Package on Package Module Assembly Process Development (English)
- New search for: Xia, C.
- New search for: Gui, C.
- New search for: Priore, S.
- New search for: Surface Mount Technology Association
- New search for: Xia, C.
- New search for: Gui, C.
- New search for: Priore, S.
- New search for: Surface Mount Technology Association
In:
Surface Mount Technology Association
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85
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2014
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ISBN:
- Conference paper / Print
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Title:Package on Package Module Assembly Process Development
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Contributors:Xia, C. ( author ) / Gui, C. ( author ) / Priore, S. ( author ) / Surface Mount Technology Association
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Conference:International conference, Surface Mount Technology Association ; 2014 ; Rosemont, IL
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Published in:
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Publisher:
- New search for: Surface Mount Technology Association
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Place of publication:Edina, MN
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Publication date:2014-01-01
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Size:85 pages
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Remarks:Includes bibliographical references and index
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ISBN:
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Type of media:Conference paper
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Type of material:Print
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Language:English
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Keywords:
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Source:
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Table of contents conference proceedings
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
- 1
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3DIC Yield Analysis ChallengesOrbon, J. / Surface Mount Technology Association et al. | 2014
- 5
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Scalable Approaches for 2.5D IC Assembly MethodsWoychik, C.G. / Agrawal, A. / Zhang, R. / Alatorre, R. / Lee, B.-S. / Mirkarimi, L. / Arkalgud, S. / Surface Mount Technology Association et al. | 2014
- 11
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3D IC Integration with a TSV/RDL Passive InterposerLau, J. / Surface Mount Technology Association et al. | 2014
- 20
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A High Dense Organic Interposer with Fine Feature Size for Advanced Packaging ApplicationsRomero, C. / Lee, J. / Kweon, Y. / Surface Mount Technology Association et al. | 2014
- 27
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Electromigration Performance of WLCSP Solder JointsDarveaux, R. / Hoang, J.-D.V. / Vijayakumar, B. / Surface Mount Technology Association et al. | 2014
- 36
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Assembly and Failure Analysis of WLP With 0.3mm Pitch and SmallerAmir, D. / Fan, C. / Surface Mount Technology Association et al. | 2014
- 45
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Reworkable Underfill Evaluation for Fine Pitch BGA ApplicationsXie, F. / Wu, H. / Baldwin, D.F. / Houston, P. / Ji, Q. / Bo, B. / Surface Mount Technology Association et al. | 2014
- 55
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Ceramic Column Grid Array Design and AssemblyNelson, J.S. / Surface Mount Technology Association et al. | 2014
- 64
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Reliability of Capacitors/CGAs onto Substrate/PCBGhaffarian, R. / Surface Mount Technology Association et al. | 2014
- 71
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Comparative Analysis of cCGA Solder Column Interconnects Following Aerospace Level Vibration Testing to FailureJennings, J.M. / Surface Mount Technology Association et al. | 2014
- 79
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Influence of Thermal Shock on Lead Free Alloy Combinations in Package on Package AssembliesDaya, A. / Ramkumar, S.M. / Surface Mount Technology Association et al. | 2014
- 85
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Package on Package Module Assembly Process DevelopmentXia, C. / Gui, C. / Priore, S. / Surface Mount Technology Association et al. | 2014
- 91
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Manufacturing Readiness of BVA™ Technology for Fine-Pitch Package-on-PackageKatkar, R. / Co, R. / Zohni, W. / Surface Mount Technology Association et al. | 2014
- 99
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Design and Material Parameter Effects on BGA Solder Joint Reliability for Automotive ApplicationsCarpenter, B. / Koschmieder, T. / Wilkerson, B. / Hauck, T. / Arthur, J. / Surface Mount Technology Association et al. | 2014
- 112
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Effect of Board Thickness, Temperature Range and Dwell Time on Solder Joint Reliability of FCBGA Packages Based on IPC9701 CharacterizationChen, O.H. / Radhakrishnan, J. / Molina, A. / Surface Mount Technology Association et al. | 2014
- 122
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Effect of Isothermal Preconditioning on Thermal Fatigue Life and Microstructure of a SAC305 BGAWilcox, J. / Coyle, R. / Smetana, J. / Lehman, L. / Surface Mount Technology Association et al. | 2014
- 134
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Reliability Evaluation of Ultra Large BGA System-in-Package (SiP) Module AssembliesXie, W. / Guirguis, C. / Wang, Q. / Admad, M. / Surface Mount Technology Association et al. | 2014
- 143
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Characterization and Failure Analysis Techniques for Ball Grid Array Solder JointsMortensen, A.W. / Lee, M.C. / Devaney, R.M. / Surface Mount Technology Association et al. | 2014
- 152
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Root Cause Failure Analysis of Dendrite Shorting - A Comparison of Analytical TechniquesMunson, T. / Surface Mount Technology Association et al. | 2014
- 158
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Non-Destructive Evaluation of Solder Bump Quality Under Mechanical Bending Using Laser Ultrasonic TechniqueGong, J. / Ume, C. / Akinade, K. / Rogers, B. / Guirguis, C. / Chan, D. / Escobar, C. / Surface Mount Technology Association et al. | 2014
- 167
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Low Temperature Assembly of LED Packages on PET and Polyimide Flexible SubstratesPatel, A. / Raut, R. / Pandher, R. / Soydan, R. / Bent, W. / Bhatkal, R. / Sweitzer, B. / Surface Mount Technology Association et al. | 2014
- 173
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Several Studies of NaCl Presence on Tin MetallizationServin, J. / Surface Mount Technology Association et al. | 2014
- 187
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J-STD-004B: A New Twist on an Old Standard?Seelig, K. / O Neill, T. / Surface Mount Technology Association et al. | 2014
- 194
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Contract Manufacturing and Conflict Minerals: Creating a Workable Compliance SystemSheehan, J. / Abell, A. / Surface Mount Technology Association et al. | 2014
- 198
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Lessons Learned from AIM's Participation in the Conflict-Free Tin InitiativeSuraski, D. / Surface Mount Technology Association et al. | 2014
- 202
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PCB Design and Fabrication Process Variations for Embedding Passive and Active ComponentsSolberg, V. / Surface Mount Technology Association et al. | 2014
- 207
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Embedded Passive Technology Materials, Design and ProcessChammas, H. / Surface Mount Technology Association et al. | 2014
- 215
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Power Overlay (POL) - Advanced Embedding Packaging Technology PlatformGowda, A. / Tuominen, R. / McConnelee, P. / Surface Mount Technology Association et al. | 2014
- 222
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Embedding of Power Semiconductors for Innovative Packages and ModulesBottcher, L. / Karaszkiewicz, S. / Ostmann, A. / Manessis, D. / Surface Mount Technology Association et al. | 2014
- 229
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Overview of the Opportunities and Processes for Printed ElectronicsHolden, H. / Surface Mount Technology Association et al. | 2014
- 243
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Turning Printed Circuit Boards into Printed Circuit Structures Using 3D PrintingChurch, K. / Chen, X. / Deffenbaugh, P. / Perkowski, C. / LeBlanc, S. / Rojas, E. / Weller, T. / Surface Mount Technology Association et al. | 2014
- 248
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Understanding Nano-Sized Fillers in Conductive AdhesivesNeuhaus, H. / Bauer, C. / Surface Mount Technology Association et al. | 2014
- 255
-
Low Porosity Pressureless Sintering of Novel Ag Paste For Die AttachChen, S. / Fan, G. / Yan, X. / LaBarbera, C. / Kresge, L. / Lee, N.-C. / Surface Mount Technology Association et al. | 2014
- 262
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Component Level Reliability for High Temperature Power Computing with SAC305 and Alternative High Reliability SoldersThirugnanasambandam, S. / Sanders, T. / Evans, J. / Bozack, M. / Suhling, J. / Johnson, W. / Surface Mount Technology Association et al. | 2014
- 271
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Can Sintered Silvers be Used in Surface Mount ApplicationsHunt, C.P. / Crocker, L. / Surface Mount Technology Association et al. | 2014
- 284
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Measurement of the High Strain Rate Mechanical Behavior of SAC305 Alloy at Product Operating Temperature and Derivation of Anand Viscoplasticity ConstantsLall, P. / Zhang, D. / Yadav, V. / Locker, D. / Surface Mount Technology Association et al. | 2014
- 293
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The Effect of PCB and System Thermal Efficiency on the Thermal Performance of Die Attach MaterialsMansi, M. / Santos, D. / Havens, R. / Srihari, K. / Fried, B. / Zhao, J. / Surface Mount Technology Association et al. | 2014
- 299
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High Temperature Resistant Interconnects for Power Electronics ApplicationAlbrecht, H.-J. / Busche, N. / Strogies, J. / Surface Mount Technology Association et al. | 2014
- 306
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New Interconnection for High Temperature Application: HotPowCon (HPC): Part 3 FinalTrodler, J. / Nowottnick, M. / Fix, A. / Herberholz, T. / Surface Mount Technology Association et al. | 2014
- 319
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Effect of Solder Alloy, Aging and TAL on High Strain-Rate Fracture of Lead-Free Solder JointsNourani, A. / Spelt, J.K. / Surface Mount Technology Association et al. | 2014
- 325
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Impact of Solder Interconnect Configuration Modeling on Reliability Assessment Results of Electronic AssembliesXie, J. / Surface Mount Technology Association et al. | 2014
- 333
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Temperature Cycling and Fatigue in ElectronicsSharon, G. / Tulkoff, C. / Surface Mount Technology Association et al. | 2014
- 343
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Mitigation of Resistor Silver Sulfide Corrosion Through Design and SMT Process OptimizationCai, B. / Cole, M. / Zhang, J. / Zhang, H. / Kwon, B.B. / Seok, J.I. / Hwan, R.J. / Gack, D. / Surface Mount Technology Association et al. | 2014
- 351
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Silver Sulfidation Kinetics in Flowers of Sulfur EnvironmentHindin, B. / Pledger, M. / Surface Mount Technology Association et al. | 2014
- 358
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Hydrophobic Coatings as an Approach for Preventing Corrosion Under BGAsClifton, J.D. / Panackal, P.A. / Schoch, K.F. / Surface Mount Technology Association et al. | 2014
- 365
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Effect of Gold and Copper on AuSn4 Deposition and Isothermal Durability of SAC305 Solder JointsMukherjee, S. / Dasgupta, A. / Silk, J. / Ong, L.-l. / Surface Mount Technology Association et al. | 2014
- 373
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Assessment of the Effect of Mean Temperature on Thermal Cycling Reliability of SAC Solder Joints Using Leading Indicators of FailureLall, P. / Mirza, K. / Surface Mount Technology Association et al. | 2014
- 388
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Flip Chip Component Technology Qualification for High Performance Avionics ProductsHillman, D. / Wilcoxon, R. / Schlueter, L. / Walker, R. / Scalzo, M. / Lara, D. / Surface Mount Technology Association et al. | 2014
- 401
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A.R.E.A. - Low Loss Laminate Material Pad Cratering ResistanceMeilunas, M. / Anselm, M. / Surface Mount Technology Association et al. | 2014
- 406
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A.R.E.A. - Effect of PCB Surface Finish on Sn Grain Morphology and Thermal Fatigue Performance of Lead Free Solder JointsArfaei, B. / Anselm, M. / Mutuku, F. / Cotts, E. / Surface Mount Technology Association et al. | 2014
- 415
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A.R.E.A. - Component Level Testing of Thermal Interface MaterialsSchoeller, H. / Anselm, M. / Surface Mount Technology Association et al. | 2014
- 423
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Recalling the Lead-Free Manhattan ProjectRafanelli, A. / Woody, L. / Surface Mount Technology Association et al. | 2014
- 429
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Process Sensitive Components Guideline - a Primer for the IndustryCole, M. / Grosskopf, C. / Lam, M. / Lauri, M. / Geiger, D. / Rubin, H.-D. / Sack, T. / Bixenman, M. / Schultz, L. / Wilcox, J. et al. | 2014
- 436
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``Smart'' Chemistry Towards Highly Efficient Soldering Material FormulationShi, Y. / Wei, X. / Tolla, B. / Surface Mount Technology Association et al. | 2014
- 444
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Risk and Mitigation for Tin Whiskers and Tin PestLasky, R. / Surface Mount Technology Association et al. | 2014
- 449
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Strategic Environmental Research and Development Program (SERDP) Tin Whisker Testing and Modeling: Tin Whisker Growth on SAC305 AssembliesMeschter, S. / Snugovsky, P. / Kennedy, J. / Bagheri, Z. / Kosiba, E. / Surface Mount Technology Association et al. | 2014
- 476
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Tin Whisker Inorganic Coating Evaluation (TWICE)Hillman, D. / Wilcoxon, R. / Lower, N. / Grossman, D. / Surface Mount Technology Association et al. | 2014
- 489
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Strategic Environmental Research and Development Program (SERDP) Nanoparticle Enhanced Conformal Coating for Whisker MitigationMeschter, S. / Cho, J. / Maganty, S. / Starkey, D. / Gomez, M. / Edwards, D. / Ekin, A. / Elsken, K. / Keeping, J. / Snugovsky, P. et al. | 2014
- 530
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A Closed-Form Norris-Landzberg Solder Reliability ModelAl-Momani, E. / Khasawneh, M.T. / Sammakia, B. / Surface Mount Technology Association et al. | 2014
- 536
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Microstructurally Adaptive Constitutive Relations and Reliability Assessment Protocols for Lead Free SolderBorgesen, P. / Cotts, E. / Dutta, I. / Surface Mount Technology Association et al. | 2014
- 547
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iNEMI PB-Free Alloy Characterization Project Report: Part VIII - Thermal Fatigue Results for High-AG Alloys at Extended Dwell TimesCoyle, R. / Smetana, J. / Reed, P. / Parker, R. / Allen, A. / Benedetto, E. / Howell, K. / Sweatman, K. / Longgood, S. / Arfaei, B. et al. | 2014
- 561
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iNEMI PB-Free Alloy Characterization Project Report: Part VII - Thermal Fatigue Results for Low-AG AlloysCoyle, R. / Smetana, J. / Parker, R. / Howell, K. / Sweatman, K. / Allen, A. / Benedetto, E. / Lui, W. / Silk, J. / Surface Mount Technology Association et al. | 2014
- 575
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Copper Dissolution as a Function of Surface Finish as Observed on RoHS Selective Solder EquipmentShoaf, T. / Surface Mount Technology Association et al. | 2014
- 583
-
Sensitivity of Copper Dissolution to the Flow Behavior of Molten Sn-Pb SolderVianco, P.T. / Rejent, J.A. / Kilgo, A.C. / Garrett, S.E. / Surface Mount Technology Association et al. | 2014
- 600
-
Reliable Soldering for High and Mixed Volume Selective Soldering ProcessesDiepstraten, G. / Surface Mount Technology Association et al. | 2014
- 607
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Assembly Material/Flux Interactions and the Impact on ReliabilityWilding, I. / Jackson, G. / Day, K. / Boyle, R. / Carter, M. / Buckland, D. / Surface Mount Technology Association et al. | 2014
- 615
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Effect of Flux Systems on Electrochemical Migration of Lead-Free AssemblyWei, X. / Tolla, B. / Surface Mount Technology Association et al. | 2014
- 622
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The Effect of Solder Paste Reflow Conditions on Surface Insulation ResistanceTellefsen, K. / Holtzer, M. / Surface Mount Technology Association et al. | 2014
- 627
-
Conformal Coating Over No Clean Flux Residues, Part 2O Neill, T. / Seelig, K. / Surface Mount Technology Association et al. | 2014
- 633
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Component Removal Techniques With Underfill on Printed Circuit Boards for Failure AnalysisDobriyal, P. / Wade, J. / Kurella, A. / Surface Mount Technology Association et al. | 2014
- 639
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Development of an Underfill Rework Process and Evaluation of Underfill ReworkabilityEngland, J. / Toleno, B.J. / Israel, J. / Surface Mount Technology Association et al. | 2014
- 645
-
The Effect of Thermal Profiles on Cleanliness and Electrical PerformanceCamden, E. / Surface Mount Technology Association et al. | 2014
- 655
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Cleaning Process Efficiency and the Influence of Static & Dynamic Cleaning RatesTosun, U. / Vargas, A. / Surface Mount Technology Association et al. | 2014
- 673
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More Than Monitoring: Controlling Multi-Phase Cleaning AgentsWissel, R. / Jones, H. / Lober, D. / Afugu, J. / Surface Mount Technology Association et al. | 2014
- 683
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To Kill a Circuit Board: Perils in Manual Soldering & Cleaning ProcessesTulkoff, C. / Surface Mount Technology Association et al. | 2014
- 691
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Study of Precise Micro-Dispensing for Adhesive DepositionChen, X. / Denkins, J. / Church, K.H. / Surface Mount Technology Association et al. | 2014
- 696
-
An Innovative Reliability Solution to Interconnect of Flexible/Rigid SubstratesLiu, M. / Yin, W. / Surface Mount Technology Association et al. | 2014
- 701
-
Soldering with Exothermic Reacting PastesNowottnick, M. / Seehase, D. / Huth, H. / Surface Mount Technology Association et al. | 2014
- 707
-
Enhancing the Impact Properties of Tin-Copper and Tin-Copper-Nickel Lead-Free Solders with Trace Additions of Zinc, Indium and GoldSweatman, K. / Nishimura, T. / Mu, D. / Surface Mount Technology Association et al. | 2014
- 712
-
Mapping Mechanical Properties of Lead-Free Solder JointsMorillo, C. / Hay, J.L. / Silk, J. / Surface Mount Technology Association et al. | 2014
- 718
-
Microstructure Study of Lead-Free Solder Joints Reflowed Using Alternative Low Silver Alloy Solder PastesMcKay, E.G. / Nguyen, J. / Surface Mount Technology Association et al. | 2014
- 732
-
Reliability of PCB Solder Joints Assembled with SACM™ Solder PasteDasgupta, A. / Zhou, F. / LaBarbera, C. / Liu, W. / Bachorik, P. / Lee, N.-C. / Surface Mount Technology Association et al. | 2014
- 739
-
Low-Temperature Soldering of Si-based Photo MultipliersDenteneer, R.P.J. / Krassenburg, L.C.P. / Brom, J.H.G. / Biglari, M.H. / Surface Mount Technology Association et al. | 2014
- 745
-
X-ray / Bondtester Reliability Study of BGA Devices - Impact of Interfacial VoidingTingay, J. / Krastev, E. / Surface Mount Technology Association et al. | 2014
- 750
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Optimizing X-Ray Inspection With Package on PackageGeiger, D. / Feng, Z. / Liu, W. / Le, H. / Vu, T. / Mohammed, A. / Kurwa, M. / Krastev, E. / Surface Mount Technology Association et al. | 2014
- 757
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X-Ray Micro-CT for Non-Destructive Analysis of Cracks and Defects in Fine-Pitch Electronic PackagesLall, P. / Deshpande, S. / Wei, J. / Surface Mount Technology Association et al. | 2014
- 765
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Complicated Board Programming for Automated Printed Solder Paste Inspection Without CAD Data FileMao, R.-S. / Lee, N.-C. / Surface Mount Technology Association et al. | 2014
- 774
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Inspection Strategies for More Accurate, Faster and Smarter InspectionKulkami, S. / Langbridge, S. / Johnson, D. / Surface Mount Technology Association et al. | 2014
- 778
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Highly Accurate 3D Solder Paste Inspection Comparing Nano Coated Stencils With Non-Coated ResultsSalewski, C. / L Heureux, J. / Surface Mount Technology Association et al. | 2014
- 783
-
BTC: Bottom Termination Component or Biggest Technical Challenge?Caswell, G. / Tulkoff, C. / Surface Mount Technology Association et al. | 2014
- 792
-
Via-in-Pad Design Considerations for Bottom Termination Components on Printed Circuit Board AssembliesKelly, M. / Jeanson, M. / Ferrill, M. / Surface Mount Technology Association et al. | 2014
- 804
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QFN Design Considerations to Improve Cleaning - A Follow on StudyBixenman, M. / Lee, D. / Vuono, B. / Stach, S. / Surface Mount Technology Association et al. | 2014
- 815
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Advancement of Preform Technology to Reduce QFN VoidingJensen, T. / Homer, S. / Wade, G. / Surface Mount Technology Association et al. | 2014
- 820
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Eliminating BTC Voiding on the Fly: In-Production Optimization TechniquesPadilla, R. / Akita, S. / Daily, D. / Yamaki, T. / Mori, H. / Yoshikawa, T. / Shimamura, M. / Takagi, K. / Inaba, K. / Surface Mount Technology Association et al. | 2014
- 825
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What You Cannot See Can Be Hand SolderedWood, P. / Wettermann, B. / Surface Mount Technology Association et al. | 2014
- 831
-
Removal of High Density Plated Through Hole Connectors on Large Mass Multi-Layered Circuit Card AssembliesNewman, M. / Surface Mount Technology Association et al. | 2014
- 837
-
Rework of High Thermal Mass BGAs, QFNs and SMT Connectors on Lead-free Circuit Board Assemblies with Temperature Sensitive Optical FiberFarrell, R. / Bodmer, P. / Duhaime, J. / Surface Mount Technology Association et al. | 2014
- 842
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Performance Enhancing Nano Coatings: Changing the Rules of Stencil DesignLentz, T. / Surface Mount Technology Association et al. | 2014
- 850
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Advances in Fine Pitch Printing Process TechnologySmith, I. / Surface Mount Technology Association et al. | 2014
- 858
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Understencil Video Effects to Study Solder Paste Transfer and Wiping EffectsBixenman, M. / Raney, W. / Shea, C. / Whittier, R. / Surface Mount Technology Association et al. | 2014
- 869
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The Next Big Challenge for Stencil Printing - Sub 0.5 Area Ratio AperturesWhitmore, M. / Ashmore, C. / Surface Mount Technology Association et al. | 2014
- 878
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Fundamental Study on a Secure Printing Process Using NanoWork Stencils for 01005 ComponentsHaerter, S. / Franke, J. / Laentzsch, C. / Surface Mount Technology Association et al. | 2014
- 885
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The Effects of Stencil Alloy and Cut Quality on Solder Paste Print PerformanceShea, C. / Whittier, R. / Surface Mount Technology Association et al. | 2014
- 892
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Microstructure and Reliability Studies of Mixed SnPb and Pb-free BGA SolderingKramer, K. / Nelson, C. / Sharan, A. / Surface Mount Technology Association et al. | 2014
- 898
-
A.R.E.A. - Component Warpage: Issues with Measurement and StandardizationAnselm, M. / Surface Mount Technology Association et al. | 2014
- 903
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Warpage Studies on Large BGA Site and Corner Bridging Mitigation MethodPerng, S. / Xie, W. / Guirguis, C. / Surface Mount Technology Association et al. | 2014
- 909
-
3D Electroform Stencils for Two Level PCBMiller-Short, R. / Surface Mount Technology Association et al. | 2014
- 921
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ESD Sources in a Production Line (SMT) and Solutions - Requirements for Today and in the FutureBerndt, H. / Surface Mount Technology Association et al. | 2014
- 928
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Method for Identifying & Tracking Individual ComponentsMcDermott, R. / Surface Mount Technology Association et al. | 2014
- 934
-
Critical Process and Chemical Parameters Affecting the Assembly Performance of Organic Solderability Preservatives (OSP)Carano, M. / Surface Mount Technology Association et al. | 2014
- 941
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Immersion Tin Surface Finish - Reviewing the Past and a Look to the FutureOezkoek, M. / Mertens, H. / Bruder, M. / Surface Mount Technology Association et al. | 2014
- 945
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Controlling High Copper Roughness for Enhancing Immersion Metal Surface Finish PerformanceToscano, L. / Karoly, A. / Long, E. / Surface Mount Technology Association et al. | 2014
- 953
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Thick Copper PCBA Technology and Process DevelopmentWillie, D. / Loi, R. / Geiger, D. / Surface Mount Technology Association et al. | 2014
- 959
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Spherical Bend Test Failure Criteria Correlation in Compliant SystemsMcMahon, J. / Standing, B. / Salahi, M. / Surface Mount Technology Association et al. | 2014
- 967
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Electroless Nickel Immersion Gold (ENIG) and Black Tar - What Is It and How Can It Be Prevented?Trainor, J. / Surface Mount Technology Association et al. | 2014
- 973
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Comparative Study of Next-Generation Surface Finishes for Printed Circuit AssemblyTeng, S.Y. / Priore, S. / Surface Mount Technology Association et al. | 2014
- 981
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Soldering Evaluations on the New Direct Palladium Gold Finish (EPAG)Kilian, A. / Schreier, P. / Bruder, M. / Oezkoek, M. / Ramos, G. / Surface Mount Technology Association et al. | 2014
- 986
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Improving Electronics Assembly Process Through Organic-Metal Final FinishMohanty, R. / Fudala, J. / Narayanan, S. / Surface Mount Technology Association et al. | 2014
- 992
-
The Effect of Isothermal Aging on the Reliability of Sn-Ag-Cu Solder Joints Using Various Surface FinishesShen, C. / Hai, Z. / Zhao, C. / Zhang, J. / Evans, J.L. / Bozack, M.J. / Surface Mount Technology Association et al. | 2014
- 1000
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Connector Reliability: Tradeoff Between Surface Plating and Mechanical SolutionsMeyyappan, K. / McAllister, A. / Kurella, A. / Pathangey, B. / Surface Mount Technology Association et al. | 2014
- 1005
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Pb Free Solder Joint Reliability of Various Surface FinishesEjiri, Y. / Sakurai, T. / Arayama, Y. / Tsubomatsu, Y. / Akai, K. / Nakagawa, M. / Hasegawa, K. / Surface Mount Technology Association et al. | 2014