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Component Carrier With an Embedded Thermally Conductive Block and Manufacturing Method
Freier ZugriffEuropäisches Patentamt | 2024| -
Component Carrier with Embedded High-Frequency Component and Integrated Waveguide for Wireless Communication
Freier ZugriffEuropäisches Patentamt | 2022| -
COMPONENT CARRIER WITH EMBEDDED HIGH-FREQUENCY COMPONENT AND INTEGRATED WAVEGUIDE FOR WIRELESS COMMUNICATION
Freier ZugriffEuropäisches Patentamt | 2022| -
Bauteilträger mit einem eingebetteten wärmeleitfähigen Block und Herstellungsverfahren
Freier ZugriffEuropäisches Patentamt | 2021| -
Component carrier with an embedded thermally conductive block and manufacturing method
Freier ZugriffEuropäisches Patentamt | 2024| -
Component Carrier With an Embedded Thermally Conductive Block and Manufacturing Method
Freier ZugriffEuropäisches Patentamt | 2021| -
Component carrier, method for producing same, electronic device, and use of dielectric element
Freier ZugriffEuropäisches Patentamt | 2021| -
Component carrier with a dielectric element placed in a cavity and a manufacturing method
Freier ZugriffEuropäisches Patentamt | 2022| -
Component Carrier With a Dielectric Element Placed in a Cavity and a Manufacturing Method
Freier ZugriffEuropäisches Patentamt | 2021| -
COMPONENT CARRIER WITH A DIELECTRIC ELEMENT PLACED IN A CAVITY, AND A MANUFACTURING METHOD
Freier ZugriffEuropäisches Patentamt | 2021| -
COMPONENT CARRIER AND METHOD OF MAKING AND USING THE SAME
Freier ZugriffEuropäisches Patentamt | 2023| -
COMPONENT CARRIER FOR MICROWAVE APPLICATIONS WITH STACK PIECES INTERCONNECTED AT AN ELECTRICALLY CONDUCTIVE CONNECTION INTERFACE
Freier ZugriffEuropäisches Patentamt | 2023| -
OPPOSING PLANAR ELECTRICALLY CONDUCTIVE SURFACES CONNECTED FOR ESTABLISHING A TWO-DIMENSIONAL ELECTRIC CONNECTION AREA BETWEEN COMPONENT CARRIER STACKS
Freier ZugriffEuropäisches Patentamt | 2021| -
Opposing Planar Electrically Conductive Surfaces Connected for Establishing a Two-Dimensional Electric Connection Area Between Component Carrier Stacks
Freier ZugriffEuropäisches Patentamt | 2021| -
Component Carrier for Microwave Applications With Stack Pieces Interconnected at an Electrically Conductive Connection Interface
Freier ZugriffEuropäisches Patentamt | 2023| -
Component carrier with opposed stacks having respective connection bodies and a method for manufacturing the component carrier
Freier ZugriffEuropäisches Patentamt | 2022| -
Opposing Planar Electrically Conductive Surfaces Connected for Establishing a Two-Dimensional Electric Connection Area Between Component Carrier Stacks
Freier ZugriffEuropäisches Patentamt | 2022| -
COMPONENT CARRIER, METHOD OF MANUFACTURING COMPONENT CARRIER, AND METHOD OF USE
Freier ZugriffEuropäisches Patentamt | 2021|