Multiconductor Transmission Line Characterization (English)

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Table of contents – Volume 20, Issue 2

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Tables of content are generated automatically and are based on records of articles contained that are available in the TIB-Portal index. Due to missing records of articles, the volume display may be incomplete, even though the whole journal is available at TIB.

117
Study of tantalum oxide thin film capacitors on metallized polymer sheets for advanced packaging applications
Ke Chen, / Nielsen, M. / Soss, S. / Rymaszewski, E.J. / Toh-Ming Lu, / Wan, C.T. | 1997
123
Direct computation of capacitance in integrated passive components containing floating conductors
Cokkinides, G.J. / Beker, B. / Templeton, A. | 1997
129
Multiconductor transmission line characterization
Williams, D.F. | 1997
133
Etch alignment of CCD mosaic hybrid
Chapman, S.C. / Burley, G.S. / Walker, G.A.H. / Parameswaran, A. | 1997
141
Controlled solder interdiffusion for high power semiconductor laser diode die bonding
Merritt, S.A. / Heim, P.J.S. / Si Hyung Cho, / Dagenais, M. | 1997
146
The effect of solder paste viscosity on porosity and mechanical properties of surface mount solder joints
Tian, Y. / Chan, Y.C. / Lai, J.K.L. / Pak, S.T.F. | 1997
152
Thermosonic bonding of an optical transceiver based on an 8/spl times/8 vertical cavity surface emitting laser array
McLaren, T.S. / Sa Yoon Kang, / Wenge Zhang, / Teh-Hua Ju, / Yung-Cheng Lee, | 1997
152
Thermosonic Bonding of an Optical Transceiver Based on an 8 x 8 Vertical Cavity Surface Emitting Laser Array
McLaren, T.S. / Kang, S.Y. / Zhang, W. / Ju, T.-H. / Lee, Y.-C. | 1997
161
Aging studies of Cu-Sn intermetallic compounds in annealed surface mount solder joints
So, A.C.K. / Chan, Y.C. / Lai, J.K.L. | 1997
167
The effect of the oxidation of Cu-base leadframe on the interface adhesion between Cu metal and epoxy molding compound
Soon-Jin Cho, / Kyung-Wook Paik, / Young-Gil Kim, | 1997
176
Numerical Stress Analysis of Resin Cracking in LSI Plastic Packages under Temperature Cyclic Loading -- Part II: Using Alloy 42 as Leadframe Material
Saitoh, T. / Toya, M. | 1997
176
Numerical stress analysis of resin cracking in LSI plastic packages under temperature cyclic loading. II. Using alloy 42 as leadframe material
Saitoh, T. / Toya, M. | 1997
185
Call for Abstracts -- Workshop on Accelerated Stress Testing AST '97
| 1997