Power-aware Test Generation for Reducing Yield Loss Risk in At-Speed Scan Testing (English)
- New search for: Yamato, Y.
- New search for: Wen, X.
- New search for: Miyase, K.
- New search for: Furukawa, H.
- New search for: Kajihara, S.
- New search for: Yamato, Y.
- New search for: Wen, X.
- New search for: Miyase, K.
- New search for: Furukawa, H.
- New search for: Kajihara, S.
In:
International Semiconductor Technology Conference; ISTC/CSTIC 2009
1
;
231-236
;
2009
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ISBN:
- Conference paper / Print
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Title:Power-aware Test Generation for Reducing Yield Loss Risk in At-Speed Scan Testing
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Contributors:Yamato, Y. ( author ) / Wen, X. ( author ) / Miyase, K. ( author ) / Furukawa, H. ( author ) / Kajihara, S. ( author )
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Conference:International Semiconductor Technology Conference; ISTC/CSTIC 2009 ; 2009
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Published in:ECS TRANSACTIONS ; 18, 1 ; 231-236
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Publisher:
- New search for: Curran
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Place of publication:Red Hook
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Publication date:2009-01-01
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Size:6 pages
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Remarks:Includes bibliographical references
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ISBN:
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Type of media:Conference paper
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Type of material:Print
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Language:English
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Keywords:
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Source:
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Table of contents conference proceedings
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
- 3
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Electrical Defect Issues of Hetero-Epitaxy for Advanced Nanometric CMOS TechnologiesClaeys, C. / Gonzalez, M.B. / Eneman, G. / Hikavyy, A. / Loo, R. / Simoen, E. et al. | 2009
- 9
-
CMOS Compatible RF MEMS Switches with Serpentine SpringsEvans, X.L. / Gamble, H. / Baine, P. / Mitchell, S. / Montgomery, J. / Bain, M. / Rainey, P. / Bien, D. et al. | 2009
- 15
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Carbon co-implantation Used to Improve NMOS Threshold Voltage Roll-off Characteristics Study in 65nm Node CMOS TechnologyLiu, J. / Allan, Z. / Jianhua, J. / Dai, S. / Shen, Z. / Liu, E. / Wang, B. / Hung, A. / Ho, H. / Ning, J. et al. | 2009
- 21
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Investigation into the Output Characteristics and Improvement of Operation Margin of IMOS (Impact Ionization MOS) DevicesLiu, H. / Huang, R. / Wang, Z. et al. | 2009
- 27
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Minimizing Device Variation Caused by RTA Temperature Variation Across the Shot FieldJu, J. / Liu, E. / Dai, S. / Zhou, A. / Shen, Z. / Liu, J. / Wang, B. / Deng, D. / Tang, J. / Hung, A. et al. | 2009
- 33
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Electrical Characterization of Mos Memory Devices with Self-Assembled Tungsten Nano-Dots Dispersed in Silicon NitridePei, Y. / Yin, C. / Nishijima, M. / Kojima, T. / Noriha, H. / Fukushima, T. / Tanaka, T. / Koyanagi, M. et al. | 2009
- 39
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Electrical Characterization of W/Hfo2 MOSFETs with La2O3 IncorporationFujisawa, H. / Srivastava, A. / Kakushima, K. / Ahmet, P. / Tsutsui, K. / Sugii, N. / Hattori, T. / Sarkar, C.K. / Iwai, H. et al. | 2009
- 43
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The Impact of Shallow Trench Isolation on the Channel Hot Electron Programming Behaviors of SONOS CellsLi, Z. / Yang, F. / Wang, J. / Lin, P. / Chang, J. / Wang, Y. / Yi, C. / Yan, F. et al. | 2009
- 49
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Bistable Resistance Switching of Cu/Ti:ZrO2/Pt for Nonvolatile Memory ApplicationLiu, Q. / Long, S. / Wang, Q. / Liu, M. / Zhang, S. / Chen, J. et al. | 2009
- 55
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Transport in Silicon Nanowire TransistorsHiramoto, T. / Chen, J. / Jeong, Y. / Saraya, T. et al. | 2009
- 61
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pMOSFET Off-state Leakage and Junction Leakage Current in Ge-based DevicesSimoen, E. / De Stefano, F. / Eneman, G. / De Jaeger, B. / Claeys, C. / Crupi, F. et al. | 2009
- 67
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A Study of Stress Technology for 65nm Generic CMOS TechnologyLiu, X. / Dai, W. / Yu, X. / Lim, L. / Xue, B. / He, B. et al. | 2009
- 71
-
Evaluation of Lateral Ni Diffusion in Si Nanowire Schottky ContactKamimura, H. / Arai, H. / Sato, S. / Kakushima, K. / Ahmet, P. / Tsutsui, K. / Sugii, N. / Hattori, T. / Iwai, H. et al. | 2009
- 77
-
Characteristic Variations Induced by Random Fluctuation of Source/Drain Lateral Distribution Dopant in Nano-Scale UTB SOI MOSFETDu, L. / Deng, H. / Du, G. / Han, R. / Zhang, S. et al. | 2009
- 83
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A Novel Accumulation Mode GAAC FinFET Transistor: Device Analysis, 3D TCAD Simulation and FabricationXiao, D. / Chi, M. / Yuan, D. / Wang, X. / Yu, Y. / Wu, H. / Xie, J. et al. | 2009
- 89
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Bit Cost Scalable (BiCS) Flash Technology for Future Ultra High Density Storage DevicesNitayama, A. / Aochi, H. et al. | 2009
- 93
-
Silicon Nanocrystals Synthesized by Electron-beam Co-evaporation Method and Their Application for Nonvolatile MemoryChen, C. / Jia, R. / Liu, M. / Li, W. / Zhu, C.X. / Li, H.F. / Zhang, P.W. / Xie, C.Q. / Wang, Q. / Ye, T.C. et al. | 2009
- 99
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Investigations on the Impact of the Parasitic Bottom Transistor in Gate-All-Around Silicon Nanowire SONOS Memory Cells Fabricated on Bulk Si SubstrateAi, Y. / Huang, R. / Wang, Y. / Zhuge, J. / Wu, D. / Wang, R. / Tang, P. / Zhang, L. / Hao, Z. et al. | 2009
- 105
-
Halo Implantation Optimization for 65nm Low Power PMOS Device Inverse Narrow Width Effect ImprovementYe, H. / Ju, J. / Shi, X. / Liu, B. / Ning, J. / Chen, I.C. et al. | 2009
- 111
-
A Novel Super-Halo Doping Concept for Nanoscale CMOS TechnologyLiao, C. / Zhang, S. et al. | 2009
- 117
-
Shallow Trench Isolation Stress Effect on NMOS Transistor Leakage, SRAM Standby Current and VCCMINJu, J. / Liu, E. / Shen, Z. / Zhou, A. / Liu, J. / Deng, D. / Ren, C. / Wei, S. / Ho, H. / Ning, J. et al. | 2009
- 123
-
A High Performance 80V Smart LDMOS Power Device Based on Thin SOI TechnologySheu, G.N. / Hsu, Y. / Yang, S. et al. | 2009
- 129
-
Simulation Details for the Electrical Field Distribution and Breakdown Voltage of 0.15μ Thin Film SOI Power DeviceYou, H.N. / Liu, Y. / Tsaur, S. / Sheu, G.N. et al. | 2009
- 135
-
Investigation of Power MOSFET with Strained SiGe ChannelSun, S. / Zhou, W. / Yan, L. / Xu, J. / Yuan, J. / Shen, Z. et al. | 2009
- 141
-
Simulation of Retention Characteristics for Metal Nanocrystal Nonvolatile Memory with a Modified Direct Tunneling ModelLi, Y. / Liu, M. / Long, S. / Wang, Q. / Liu, Q. / Zhang, S. / Wang, Y. / Zuo, Q. / Liu, S. et al. | 2009
- 151
-
Metrology Requirements for the 32 nm Technology Node and BeyondAllgair, J. / Bunday, B. / Cordes, A. / Lipscomb, P. / Godwin, M. / Vartanian, V. / Bishop, M. / Arazi, D. / Kim, K. et al. | 2009
- 161
-
Advanced Metrology for Nanoelectronics at the National Institute of Standards and Technologyde Pinillos, J.V.M. / Obeng, Y. / Knight, S. et al. | 2009
- 169
-
Advanced 3D-AFM Metrology for Sidewall SpacersBao, T. / Ukraintsev, V. / Dawson, D. et al. | 2009
- 177
-
High Yield Patterning with Simplified DFM Rules in Sub-100nm Process TechnologiesChang, L. / Choi, C. / Chi, M. et al. | 2009
- 183
-
Evolution of Wafer Inspection and Review MethodologyChang, E. / Park, A. et al. | 2009
- 187
-
A Systematic Methodology For Low Yield Excursion AnalysisXu, X. / Lin, C. / Tey, T. / Hsu, M. et al. | 2009
- 193
-
Use FPGA Configuration Memory For Backend Defect CaptureQian, G. / Shi, J. et al. | 2009
- 199
-
Functionality, Yield and Reliability Analysis of SiGe Micro-mirrors using Automated Optical Measurement TechniquesDe Wolf, I. / De Coster, J. / Pedreira, O.V. / Haspeslagh, L. / Witvrouw, A. et al. | 2009
- 205
-
Reliability of Copper Interconnects: Stress-Induced VoidsGambino, J. / Lee, T.C. / Chen, F. / Sullivan, T.D. et al. | 2009
- 213
-
Si-O Bond-breakage Energetics Under Consideration of the Whole CrystalTyaginov, S.E. / Sverdlov, V. / Gos, W. / Schwaha, P. / Heinzl, R. / Stimpfl, F. / Grasser, T. et al. | 2009
- 219
-
Drain Bias Effect on the Interface Traps of pMOSFETs under Negative Bias Temperature StressPan, J. / Yang, J. / Qiao, Y. / Liu, X. / Han, R. / Kang, J. / Liao, C.C. / Wu, H. / Wu, Y. et al. | 2009
- 225
-
Challenges of Contacting Lead-Free PackagesGschwendtberger, G. et al. | 2009
- 231
-
Power-aware Test Generation for Reducing Yield Loss Risk in At-Speed Scan TestingYamato, Y. / Wen, X. / Miyase, K. / Furukawa, H. / Kajihara, S. et al. | 2009
- 237
-
Yield Learning Through Scan DiagnosisHuang, Y. / Cheng, W. et al. | 2009
- 243
-
A Low Power Architecture based on Unidirectional CutChen, Z. / Xiang, D. et al. | 2009
- 249
-
A Self-Repairable MicroprocessorXie, Y. / Fu, X. / He, Z. / Zhao, Y. / Hu, Y. / Li, X. et al. | 2009
- 255
-
Improved Cost of Test by Optimized Tester UtilizationJeserer, G. et al. | 2009
- 263
-
Semiconductor Cleaning Technology -Past and FutureRuzyllo, J. et al. | 2009
- 269
-
Electromigration Improvement for Advanced Technology NodesWu, H. / Wu, W. / Shaviv, R. / Sriram, M. / Pradhan, A. / Park, K. / O Loughlin, J. / Chattopadhyay, K. / Mountsier, T. / Dixit, G. et al. | 2009
- 275
-
Use of MIR-FTIR and k-value Measurements to Assess Potential Solutions to Reduce Damage During Porous Low-k IntegrationBeynet, J. / De Roest, D. / Rochat, N. / Kellens, K. / Verdonck, P. / Sprey, H. et al. | 2009
- 281
-
Performance Improvement of CuOx RRAM for Non-volatile ApplicationsLin, Y. / Zhou, P. / Chi, M. / Lv, H.B. / Song, S. / Huang, R. / Wu, J.G. / Wu, H.M. et al. | 2009
- 287
-
Yield Improvement through Mechanism Study on WSi2 Abnormal GrowthTang, J. / Fang, Z. / Xu, Z. et al. | 2009
- 291
-
Optimization of Nickel Salicide Strip Process Using Taguchi MethodYu, S. / Li, W. / Lin, C. / Lu, Y. et al. | 2009
- 299
-
Inverse Lithography Technology (ILT) Enabled Source Mask Optimization (SMO)Pang, L. / Xiao, G. / Tolani, V. / Hu, P. / Cecil, T. / Dam, T. / Baik, K. / Gleason, B. et al. | 2009
- 315
-
Challenges and Opportunities for Optical CD Metrology in Future Lithography ProcessBao, J. / Ferns, J. / Wen, Y. et al. | 2009
- 321
-
Line Edge Roughness Analysis for KrF Photoresists under sub 0.11 um GroundrulesWang, L. / Ji, L. / Wu, P. / Kan, H. / He, W. / Zhu, Z. / Chen, F. / Wei, F. / Zhu, J. et al. | 2009
- 333
-
Lithography Process Transfer from ArF to High-NA KrF ToolHong, J. / Serebryakov, A. et al. | 2009
- 341
-
Process Window Analysis for KrF Photoresists Under Sub-0.11um GroundrulesWang, L. / Ji, L. / Wu, P. / Kan, H. / He, W. / Zhu, Z. / Chen, F. / Wei, F. / Zhu, J. et al. | 2009
- 351
-
Computation Lithography: Virtual Reality and Virtual VirtualityWong, A. / Lam, E. et al. | 2009
- 357
-
OPC Accuracy and Development Time Improvement for Advanced Technology NodesNikolsky, P. / Nooitgedagt, T. / Van Adrichem, P. / Meessen, J. / Kohler, C. / Wisse, B. / Hunsche, S. et al. | 2009
- 367
-
Hot-Spots Aware Inverse Lithography TechnologyYang, Y. / Shi, Z. / Shen, S. / Xie, C. et al. | 2009
- 373
-
Trefoil Aberration Measurement of Lithographic Projection Optics Based on Linewidth Asymmetry of the Aerial ImageYuan, Q. / Wang, X. / Qiu, Z. et al. | 2009
- 381
-
High-Accuracy Measurement of Coma with the Optimized Alternating Phase-shifting Mask with a Specific Phase WidthQiu, Z. / Wang, X. / Yuan, Q. / Wang, F. et al. | 2009
- 391
-
EUV Source System Development for 22nm Generation and BeyondLin, B. / Brandt, D. / Farrar, N. et al. | 2009
- 397
-
Novel Embedded Barrier Layer Materials for ArF Non-topcoat Immersion ApplicationsWang, D. / Wu, C.J. / Xu, C. / Barclay, G. / Trefonas, P. / Xu, M. et al. | 2009
- 405
-
Silicon-Containing Coupler Polymers Used For DUV PhotoresistRan, R. et al. | 2009
- 409
-
A Cost Effective Spin on Sidewall Material Alternative to the CVD Sidewall ProcessHo, B. / Maruyama, D. / Sakamoto, R. / Sakaida, Y. et al. | 2009
- 419
-
Residue Testing of Developer-Soluble Bottom Anti-Reflective CoatingsWashburn, C. / April, E. / Brian, S. et al. | 2009
- 429
-
Investigation on Chemical Mechanical Polishing of GeSbTe for High Density Phase Change MemoryZhong, M. / Song, Z. / Liu, B. / Feng, S. / Xie, Z. / Zhang, F. / Xiang, Y. et al. | 2009
- 435
-
Study on CMP Mechanism and Technology of Sapphire Substrate for Photoconducting DeviceNiu, X. / Wu, T. / Zhao, X. / Tan, B. / Liu, Y.L. et al. | 2009
- 441
-
Investigation of Defects in Post-CuCMPXiong, S. / Huang, S. / Yang, Y. / Tan, C. / Wang, S. / Zhao, R. / Xu, J. et al. | 2009
- 447
-
Study On The Electro-Chemical Cleaning Technique with BDD Film Anode to Preparation of Electronic DevicesGao, B. / Zhu, Y. / Liu, Y. / Niu, X. / Zhang, J. / Liu, X. / Li, L. et al. | 2009
- 453
-
Cu/Low-k Thickness Measurement for Advanced Cu CMP Process Development and ControlLi, Y. / Heylen, N. / Delande, T. / Kellens, K. / Ong, P. / Leunissen, L. / Tarnowka, A. / Eliyahu, A. et al. | 2009
- 459
-
Cu/barrier CMP Protection Film Characterization Using Electrochemical TechniqueXu, S. et al. | 2009
- 465
-
Effect of Polisher Kinematics in Reducing Average and Variance of Shear Force and Increasing Removal Rate in Copper CMPSampurno, Y. / Philipossian, A. / Theng, S. / Nemoto, T. / Gu, X. / Zhuang, Y. / Teramoto, A. / Ohmi, T. et al. | 2009
- 473
-
Single Dispersion to Polish both Bulk Cu and Residual Cu along with Barrier LayersJanjam, S. / Roy, D. / Babu, S.V. et al. | 2009
- 479
-
Ultra-High Removal Rate Copper CMP Slurry Development for 3D ApplicationHu, B. / Kim, H. / Wen, R. / Mahulikar, D. et al. | 2009
- 485
-
Effect of H2O2 Concentration and Slurry Dilution on Removal Rate and Surface Quality for a Cu SlurryLin, J. / Du, T. et al. | 2009
- 491
-
Development of Copper CMP SlurryJing, J. / Yang, C. / Cai, X. / Shiao, D. / Wang, S. et al. | 2009
- 497
-
A New Kind of Technology for Post CMP Cleaning in IC FabricationWeiwei, L. et al. | 2009
- 503
-
Controlled DI Water Gasification System for Advanced Semiconductor Cleaning ProcessesXia, A. / Niermeyer, K. / Conner, G. / Mollica, R. et al. | 2009
- 511
-
A Novel Slurry for DRAM Polysilicon CMPWang, C. / Cao, Y. / Yang, C. / Zhou, H. / Jing, J. / Xia, Z. / Tang, J. / Lin, J. / Chiu, C. / Wang, S. et al. | 2009
- 517
-
A Matching Game for CMP Pads and ConditionersSun, F.F. / Hawkins, J. / Tsai, J. / Chiu, G. / Naman, A. et al. | 2009
- 523
-
Polycrystalline Diamond (PCD) Shaving Dresser: The Ultimate Diamond Disk (UDD) for CMP Pad ConditioningSung, J.C. / Chou, C. / Chen, Y. / Pai, Y. / Hu, S. / Sung, M. et al. | 2009
- 529
-
Development of CMP Conditioner for Sub-50 nm Technology NodesHwang, T. / Vedantham, R. / Zhang, S. et al. | 2009
- 535
-
The Design Features of Ultimate Diamond Disks (UDD): W CMP with In-Situ Dressing of Metal Free Diamond DisksSung, J.C. / Hu, S. / Huang, W. / Chou, C. / Pai, Y. et al. | 2009
- 541
-
Slurry Development Challenges and Solutions for Advanced Node Copper CMPMahulikar, D. et al. | 2009
- 547
-
Application of Surfactant in Si CMP ProcessingTan, B. / Niu, X. / Liang, P. / Wu, T. / Liu, Y.L. et al. | 2009
- 553
-
Poly-CMP Slurry for Flash MemoriesJing, J. / Chiu, B. / Huang, T. / Hsu, A. / Yang, C. / Yu, C. et al. | 2009
- 559
-
Synthesis of Spherical-like Ceria Particle with PVP as Assistant Agent and Its CMP Performance on Shallow Trench IsolationZhang, Z. / Liu, W. / Song, Z. / Hu, X. et al. | 2009
- 567
-
Advanced Process Control of HfxSil-xO2 Composition using Co-injection Atomic Layer DepositionBartholomew, L. / Bavin, A. / Lazerand, T. / Rao, V. / Weldon, M. / Wang, L. et al. | 2009
- 567
-
Advanced process control of Hf(x)Si(1-x)O2 composition using co-injection atomic layer depositionBartholomew, L.D. / Bavin, A. / Lazerand, T. / Rao, V. / Weldon, M. / Wang, L. et al. | 2009
- 575
-
Thin Oxidation Study with Various Thermodynamic ParametersZhang, P. / Zhang, X. / Wen, T. / Xu, L. / Shi, L. / Webber, S. / Willson, C. / Dean, K. et al. | 2009
- 581
-
Solving Arcing Issues in CVD ProcessesYan, E. / Xu, J. / Li, X. / Chen, J. / Chen, Y. / Zhao, D. / Chan, L. / Ji, L. / Padhi, D. / Zhang, B. et al. | 2009
- 587
-
Study on Bit Line TiCl4 TIN Process Optimization for Stack DRAM IDDS Standby Failure ImprovementChen, L. / Li, Z. / Song, X. / Xu, L. / Lin, Y. / Wei, H. / Lin, P. et al. | 2009
- 593
-
Second Generation Copper Dielectric Barrier (BLOk II): k Reduction and Interface Control To Improve TDDB and EMXia, L. / Zubkov, V. / Ye, W. / Shek, M. / Cui, D. / Naik, M. et al. | 2009
- 601
-
Studies of Wafer Backside Micro-arcing Prevention In Encore Ta ProcessChen, A. / Bian, A. / Lin, P. / Xing, C. / Zhou, H. et al. | 2009
- 605
-
Pre-clean Study for Both Damascene SiN and N-Blok to Resolve Queue-time-dependent Dielectric Barrier VBD DegradationXu, J. / Gao, R. / Wang, H. / Li, X. / Lee, S. / Cui, D. / Naik, M. / Xia, L. / Xu, Q. / Zhang, Z. et al. | 2009
- 611
-
A Study on PVD Co Pre-clean Chamber RF Reflect Power ImprovementGui, K. / Hu, P. / Ouyang, D. / Peng, C. / Yang, H. / Lin, P. et al. | 2009
- 617
-
Robust HfxSi1-xO2 Gate Dielectric using Co-injection Atomic Layer DepositionBartholomew, L. / Bavin, A. / Lazerand, T. / Rao, V. et al. | 2009
- 625
-
Plasma Charging Damage Affecting Flash Memory Device Encountered at Pad EtchChong, S. / Mohammad, K.A. / Ng, F. / Liu, L.J. / Lee, D. / Lee, S.F. et al. | 2009
- 635
-
Material Etch Rate Control in the Fluoride Containing Stripper for Post Etch and Ashing Residue RemovalLiu, B. / Peng, L. / Peng, J. / Yu, J. / Wang, S. et al. | 2009
- 641
-
Influence of Polymeric Gas on Sidewall Profile and Defect Performance of Aluminum Metal EtchWang, X. / Zhang, H. / Shen, M. / Sun, W. / Chang, S. et al. | 2009
- 645
-
Etch Arts of Dual Damascus Structure and Their Impacts on WAT/VBD in 65nm Cu InterconnectsSun, W. / Chang, S. / Zhang, H. / Yin, X. / Fu, L. / Han, B. / Wang, X. / Wu, Y. et al. | 2009
- 651
-
Understanding and Importance of Defects in Advanced MaterialsPantisano, L. / Trojman, L. / Aoulaiche, M. / O Connor, R. / Kaczer, B. / Groeseneken, G. et al. | 2009
- 659
-
Yield Enhancement with Optimized Offset Spacer Etch for 65nm Logic Low-leakage ProcessHan, B. / Chang, S. / Zhang, H. / Zhao, L. / Fu, Y. / Sun, W. / Liu, B. et al. | 2009
- 663
-
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- 669
-
Via Resistance Variation Improvement Through Amine Versus Fluorine Based Chemical and O2 Dry Flushing for BiCMOS TechnologyTee, P. / Teo, H.L. / Liew, S. / Chong, S. / Lee, D. / Lee, S.F. et al. | 2009
- 677
-
A Novel Approach for Electro Chemical Plating (ECP) Process Swirl Defect ReductionSun, R. / Zhang, J. / Jiang, J. / Bian, Y. / Lin, P. / Xing, C. / Li, X. / Zhou, H. et al. | 2009
- 683
-
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- 689
-
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- 695
-
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- 701
-
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- 707
-
3D Integrated, Ultra-Thin Functional Microcontroller Device for Wireless, Flexible ECG SystemsChristiaens, W. / Torfs, T. / Huwel, W. / Van Hoof, C. / Vanfleteren, J. et al. | 2009
- 713
-
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- 721
-
Throughput Enhanced Flip-Chip to Wafer Bonding: The Advanced Chip to Wafer BondingSigl, A. / Pargfrieder, S. / Matthias, T. / Wimplinger, M. / Kettner, P. et al. | 2009
- 727
-
Material Solutions for Advanced Thin PackagesTanaka, H. et al. | 2009
- 733
-
Development of Epoxy-Silicone Hybrid Polymer and Application for Semiconductor AssemblyTomiyoshi, K. / Kanamaru, T. / Fukui, K. et al. | 2009
- 739
-
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- 745
-
Current Evolution of Wafer Thinning and DicingSullivan, S.M. et al. | 2009
- 751
-
Electroless Nickel/Gold Under-Bump-Metallization Cost ComparisonsStrandjord, A.J. / Scheffler, A. / Zakel, E. / Oppert, T. / Teutsch, T. et al. | 2009
- 757
-
Edge Protection of Temporarily Bonded Wafers during BackgrindingBai, D. / Zhong, X. / Puligadda, R. / Burggraf, J. / Burgstaller, D. / Lypka, C. / Verzosa, J. et al. | 2009
- 763
-
Wafer Level SAW RF Filter Packaging With Through Wafer Via InterconnectionKweon, Y. / Park, S. / Kim, T. / Honh, J. / Yang, S. / Ha, J. / Yi, S. et al. | 2009
- 769
-
High Volume, Low Cost Multi Die Packaging Using Conductive Polymer InterconnectRobinson, M. / Leal, J. et al. | 2009
- 777
-
Next Generation Nickel-Based Bond Pads Enable Copper Wire BondingChylak, B. / Ling, J. / Clauberg, H. / Thieme, T. et al. | 2009
- 787
-
Consideration of Gold Thickness in ENIG UBM ApplicationNozu, M. / Shibata, T. / Yoshikawa, K. / Hashimoto, S. et al. | 2009
- 793
-
Dippable Paste: A Robust Assembly Material and Enabling TechnologySy, H.G. / Lathrop, R. et al. | 2009
- 803
-
The Destructive Wire Bond Pull Test Methodology for the Ultra Low Loop Application on Thinner Die PackageKwon, O. / Chylak, B. / Yauw, O. / Lee, K. et al. | 2009
- 813
-
Grooved Ball Pad Structure (GBPS) to Improve FBGA Solder Joint Reliability (SJR) PerformanceZhou, W. / Jiang, T. et al. | 2009
- 821
-
Microdot Epoxy Stamping Process Qualification for Substrate-Based Optocoupler BGA PackagingLivelo, E.I. / Rojas, R.V. et al. | 2009
- 831
-
Cu2 Process Development For Cost Effective SOT PackageSoh, Y. / Lim, T. et al. | 2009
- 837
-
Enabling Technology in Thin Wafer DicingVan Borkulo, J. / Evertsen, R. / Hendriks, R. et al. | 2009
- 845
-
Growth and Electrical Characterization of Horizontally Aligned CNTsSantini, C. / Cott, D.J. / Negreira, A.R. / Sanseverino, S.R. / De Gendt, S. / Vereecken, P.M. et al. | 2009
- 851
-
Fine Pitch Transfer and Join (T&J) From MCM to 3DIYu, R.R. et al. | 2009
- 857
-
Exploratory NEMS-CMOS Hybrid Devices for Post CMOS EraLee, B. et al. | 2009
- 863
-
Evaluation of InAs QWFET for Low Power Logic ApplicationsChang, E. / Kuo, C. / Hsu, H. / Miyamoto, Y. / Chang, C. / Wu, C. et al. | 2009
- 869
-
Translucent Polymer Solar CellsNg, G. / Vijila, C. / Goh, W. / Zhu, F. et al. | 2009
- 875
-
PV Efficiency Improved Large-area Dye-sensitized Solar CellsYin, H. / Zhang, T. / Wang, X. / Liu, L. / Wang, Y. / Liu, X. / Kang, J. et al. | 2009
- 881
-
Influence of Sulfurization Temperature on Structure and Semiconducting Properties of SnxSy Thin FilmsCheng, S. / Peng, S. / Yang, Y. et al. | 2009
- 887
-
Thin Film InP Epitaxy on Si (001) Using Selective Aspect Ratio TrappingLi, J. / Bai, J. / Hydrick, J.M. / Fiorenza, J.G. / Major, C. / Carroll, M. / Shellenbarger, Z. / Lochtefeld, A. et al. | 2009
- 895
-
Sub-micrometer Organic Field Effect TransistorsShang, L. / Liu, M. / Ji, Z. / Liu, G. / Liu, X. / Liu, J. / Wang, H. et al. | 2009
- 901
-
Resistive Switching Characteristics of MnOx-based ReRAMZhang, S. / Long, S. / Liu, Q. / Wang, Q. / Liu, M. et al. | 2009
- 907
-
FEA Based Design Optimization of Exciting Sensitivity for Micromachined Beam Ultrasonic TransducerHan, Y. / Cai, C. / Liu, Y. / Salo, A. / Xu, L. / Xie, J. et al. | 2009
- 915
-
Polysilicon Production: Reaction Engineering and Scaleup IssuesRamachandran, P.A. et al. | 2009
- 925
-
Heat and Impurity Transfer Mechanisms of Czochralski and Directional Solidification ProcessesKakimoto, K. / Chen, X. / Liu, L.J. / Miyazawa, H. / Matsuo, H. / Nakano, S. / Hisamatsu, S. / Kangawa, Y. et al. | 2009
- 935
-
Global Simulation of CZ and FZ Bulk Crystal Growth: From Quasi-Dynamic and Dynamic Modelling to Process Control and Crystal Quality OptimizationDupret, F. / Rolinsky, R. / Wu, L. / Loix, F. / De Potter, A. / Van den Bogaert, N. / Regnier, V. et al. | 2009
- 945
-
Agglomeration of Vacancies into Voids and Oxide Particles in Silicon CrystalsVoronkov, V.V. et al. | 2009
- 959
-
Atomistic-to-Continuum Modeling of Defect-Related Phenomena in Silicon CrystalsSinno, T. / Kapur, S.S. et al. | 2009
- 969
-
Challenges in Wafering Processes for Semiconductor and Solar WafersErk, H. et al. | 2009
- 983
-
Prediction of Melt-Crystal Interface Shape and Melt Convection in a Largescale CZ-Si Growth System Using RANS and LES Methods in Global SimulationLiu, X. / Liu, L. / Li, Z. / Wang, Y. / Kakimoto, K. et al. | 2009
- 989
-
Calibration of the Enthalpy-Porosity Based Method for CZ Silicon GrowthDai, B. / Devulapalli, B. / Gunjalb, P. / Kulkarni, M. et al. | 2009
- 995
-
Advances in the Understanding of Oxide Precipitate Nucleation in SiliconKissinger, G. / Kot, D. / Akhmetov, V. / Sattler, A. / Mueller, T. / Von Ammon, W. et al. | 2009
- 1001
-
Oxygen Precipitation in Heavily Phosphorus-doped Czochralski SiliconZeng, Y. / Yang, D. / Ma, X. / Zhang, X. / Lin, L. / Que, D. et al. | 2009
- 1013
-
Interactions of Cu and Ni Impurities with Vacancy-related Point Defects in Czochralski-grown Si CrystalsMarkevich, V. / Peaker, A.R. / Medvedeva, I.F. / Gusakov, V.E. / Murin, L.I. / Svensson, B.G. et al. | 2009
- 1019
-
Effect of Oxygen Precipitates in Annealed Electron Irradiated Czochralski SiliconChen, G. / Ma, X. / Bai, Y. / Cai, L. / Li, Y. et al. | 2009
- 1023
-
Modeling Multi-Crystalline Silicon Growth in Directional Solidification SystemsDevulapalli, B. / Kulkarni, M. et al. | 2009
- 1031
-
Simulation Analysis of Point Defects in Silicon Ingot during Unidirectional Solidification Process for Solar CellsChen, X. / Nakano, S. / Liu, L. / Kakimoto, K. et al. | 2009
- 1037
-
Distributions of Light Elements and Their Precipitations Grown by Unidirectional Solidification Method in Multicrystalline Silicon for Solar CellsMatsuo, H. / Hisamatsu, S. / Kangawa, Y. / Kakimoto, K. et al. | 2009
- 1043
-
Numerical Simulation of Thermal Distribution during the Directional Solidification of Polycrystalline Silicon IngotWu, D. / Sun, W. / Hao, Q. / Zhao, J. / Liu, C. et al. | 2009
- 1049
-
Performance Limitations of mc-Si Solar Cells Caused by Defect ClustersSopori, B. / Rupnowski, P. / Mehta, V. / Budhraja, V. / Johnston, S. / Call, N. / Mountinho, H. / Al-Jassim, M. / Shaikh, A. / Seacrist, M. et al. | 2009
- 1059
-
Cluster Ion Implantation System: Claris for Beyond 45nm Device Fabrication (Ii)Tanjyo, M. / Hamamoto, N. / Nagayama, T. / Umisedo, S. / Koga, Y. / Maehara, N. / Une, H. / Matsumoto, T. / Nagai, N. / Borland, J.O. et al. | 2009
- 1065
-
Silicon Etching Technology Using Inductively Coupled Plasma Suitable for Fabrication of Silicon Nanowires and Ring ResonatorsZhou, J. / Shen, H. / Zhang, H. / Liu, X. et al. | 2009
- 1071
-
The Synthesization of Si Nanocrystals Embedded in HfO2 Matrix by Electron Beam co-Evaporation TechniqueLi, W. / Jia, R. / Chen, C. / Liu, M. / Li, H.F. / Zhu, C.X. / Long, S. et al. | 2009
- 1075
-
New Structure Improves Copper Phthalocyanine (CuPc) Order and Decrease the Device ResistanceLiu, G. / Liu, M. / Shang, L. / Ji, Z. / Liu, X. / Wang, H. / Liu, J. et al. | 2009
- 1081
-
Investigating the Effects of Different Gate Biasing Voltages and Temperatures on RadFETsTang, H. / Liu, Y. / Wang, Y. / Wang, J. / Jin, Y. et al. | 2009