Seite 1 von 31.045 Ergebnissen

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  1.  

    Robust PPC and DFM methodology for exposure tool variations

    Kotani, T. / Nakajima, F. / Mashita, H. et al. | Tema Archiv | 2008
  2.  

    An approach for nanometer trench and hole formation

    Wang, Zhongyan / Sun, Ming / Peng, Xilin et al. | Tema Archiv | 2008
  3.  

    Double patterning down to k1=0.15 with bilayer resist

    Noelscher, C. / Jauzion-Graverolle, F. / Heller, M. et al. | Tema Archiv | 2008
  4.  

    Double patterning overlay and CD budget for 32 nm technology node

    Iessi, U. / Loi, S. / Salerno, A. et al. | Tema Archiv | 2008
  5.  

    A rigorous finite-element domain decomposition method for electromagnetic near field simulations

    Zschiedrich, L. / Burger, S. / Schadle, A. et al. | Tema Archiv | 2008
  6.  

    Patterning strategy and performance of 1.3 NA tool for 32 nm node lithography

    Mimotogi, S. / Satake, M. / Kitamura, Y. et al. | Tema Archiv | 2008
  7.  

    The rapid introduction of immersion lithography for NAND flash: challenges and experience

    Wu, Chan-Tsun / Lin, Hung-Ming / Wu, Wei-Ming et al. | Tema Archiv | 2008
  8.  

    Double printing through the use of ion implantation

    Samarakone, N. / Yick, P. / Zawadzki, M. et al. | Tema Archiv | 2008
  9.  

    Consideration of VT5 etch-based OPC modeling

    Lim, ChinTeong / Temchenko, V. / Kaiser, D. et al. | Tema Archiv | 2008

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