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Investigations on the damage mechanism of aluminium wire bonds used for high-power applications (English)

In: Electronic packaging technology: EuPac '96   ;  128-131  ;  1996

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Table of contents conference proceedings

The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.

1
Modular systems in MST for medical applications
Menz, W. / Bacher, W. / Schomburg, W. K. / German Welding Society et al. | 1996
4
Software tools for electromagnetic compatibility on board level
Franchois, A. / De Smedt, R. / Allaert, K. / German Welding Society et al. | 1996
8
Design and characterization of RF-circuits in multilayer MCM substrates
Rekonen, H. / Perttula, A. / Tervonen, A. / Barnwell, P. / German Welding Society et al. | 1996
8
Design and characterisation of RF-circuits in multilayer MCM substrates
Rekonen, H. / Perttula, A. / Tervonen, A. / Barnwell, P. / Sherthouse, G. et al. | 1996
11
The use of integrated resistors and buried capacitance in high performance telecom printed circuit boards
Peeters, J. / Roose, E. / Vandam, L. / Ackaert, A. / German Welding Society et al. | 1996
15
A simplified approach for the environmental assessment of populated printed circuit boards
Nissen, N. F. / Middendorf, A. / German Welding Society et al. | 1996
19
An overview of polymeric electronics packaging using conductive adhesives
Liu, J. / German Welding Society et al. | 1996
24
Development of an adhesive TAB joining technology
Vanfleteren, J. / Van Calster, A. / Sabbe, K. / De Caluwe, M. / German Welding Society et al. | 1996
27
Conductive adhesive joints with non-conductive adhesives for small-pitch SMT-applications
Bauer, A. / Oeverdiek, H. / Gesang, T. / Schaefer, H. / German Welding Society et al. | 1996
27
Conductive adhesive joints with non-conductive adhesives for fine-pitch SMT-applications
Bauer, A. / Oeverdiek, H. / Gesang, T. / Schäfer, H. et al. | 1996
30
Electrically conductive adhesive joints with nonfilled adhesives
Schaefer, H. / Wiegmann, G. / Hennemann, O.-D. / German Welding Society et al. | 1996
33
Flip-chip integration in standard SMT assembling processes
Richter, H. / Florjancic, M. / Heck, W. / Schleeh, T. / German Welding Society et al. | 1996
37
Flip-chip bonding investigations on the self-alignment of tin-lead bumps under vacuum conditions
Kuhmann, J. F. / Hensel, H.-J. / Bach, H.-G. / German Welding Society et al. | 1996
41
Si circuit chip joining technology using Ar atom bombardment
Kohno, A. / Sasaki, Y. / Horino, M. / Usami, M. / German Welding Society et al. | 1996
47
Flip-chip technology for chip-on-glass applications (LCD)
Wojciechowski, D. / Van Calster, A. / Vrana, M. / De Baets, J. / German Welding Society et al. | 1996
51
Flip-chip bonding with solder-filled anisotropic adhesive
Savolainen, P. / Kivilahti, J. / German Welding Society et al. | 1996
54
Organic versus non-organic substrates for R. F. applications
Drevon, C. / German Welding Society et al. | 1996
58
The impact of thermoplastic substrates on soldering of electronic products
Feldmann, K. / Gerhard, M. / German Welding Society et al. | 1996
65
Sn-Ag-Ga, a possible lead-free solder alloy
Fritz, K. / Wege, S. / Schmitt-Thomas, K. G. / German Welding Society et al. | 1996
69
Stability of grain structure and grain boundary distribution in 1-D and 2-D metallic systems
Sursaeva, V. G. / Tatzij, T. V. / Shvindlerman, L. S. / Faulkner, R. G. / German Welding Society et al. | 1996
73
Techniques for optoelectronic interconnections
Leppihalme, M. / Honkanen, S. / German Welding Society et al. | 1996
75
Self-aligned packaging of multi-channel photodiode array module using AuSn solder bump flip-chip bonding
Itoh, M. / Yoneda, I. / Sasaki, J. / Honmou, H. / German Welding Society et al. | 1996
77
High precision LIGA structures for optical fibre-in-board technology
Picard, A. / Ehrfeld, W. / Reinhardt, J. / Morlion, D. / German Welding Society et al. | 1996
81
Wafer through-hole interconnections for high vertical wiring densities
Christensen, C. / Bouwstra, S. / Petersen, J. W. / Kersten, P. / German Welding Society et al. | 1996
83
Issues and opportunities in thin film MCM
Beyne, E. / German Welding Society et al. | 1996
88
High power 3D MCM-V modules
Coello-Vera, A. / Albo, L. / Pipard, P. / Masgrangeas, M. / German Welding Society et al. | 1996
91
MCM introduction scenarios for B-ISDN
Temmerman, W. / De Bondt, R. / Ackaert, A. / Allaert, K. / German Welding Society et al. | 1996
95
MCM-L packaging: Technology for die and SMD components under the same overcoating
Clot, P. / Zeberli, J.-F. / German Welding Society et al. | 1996
99
Reliability analysis for electronic equipment and systems
Birolini, A. et al. | 1996
99
Reliability analysis techniques for electronic equipment and systems
Birolini, A. / German Welding Society et al. | 1996
106
Fracture electronics - fracture problems in electronic packaging
Michel, B. / Schubert, A. / Villain, J. / German Welding Society et al. | 1996
108
Deformation measurements at components, printed wiring boards and microelectronic assemblies to ensure the reliability of a system
Ahrens, T. / Krumm, M. et al. | 1996
108
Deformation measurements at components, printed wiring boards and microelectronics assemblies to ensure the reliability of a system
Ahrens, T. / Krumm, M. / German Welding Society et al. | 1996
112
Damage and micro-crack evolution in SMT solder joints
Heiduschke, K. / Weber, L. / Birolini, A. / German Welding Society et al. | 1996
116
Reliability of displaced solder joints
Halser, K. / German Welding Society et al. | 1996
119
Wire bonding for future requirements
Lang, K.-D. / German Welding Society et al. | 1996
125
Frequency characteristics of ultrasonic wire bonding - high frequency ultrasonic wire bonding
Tsujino, J. / German Welding Society et al. | 1996
128
Investigations on the damage mechanism of aluminium wire bonds used for high-power applications
Poech, M.-H. / Dittmer, K. J. / Gaebisch, D. / German Welding Society et al. | 1996
132
Optimization of the ball-wedge bonding process for use of thick wires on non-precious metal basis
Fritzsche, H. / Meusel, E. / Draugelates, U. / Trapp, T.-U. / German Welding Society et al. | 1996
135
Analytical methods to characterise the interconnection quality of gold ball bonds
Carrass, A. / Jaecklin, V. P. / German Welding Society et al. | 1996
140
Radiated emission of PCB tracks
De Langhe, P. / Olyslager, F. / Franchois, A. / De Zutter, D. / German Welding Society et al. | 1996
143
The structures of laser-beam soldered microjoints with RS solders
Dorn, L. / Herbert, F. / Hofmann, F. / Jafari, S. / German Welding Society et al. | 1996
143
The strutures of laser-beam soldered microjoints with RS solders
Dorn, L. / Herbert, F. / Hofmann, F. / Jafari, S. / Sodeik, H. et al. | 1996
146
High frequency characterization of laser-CVD deposited aluminum lines
Metzger, D. / Loppnow, A. / Owzar, A. / Reichl, H. / German Welding Society et al. | 1996
146
High frequency charcterization of laser-CVD deposited aluminum lines
Metzger, D. / Loppnow, A. / Owzar, A. / Reichl, H. et al. | 1996
149
Temperature dependence of solder paste adhesion
Nowottnick, M. / Wittke, K. / Kising, M. / Bell, H. / German Welding Society et al. | 1996
151
Study of adhesion of molding compounds on differently treated copper surfaces
Scandurra, A. / Zafarana, R. / Grasso, A. / Pelligra, B. / German Welding Society et al. | 1996
156
Evaluation of wettability and behaviour of the solder-flux-system
Schmitt-Thomas, K. G. / Schurig, J. / Hoeninger, H. / German Welding Society et al. | 1996
159
"Right-first-time" MCM design
Zorba, O. / German Welding Society et al. | 1996
162
Fully automatic calculation of die-attach voids
Frank, U. E. / German Welding Society et al. | 1996
163
Groundrules for reliability improvement of IGBT power module packaging
Jacob, P. / Held, M. / Scacco, P. / German Welding Society et al. | 1996
166
Investigation on low-stress COB-packaging
Schneider, W. et al. | 1996
166
Investigations on low-stress COB-packaging
Schneider, W. / German Welding Society et al. | 1996
168
Reliability prediction of wire bonding
Tiederle, V. / German Welding Society et al. | 1996
171
Interconnection by laser induced metal deposition from liquid solutions
Gillner, A. / Wehner, M. / German Welding Society et al. | 1996

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