Transient Simulation of Frequency-Dependent Nonuniform Coupled Lossy Transmission Lines (Unknown language)

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Table of contents – Volume 17, Issue 1

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Tables of content are generated automatically and are based on records of articles contained that are available in the TIB-Portal index. Due to missing records of articles, the volume display may be incomplete, even though the whole journal is available at TIB.

3
Transient simulation of frequency-dependent nonuniform coupled lossy transmission lines
Fung-Yuel Chang, | 1994
15
Delay and reflection noise macromodeling for signal integrity management of PCBs and MCMs
Simovich, S. / Mehrotra, S. / Franzon, P. / Steer, M. | 1994
22
Design tradeoffs among MCM-C, MCM-D and MCM-D/C technologies
Iqbal, A. / Swaminathan, M. / Nealon, M. / Omer, A. | 1994
30
Physical scaling and interconnection delays in multichip modules
Frye, R.C. | 1994
38
Multilevel thin film packaging: applications and processes for high performance systems
Prasad, K. / Perfecto, E. | 1994
50
CAD-based net capacitance testing of unpopulated MCM substrates
Marshall, J. / Chong, F.C. / Modlin, D. / Westbrook, S. | 1994
56
Electrical test of multichip substrates
Economikos, L. / Morrison, T. / Crnic, F. | 1994
56
Electron Test of Multichip Substrates
Economikos, L. / Morrison, T. | 1994
62
Electron-beam MCM testing and probing
Brunner, M. / Schmid, R. / Schmitt, R. / Sturm, M. / Gessner, O. | 1994
69
Estimating the dynamic behavior of printed circuit boards
Cifuentes, A.O. | 1994
76
Automated design tool for examining microelectronic packaging design alternatives
Siew-Wei Chin, / Rajan, S.D. / Nagaraj, B.K. / Mahalingam, M. | 1994
83
Surface Mount Technology--Can Miniaturization Lead to Safety Problems?
Boden, P.J. | 1994
83
Surface mount technology-a study of safety considerations: silver migration and adhesive flammability
Boden, P.J. | 1994
91
Evaluation of low temperature snap-cure die attach materials
Mekdhanasarn, B. / Chen, A.S. / Lo, R.H.Y. | 1994
97
Errors associated with the design, calibration and application of piezoresistive stress sensors in (100) silicon
Jaeger, R.C. / Suhling, J.C. / Ramani, R. | 1994
108
Restraint Effect inLaser Welding of an Aluminum MMC
Fuersbach, P.W. / Cieslak, M.J. | 1994
108
Restraint effects in laser welding of an aluminum MMC
Fuerschbach, P.W. / Cieslak, M.J. | 1994
115
A CPU chip-on-board module
Tanaka, A. / Shinohara, H. / Yamada, K. / Honda, M. / Hatada, T. / Yamagiwa, A. / Shirai, Y. | 1994
119
Printing encapsulation systems (PES) of advanced multichip module and COB device
Okuno, A. / Nagai, K. / Oyama, N. / Hashimoto, T. / Onishi, T. / Wakamoto, S. / Masui, K. | 1994