
- 401
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Electromigration-induced failures at Cu/Sn/Cu flip-chip joint interfacesTseng, H. W. / Lu, C. T. / Hsiao, Y. H. / Liao, P. L. / Chuang, Y. C. / Liu, C. Y. et al. | 2009
- 406
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Reliability consequences of the chip-package interactionsvan Driel, W.D. et al. | 2009
- 412
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Temporary bonding for Chips In Wafer processingSouriau, Jean-Charles / Jouve, Amandine / Sillon, Nicolas et al. | 2009
- 416
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Dynamic analysis of structure of a piezoelectric MEMS micro-mirror actuator: Effects of chip anisotropy and residual stressMatin, A. / Akai, D. / Ozaki, K. / Kawazu, N. / Hanebuchi, M. / Sawada, K. / Ishida, M. et al. | 2009
- 422
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Investigation of wall-slip behavior in lead-free solder pastes and isotropic conductive adhesivesDurairaj, R. / Man, Lam Wai / Ramesh, S. / Wea, Lim Chia / Ekere, N.N. / Mallik, S. / Seman, A. et al. | 2009
- 427
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3D device integrationBauer, Charles E. / Neuhaus, Herbert J. et al. | 2009
- 431
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TSV interposer fabrication for 3D IC packagingRao, Vempati Srinivasa / Wee, Ho Soon / Vincent, Lee Wen Sheng / Yu, Li Hong / Ebin, Liao / Nagarajan, Ranganathan / Chong, Chai Tai / Zhang, Xiaowu / Damaruganath, Pinjala et al. | 2009
- 438
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Inspection of through silicon vias (TSV) and other interconnections in IC packages by computed tomographyRoth, Holger / He, Zhenhui / Mayer, Thomas et al. | 2009
- 442
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Bottom-up filling of Through Silicon Via (TSV) with Parylene as sidewall protection layerMiao, Min / Zhu, Yunhui / Ji, Ming / Ma, Shenglin / Sun, Xin / Jin, Yufeng et al. | 2009
- 447
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Alignment and overlay characterization for 3D integration and advanced packagingvan Zeijl, H. W. / Sarro, P.M. et al. | 2009
- 452
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Assembly and reliability of micro-bumped chips with Through-silicon Vias (TSV) interposerOng, Yue Ying / Chai, Tai Chong / Yu, Daquan / Thew, Meei Leng / Myo, Eipa / Wai, Leong Ching / Jong, Ming Chinq / Rao, Vempati Srinivasa / Su, Nandar / Zhang, Xiaowu et al. | 2009
- 459
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Lowest cost of ownership for chip to wafer bonding with the advanced chip to wafer bonding process flowSigl, A. / Glinsner, T. / Pichler, C. / Scheiring, C. / Kettner, P. et al. | 2009
- 464
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Thin die stacking by low temperature In/ Au IMC based bonding methodOng, Siong Chiew / Choi, Won Kyoung / Premachandran, C. S. / Liao, Ebin / Xie, Ling et al. | 2009
- 469
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Fine pitch copper wire bonding — Why now?Appelt, Bernd K. / Tseng, Andy / Lai, Yi-Shao et al. | 2009
- 473
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Plasma cleaning on bond pad surfaces for gold wire bondingLi, Wu-Hu / Reingruber, Klaus / Mais, Norbert / Acuesta, Albert / Yape, Christian Alde et al. | 2009
- 479
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Ultra-fine-wire applications and challenges in 30um processTok, C.W / Effie, Chew et al. | 2009
- 486
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2N Au wire bonding for ultra fine picth BGALeng, Eu Poh / Yong, C.C. / Siong, Chin Teck / Masahiro, Tsuriya / Vo, Nick / Seong, Lee Boon / Faizal, Zul-Kifli Mohd / Sazilawati, Fadzli et al. | 2009
- 494
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Understanding materials compatibility issues in electronics packagingPaulasto-Krockel, M. / Laurila, T. / Vuorinen, V. et al. | 2009
- 500
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Adsorbed contamination on ceramic surfaces stored in industrial ambient conditions and its effect on epoxy bleedWilliams, O. / Liu, C. / Webb, D.P. / Firth, P. et al. | 2009
- 506
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Next generation materials for thermal interface and high density energy storage applications via liquid phase sinteringLiu, J. / Rottman, P. / Dutta, S. / Kumar, P. / Raj, R. / Renavikar, M. / Dutta, I. et al. | 2009
- 512
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TEM interfacial characteristics of thermosonic gold wire bonding on aluminium metallizationXu, H. / Liu, C. / Silberschmidt, V. V. / Chen, Z. / Sivakumar, M. et al. | 2009
- 518
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Millimeter wave dielectric characterization & demonstration of High-Q passives using a low loss thin film materialYing, Lim Ying / Su, Nandar / Wee, David Ho Soon / Thaw, Phyo Phyo / Wang, Orson / Kuriyama, Hijiri / Yokotsuka, Shun / Shirashi, Kenichi et al. | 2009
- 524
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EMI reducing solution by modify EBG structure for stacked packagingChang, Feng-Cheng / Cheng, Kuan-Wen / Wu, Sung-Mao et al. | 2009
- 528
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Development and characterisation of high electrical performances TSV for 3D applicationsHenry, D. / Cheramy, S. / Charbonnier, J. / Chausse, P. / Neyret, M. / Garnier, G. / Brunet-Manquat, C. / Verrun, S. / Sillon, N. / Bonnot, L. et al. | 2009
- 536
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High frequency characterization of through silicon via structureMong, Khoo Yee / Kee, Chua Eng / Guan, Lim Teck / Enxiao, Liu et al. | 2009
- 541
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Effect of split power/ground planes using stitching capacitors on radiated emissionLee, Jang-Hoon / Lee, Pil-Soo / Lee, Tae-Heon / Kim, ChangGyun / Song, In-Chae / Wee, Jae-Kyung et al. | 2009
- 546
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Study of electromagnetic interference analysis and solution for PoP packagingKuo, Chin-Ting / Wu, Sung-Mao et al. | 2009
- 550
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Gluing as an alternative to solder flexible batteries for its use in system-in-a-package: Preliminary resultsAguilera, N.B. Palacios / Mollinger, J.R. / Bastemeijer, J. / Zhou, J. / French, P.J. / Bossche, A. et al. | 2009
- 556
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Experimental methods in monitoring voids formation during flip chip underfill cure processSeng, Foong Chee / Xian, Tee Swee / Ling, Wong Tzu et al. | 2009
- 562
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Intermetallics formation and evolution in pure indium joint for cryogenic applicationCheng, X. / Liu, C. / Silberschmidt, V.V. et al. | 2009
- 567
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Amorphous metallic thin films as copper diffusion barrier for advanced interconnect applicationsYan, H. / Tay, Y. Y. / Liang, M. H. / Chen, Z. / Ng, C. M. / Pan, J. S. / Xu, H. / Liu, C. / Silberschmidt, V. V. et al. | 2009
- 573
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Effect of process parameters on pad damage during Au and Cu ball bonding processesQin, I. / Shah, A. / Huynh, C. / Meyer, M. / Mayer, M. / Zhou, Y. et al. | 2009
- 579
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Novel bumping material for stacking silicon chipsChoi, Kwang-Seong / Sung, Ki-Jun / Lim, Byeong-Ok / Bae, Hyun-Cheol / Jung, Sunghae / Moon, Jong Tae / Eom, Yong Sung et al. | 2009
- 584
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Analysis of interfacial delamination in IC packaging: Use stress or fracture mechanics?Guojun, Hu / Jing-en, Luan / Baraton, Xavier / Tay, Andrew A. O. et al. | 2009
- 591
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Sub-modeling technique for thermo-mechanical simulation of solder microbumps assembly in 3D chip stackingKhong, Chee Houe / Yu, Aibin / Zhang, Xiaowu / Kripesh, V. / Pinjala, D. / Kwong, Dim-Lee / Chen, Scott / Chan, Chien-Feng / Chao, Chun-Chieh / Chiu, Chi-Hsin et al. | 2009
- 596
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Crack and damage evaluation in low-k BEoL structures under CPI aspectsAuersperg, J. / Vogel, D. / Lehr, M. U. / Grillberger, M. / Michel, B. et al. | 2009
- 600
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Numerical and experimental investigation of board level reliability of TEFCBGAMa, Y.Y. / Lenzi, M. / Loo, K.W. / Ho, P.S. / Luan, J.E. / Baraton, X. et al. | 2009
- 607
-
Finite element simulation of inkjet printed strain gauge on polyimide substrates applied to flexible boardsSilva, Edson R. / Oliveira, W.C. / Arruda, L.O. / Bonadiman, R. / Quintero, J. / Mancosu, R. / Neto, J. et al. | 2009
- 607
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Finite Element simulation of inkjet printed strain gage on polyimide substrates applied to flexible boardsSilva, Edson R. / Oliveira, W. C. / Arruda, L.O. / Bonadiman, R / Quintero, J. / Mancosu, R. / Neto, J. M. Silva / Silva, Edson et al. | 2009
- 612
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Modelling stress in silicon with TSVs and its effect on mobilitySelvanayagam, C. S. / Zhang, Xiaowu / Rajoo, R. / Pinjala, D. et al. | 2009
- 619
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Feasibility study of nanofluid cooling techniques for microelectronic systemsZhang, Hengyun / Tay, Andrew A. O. / Xue, Zhengjun et al. | 2009
- 626
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Microchannel water cooling for LTCC based microsystemsZhang, Yang-Fei / Chen, Jia-Qi / Bai, Shu-Lin / Jin, Yu-Feng / Miao, Min / Zhang, Jing et al. | 2009
- 630
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Performance analysis of a synthetic jet-microchannel hybrid heat sink for electronic coolingChandratilleke, T T / Jagannatha, D / Narayanaswamy, R et al. | 2009
- 636
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Molecular dynamics study of the chiral vector influence on thermal conductivity of carbon nanotubesFalat, Tomasz / Platek, Bartosz / Felba, Jan et al. | 2009
- 640
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Thermal performance of PCM-cooled mobile phoneTan, F.L. / Shen, W. / Fok, S.C. et al. | 2009
- 646
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Thermal resistance (Rth) enhancement by optimizing to package thermal contactSim, Lee Teck / Le, Darakorn Sae et al. | 2009
- 652
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Whole-field board strain and displacement characterization during drop impact using a single camera DIC techniqueDe Lim, Fabian Zhi / Tan, Long Bin / Quan, Chenggen / Tee, Tong Yan et al. | 2009
- 656
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Drop impact life model development for FBGA assembly with lead-free solder jointChe, Faxing / Luan, Jing-En / Goh, Kim Yong / Baraton, Xavier et al. | 2009
- 663
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Prediction of drop impact reliability of BGA solder joints on FPCHuang, Jianlin / Chen, Quayle / Xu, Leon / Zhang, G. Q. et al. | 2009
- 668
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Study of drop-performance improved lead-free solder by PCB pad finishLee, Y.W / Lee, J.H / Moon, J.T. / Park, Y.S / Paik, K.W et al. | 2009
- 673
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Improvement of drop shock and TC reliability for large die Wafer Level Packages in mobile applicationLee, Jun-Kyu / Park, Yun-Mook / Kang, In-Soo / Kwon, Yong-Min / Paik, Kyung-Wook et al. | 2009
- 679
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Tensile properties and drop/shock reliability of Sn-Ag-Cu-In based solder alloysYu, A-Mi / Kim, Jun-Ki / Lee, Jong-Hyun / Kim, Mok-Soon et al. | 2009
- 683
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Effect of electromagnetic band-gap depredation by plating through hold in packaging applicationChuang, Yung-Hsiang / Wu, Sung-Mao et al. | 2009
- 687
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Analysis of power/ground noise effect on performance degradation of analog-to-digital converterAhn, Woojin / Shim, Jongjoo / Cho, Jeonghyeon / Shin, Minchul / Koo, Kyoungchoul / Kim, Joungho et al. | 2009
- 692
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Electromagnetic interference suppression and simultaneous switching noise mitigation in system on package using a lowpass filter structure with embedded capacitorLi, Lei / Wang, Yunfeng / Wan, Lixi / Liu, Xiaoli / Sun, Rong / Yu, Shuhui et al. | 2009
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Decoupled victim model for the analysis of crosstalk noise between on-chip coupled interconnectsPalit, Ajoy K. / Hasan, Shehzad / Anheier, Walter et al. | 2009
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Modeling and analysis of coupling between TSVs, metal, and RDL interconnects in TSV-based 3D IC with silicon interposerYoon, Kihyun / Kim, Gawon / Lee, Woojin / Song, Taigon / Lee, Junho / Lee, Hyungdong / Park, Kunwoo / Kim, Joungho et al. | 2009
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Modeling and analysis of die-to-die vertical coupling in 3-D ICLee, Sangrok / Kim, Gawon / Kim, Jaemin / Song, Taigon / Lee, Junho / Lee, Hyungdong / Park, Kunwoo / Kim, Joungho et al. | 2009
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Modeling solder joint fatigue in combined environmental reliability tests with concurrent vibration and thermal cyclingEckert, Tilman / Muller, Wolfgang H. / Nissen, Nils F. / Reichl, Herbert et al. | 2009
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Interface reaction of Pb-free Sn-3.5Ag solder with Ni-Sn-P metallizationYang, Y. / Teh, P. F. / Sumboja, A. / Chen, Z. et al. | 2009
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The effect of Ni,Ge elements on microstructure and mechanical properties of Sn-Ag-Cu soldersShimoda, Masayoshi / Hidaka, Noboru / Yamashita, Mitsuo / Sakaue, Kenichi / Ogawa, Takeshi et al. | 2009
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Damage mechanics of solder/IMC interface fracture in Pb-free solder interconnectsBo, Lai Zheng / Keat, Loh Wei / Tamin, Mohd Nasir et al. | 2009
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Adhesive bonding of polymeric microfluidic devicesGoh, C.S. / Tan, S.C. / May, K. T. / Chan, C.Z. / Ng, S.H. et al. | 2009
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Stacked wire interconnect technology — Cu wire on Au bump bonding methodologySan, Lim Swee / Krishna, Venkata / Fei, Cheong Choke et al. | 2009
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A novel approach to die attach: Magnetic rollers with substrate thickness detection capabilityVittal, R. / Vemal, R. et al. | 2009
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Wafer Backside CoatingTM of electrically conductive die attach adhesives for small IC packagingLing, Law Wai / Erfe, Eric / Vaquilar, Aldrin / Khor, Lily / Thong, K C / Yong, Nicole / Nam, Ng Peng / Winster, Tony / Hong, Xuan / Israel, Jonathan et al. | 2009
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Effect of transfer pressure on die attach film void performanceSu, Yeqing / Bai, Denis / Huang, Vitto / Chen, Weimin / Xian, Tee Swee et al. | 2009
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Soft solder die attach in small outline discrete packages for both reliability and cost breakthroughAmiruddin, Mohd Syahril / Tan, C E / Dhanapalan, P. et al. | 2009
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Assembly challenges for low modulus die attach material for MEMS devicesLo, Calvin / Yoke, Ong Kar / Yong, C.C. / Seong, Lee Boon et al. | 2009
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Influence of plasma cleaning on silicon die back adhesion performanceSu, Yeqing / Wei, Xiao / Hu, Cindy / Jiang, Y. W. / Zi-Song, Poh et al. | 2009
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Mid-process through silicon vias technology using tungsten metallization: Process optimazation and electrical resultsPares, G. / Minoret, S. / Lugand, J F. / Huet, S. / Lapras, V. / Anciant, R. / Henry, D. / Sillon, N. / Dunne, B. et al. | 2009
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Effect of TSV interposer on the thermal performance of FCBGA packageHoe, Yen Yi Germaine / Yue, Tang Gong / Damaruganath, Pinjala / Chong, Chai Tai / Lau, John H. / Xiaowu, Zhang / Vaidyanathan, Kripesh et al. | 2009
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Thin wafer handling and processing-results achieved and upcoming tasks in the field of 3D and TSVKettner, Paul / Burggraf, Jurgen / Kim, Bioh et al. | 2009
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Polymer filling of medium density through silicon via for 3D-packagingChausse, P. / Bouchoucha, M. / Henry, D. / Sillon, N. / Chapelon, L.L. et al. | 2009
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3D integration of image sensor SiP using TSV silicon interposerWolf, M. Juergen / Zoschke, K. / Klumpp, A. / Wieland, R. / Klein, M. / Nebrich, L. / Heinig, A. / Limansyah, I. / Weber, W. / Ehrmann, O. et al. | 2009
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Prediction of hotspots on 3D packages due to joule heating in Through Silicon Vias (TSV)Tan, S.P. / Zhang, X.W. / Pinjala, D. et al. | 2009
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Non-destructive electrical measurement of interconnect degradation in early states by the use of RF signalsKruger, Michael / Eckert, Tilman / Nissen, Nils F. / Reichl, Herbert et al. | 2009
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Reliability based design optimization for fine pitch ball grid array: Modeling construction and DOE analysisXue, Ke / Wu, Jingshen / Chen, Haibin / Gai, Jingbo / Lam, Angus et al. | 2009
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Optimal design of passivation/UBM openings for reducing current crowding effect under electromigration of flip-chip solder jointChang, Y. W. / Chen, Chih et al. | 2009
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Reliability testing of TIM materials with thermal transient measurementsVass-Varnai, Andras / Sarkany, Zoltan / Rencz, Marta et al. | 2009
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Ball impact response based on modeling techniquesShinohara, Kazunori / Yu, Qiang / Fujita, Masato / Ishii, Hideaki / Ishikawa, Hisao et al. | 2009
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Semiconductor final test fixture design with microstructure alloy contacts using Finite Element AnalysisLam, Z.Y. / Koay, H.W. / Amin, N. et al. | 2009
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Reliability evaluation of fatigue life for solder joints in chip components considering shape dispersionNishimura, Yuji / Yu, Qiang / Maruoka, Toshiaki et al. | 2009
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Laser grooving characterization for dicing defects reduction and its challengesShi, Koh Wen / Beng, Lau Teck / Yow, K.Y. et al. | 2009
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Reliability study of low cost alternative Ag bonding wire with various bond pad materialsYoo, Kyung-Ah / Uhm, Chul / Kwon, Tae-Jin / Cho, Jong-Soo / Moon, Jeong-Tak et al. | 2009
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Plastic circuit reliability and design for recyclingThiel, David V. / Neeli, Madhusudanrao / Raj, Sundra et al. | 2009
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Investigation of lead-free BGA solder joint reliability under 4-point bending using PWB strain-rate analysisSong, Fubin / Newman, Keith / Yang, Chaoran / Lee, S. W. Ricky et al. | 2009
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Study of the rheological behaviours of Sn-Ag-Cu solder pastes and their correlation with printing performanceMallik, S. / Thieme, J. / Bauer, R. / Ekere, N. N. / Seman, A. / Bhatti, R. / Durairaj, R. et al. | 2009
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Effect of cooling rate on Ag3Sn formation in Sn-Ag based lead-free solderLee, Hwa-Teng / Chen, Yin-Fa / Hong, Ting-Fu / Shih, Ku-Ta et al. | 2009
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Properties of conductive microstructures containing nano sized silver particlesFelba, Jan / Nitsch, Karol / Piasecki, Tomasz / Tesarski, Sebastian / Moscicki, Andrzej / Kinart, Andrzej / Bonfert, Detlef / Bock, Karlheinz et al. | 2009
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Development of negative profile of dry film resist for metal lift off processChew, Michelle / Ho, Soon Wee / Su, Nandar / Liao, Ebin / Rao, Vempati Srinivas / Premachandran, C S / Kumar, Rakesh / Damaruganath, Pinjala et al. | 2009
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Wafer dicing process optimization and characterization for C90 low-k wafer technologyShi, Koh Wen / Yow, K.Y. / Rachel, Khoo / Calvin, Lo et al. | 2009
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Stretchable electronic systems: Realization and applicationsLoher, Thomas / Seckel, Manuel / Vieroth, Rene / Dils, Christian / Kallmayer, Christine / Ostmann, Andreas / Aschenbrenner, Rolf / Reichl, Herbert et al. | 2009
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Inductors from wafer-level package process for high performance RF applicationsGuruprasad, Badakere / Lin, Yaojian / Chelvam, M. Pandi / Yoon, Seung Wook / Liu, Kai / Frye, Robert C. et al. | 2009
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Encapsulation challenges for wafer level packagingTh, Eric Kuah / Hao, J Y / Ding, J P / Li, Q F / Chan, W L / Ho, S C / Huang, H M / Jiang, Y J et al. | 2009
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Ultra thinning of wafer for embedded wafer packagingVincent, Lee Wen Sheng / Navas Khan, Johnson Kek / Chua, H S / Tsutsumi, Yoshihiro / Yew, L C / Wee, Ho Soon / Eipa, Myo / Vempati, Srinivas / Kripesh, V. / Sundaram, Venky et al. | 2009
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3D eWLB (embedded wafer level BGA) technology for 3D-packaging/3D-SiP (Systems-in-Package) applicationsYoon, Seung Wook / Bahr, A. / Baraton, X. / Marimuthu, Pandi Chelvam / Carson, Flynn et al. | 2009
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Laser micromachining of polycrystalline alumina and aluminium nitride to enable compact optoelectronic interconnectsWilliams, Owain / Williams, Martin / Liu, Changqing / Webb, Patrick / Firth, Paul et al. | 2009
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Optimization of flexible substrate for automotive LED rear-lampKim, Young-Woo / Kim, Min-Sung / Park, Sung-Mo / Kim, Jae-Pil / Song, Sang-Bin / Whang, Nam / Lim, Yeong-Seog et al. | 2009
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Photonic System-in-Package technologies using thin glass substratesBrusberg, Lars / Schroder, Henning / Topper, Michael / Reichl, Herbert et al. | 2009
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Polymer optical waveguide fabrication using laser ablationZakariyah, Shefiu S. / Conway, Paul P. / Hutt, David A. / Selviah, David R. / Wang, Kai / Baghsiahi, Hadi / Rygate, Jeremy / Calver, Jonathan / Kandulski, Witold et al. | 2009
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Analysis on interfacial failures of ultra-fine pitch wire with low inter-metallic coverageShin, Ji-Won / Song, Min-Suk / Park, Yong-Sung / Kwon, Yong-Min / Moon, Jeong-Tak / Cho, Jong-Soo / Yoo, Kyung-Ah / Byun, Kwan-Yoo / Joh, Cheol-Ho / Do, Eun-Hye et al. | 2009
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Thin films interfacial adhesion characterization by Cross-Sectional Nanoindentation: Application to pad structuresGallois-Garreignot, S. / Chave, F. / Gonchond, J.P. / Gautheron, B. / Fiori, V. / Nelias, D. et al. | 2009
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Interfacial reaction and dissolution behavior of Cu substrate in molten Sn-3.8Ag-0.7Cu-nano Mo composite solderArafat, M.M. / Haseeb, A.S.M.A. et al. | 2009
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A numerical study of 3D interfacial delamination in PQFP packagesHo, Siow Ling / Tay, Andrew A. O. et al. | 2009
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Assessment of thinned Si wafer warpage in 3D stacked wafersKim, Youngrae / Kang, Sung-Geun / Kim, Eun-kyung et al. | 2009
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Analysis of coupled simultaneous switching noise induced from power delivery network in adjacent switching circuitKim, Jongmin / Song, Ki-Jae / Yoo, Jongwoon / Nah, Wansoo et al. | 2009
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Fabrication of fully embedded board-level optical interconnects and optoelectronic printed circuit boardsChang, C.C. / Chang, C.J. / Lau, John H. / Chang, Al / Tang, Tom / Chiang, Steve / Lee, Maurice / Tseng, T. J. / Wei, Tan Chee / Shiah, Lim Li et al. | 2009
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In-depth characterization of die attach adhesive for low-k automotive device applicationHoon, Khoo Ly / Kheng, Au Yin et al. | 2009
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Versatility and flexibility from low outgassing siliconesRiegler, Bill / Velderrain, Michelle / Lim, T.Y. et al. | 2009
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Effect of reflow profile and thermal cycle ageing on the intermetallic formation and growth in lead-free solderingBernasko, P.K. / Mallik, S. / Ekere, N.N. / Seman, A. / Takyi, G. et al. | 2009
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A study on the thermal deformation and the mechanical properties due to curing process of the encapsulation resinSato, Hiroyuki / Yu, Qiang et al. | 2009
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Application of GR&R for productivity improvementLow, S.M. / Lee, S.Y. / Yong, W.K. et al. | 2009
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Electro-mechanical evaluation of Ag trace patterns by ink-jet printingQuintero, J. A. / Mancosu, R. D. / de Oliveira, A. W. C. / Rolim, D. C. / da Silva, O. C. / Silva, J. M. et al. | 2009