Status and Prospect of Cr-free Passivation for Tin-plated Sheet (Unknown)
- New search for: Cheng, X.-g.
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In:
ELECTROPLATING AND POLLUTION CONTROL
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26
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5-9
;
2006
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ISSN:
- Article (Journal) / Print
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Title:Status and Prospect of Cr-free Passivation for Tin-plated Sheet
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Contributors:
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Published in:ELECTROPLATING AND POLLUTION CONTROL ; 26 ; 5-9
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Publisher:
- New search for: CHINESE LIGHT INDUSTRY
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Publication date:2006-01-01
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Size:5 pages
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ISSN:
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Type of media:Article (Journal)
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Type of material:Print
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Language:Unknown
- New search for: 621.38 / 614.7
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Table of contents – Volume 26
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
- 1
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Status and Development of Fe-Ni-Cr Alloy ElectroplatingXu, L.-j. / Gong, Z.-q. / Du, J.-j. et al. | 2006
- 1
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Research Progress of Tin Whisker in Electroless Tin PlatingZhao, J. / Li, N. / Sun, W. et al. | 2006
- 1
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Application of Electroless Tin in Fabrication of Printed Circuit BoardsZhao, J. / Li, N. et al. | 2006
- 1
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Electrochemistry of Composite Nickel Coating in NaCl SolutionHu, H.-l. / Cheng, J.-n. / Zhu, F.-j. et al. | 2006
- 1
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Research Status of Nickel-based Composite Coatings by Brush PlatingLv, B.-l. / Gao, X.-p. / Jiang, Y.-t. et al. | 2006
- 1
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Electrodeposition of Metals in Ionic LiquidsYang, P.-x. / An, M.-z. / Liang, S.-m. et al. | 2006
- 4
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Preparation Methods and Mechanisms of Electrodeposited Nanocrystalline MaterialsTu, Z.-m. / Hu, H.-l. / Yu, Y.-c. et al. | 2006
- 5
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Developing Status of Solderable Sn Alloy PlatingGuan, L.-f. / Fan, B.-w. / Zhu, J.-z. et al. | 2006
- 5
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Electroplating Sn and Development of Its Crystal FlowerZhong, Y. / He, Y.-f. / Yan, Y. et al. | 2006
- 5
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Status and Prospect of Cr-free Passivation for Tin-plated SheetCheng, X.-g. / Li, N. / Li, D.-y. et al. | 2006
- 6
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Surface Reinforcement of Large MouldsLuo, J.-d. / Ruan, F. et al. | 2006
- 7
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Effects of Additive on the Nanocrystalline Co-Ni Alloy by Jet ElectrodepositionWang, N. / Jing, T.-f. / Qiao, G.-y. et al. | 2006
- 8
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A Discussion on Some Theoretical Problems in Barrel PlatingWu, S.-c. et al. | 2006
- 8
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Influences of Pulse Plating and DC Plating on the Performance of Tungsten CoatingGao, Y.-h. / Li, Y.-g. et al. | 2006
- 8
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A Brief Discussion on Brighteners for Zincate Zinc PlatingZhou, C.-h. / Chen, S. et al. | 2006
- 8
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Effects of Pulse Parameters on the Quality of Ni-SiC Nano Composite CoatingsWu, H. / Chen, Y. / Li, X.-s. et al. | 2006
- 10
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Progress of the Solutions for Stripping Metal Coatings on Plating HangersSun, Y.-h. / Tang, H. et al. | 2006
- 11
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A Study of Sulfite Au-Co Alloy ElectroplatingGuo, C.-z. / Liang, C.-h. / Yang, C.-j. et al. | 2006
- 11
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Effects of Dispersants on the Dispersion of Nano-alumina in (Zn-Ni)-Al~2O~3 Composite PlatingZheng, H.-y. / An, M.-z. / Chen, L. et al. | 2006
- 11
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A Study of Cyanide-free Gold Plating ProcessCao, R.-p. / Xiao, S.-m. et al. | 2006
- 11
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A Study of Hard Chromium Plating in Trivalent Chromium Bath and Its PerformanceZeng, Z.-x. / Li-ping, W. / Chen, L. et al. | 2006
- 11
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Troubleshooting for Sn-Pb Plating of ConnectorsGuan, L.-f. / Fan, B.-w. et al. | 2006
- 13
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A Study of Ni-Fe Alloy Brush Plating with Dissoluble AnodeZhang, Y.-f. et al. | 2006
- 13
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A Method of Preparing Burr Nickel Plated Deep Drawn Steel StripChen, H.-h. / Peng, P.-f. / Xiao, X.-l. et al. | 2006
- 14
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The Influences of Additives on Hardness of Acid Hard Copper PlatingWang, Q.-h. / Xie, H.-b. / Ma, X.-k. et al. | 2006
- 14
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Hard Chromium Plating for Different Kinds of PartsZhang, S.-l. et al. | 2006
- 14
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A Novel Alkaline Cyanide-free Zinc Plating ProcessChen, Y. et al. | 2006
- 14
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Ratio Imbalance Problems in Using Electroplating AssistantsYuan, S.-p. et al. | 2006
- 15
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Applications of Surfactants in ElectroplatingGuo, G.-c. et al. | 2006
- 16
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Applications of Large-area Nickel-based Alloys Brush Plating on Iron and Steel SurfaceMa, Z.-y. / Fei, J.-y. et al. | 2006
- 16
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A Study of W-Co Alloy ElectroplatingLi, Y. et al. | 2006
- 17
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Effects of the Technological Conditions of Low Temperature Electroless Tin Plating on the Thickness of Tin CoatingSun, W. / Li, N. / Zhao, J. et al. | 2006
- 18
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Ni-W Alloy Plating on DiesZhang, C.-x. / Zhou, M.-g. et al. | 2006
- 18
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A Study of Pretreatment for Electroless Nickel Plating on Aluminum SubstrateLei, M. / Wan, J.-g. / Wan, D.-l. et al. | 2006
- 18
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A Research on Electrochemically Green Coloration of Stainless SteelZhang, S.-l. / Chen, S.-b. / Wang, X.-b. et al. | 2006
- 19
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Plating on Zinc Alloy DiecastingCheng, L. et al. | 2006
- 19
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A Study of Electroless Ni-Fe-B-La Alloy PlatingYang, L.-l. / Xuan, T.-p. / Ju, Z.-t. et al. | 2006
- 20
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A Discussion on Cadium Plating on Alumium and It's AlloysWu, W.-m. / Cheng, H.-y. et al. | 2006
- 20
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A Process for Chromating on AluminumLu, P.-y. et al. | 2006
- 20
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Effects of Stabilizers on the Stability of Electroless Nickel Bath and the Deposit PerformanceLiu, H.-p. / Li, N. / Bi, S.-f. et al. | 2006
- 20
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Electroless Silver Plating on Polyurethane Foaming PlasticLi, H.-f. / Wang, Y.-h. / Zhang, X.-s. et al. | 2006
- 22
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A Research on the Cleanness of the Chemical Conversion Coating on BrassPeng, Y.-t. et al. | 2006
- 22
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Application of Electroless Composite (Ni-P)-PTFE Plating in Moulds for Ceramic ProductsLiu, H.-p. / Luo, J.-d. / Ruan, F. et al. | 2006
- 23
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A Study of Electroless Nickel Plating for Magnesium AlloysGuo, Y.-t. / Li, J.-s. et al. | 2006
- 23
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A Study of Electroless Nickel Plating with Pd-free ActivationChen, J. / Zhu, A.-p. et al. | 2006
- 23
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Solderable Bright Nickel PlatingChen, Y.-h. et al. | 2006
- 23
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Research on Self-Lubricating Coating with Electroless Composite (Ni-Co-P)-MoS~2 CoatingTang, H.-k. / Zhang, D.-n. / Li, Y.-t. et al. | 2006
- 23
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Effects of Duty Cycle on the Formation of Microarc Oxide Films on Titanium Alloy in Different Control ModesHu, Z.-c. / Xie, F.-q. / Wu, X.-q. et al. | 2006
- 24
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High Speed Bright Electroless Nickel PlatingHe, X.-h. / Liu, Y.-z. / Gu, Y.-q. et al. | 2006
- 25
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A Study of Electroless (Ni-P)-CeO~2 Composite PlatingLi, Y. et al. | 2006
- 25
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A Study of Electroless Nickel Plating with Composite Coordination AgentsLi, B.-j. / Li, X. / Yang, C.-y. et al. | 2006
- 25
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A Research on the Internal Stress of Electroless Ni-P Alloy CoatingsWang, X.-b. / Xie, H. et al. | 2006
- 26
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A Study of Stabilizers for Electroless Ni-Cu-P Alloy Plating by Mixed Potential TheoryMa, M.-r. / Deng, S.-t. / Wang, G.-x. et al. | 2006
- 26
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Environment-Friendly Anodizing Process for Magnesium AlloysLi, J.-s. / Tang, H.-l. / Qiu, C.-y. et al. | 2006
- 27
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Slow Tensile Property of the Electroless Nickel on Spring SteelLi, Y. / Feng, W.-j. / Lin, Y.-q. et al. | 2006
- 28
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Effects of Power Wave Form on Brush PlatingLuo, J.-d. / Ruan, F. / Yan, J.-w. et al. | 2006
- 28
-
A Research on the Corrosion Resistance of Clear Chromate Coating for Potassium Chloride Zinc PlatingKong, Z.-b. / Hai, H.-a. / Zhang, S.-b. et al. | 2006
- 28
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Pretreatment for Zinc Surface CoatingTang, C.-h. / Tang, B. et al. | 2006
- 28
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Preparation of Highly Ordered Porous Anodic Alumina FilmYang, P.-x. / An, M.-z. / Guo, H.-f. et al. | 2006
- 29
-
A Study of New Brass Pickling Technology Using Super Lower Nitric AcidYang, Y. / Li, X.-s. et al. | 2006
- 29
-
A Study of Coloring Process for Aluminum AnodizationKuang, Y.-f. / Zhang, P. / Luo, P. et al. | 2006
- 30
-
Common Troubleshooting for Electrophoresis Coatings on Car BodyChang, F.-q. et al. | 2006
- 31
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A Study of Pickling for Removal of Thick Oxide ScaleZhang, P. / Zhang, H. / Ran, H.-w. et al. | 2006
- 31
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Phenomenon of Crystal Whisker in Zincate Process and Exploration of Its ReasonsJiang, L.-m. / Li, N. / Huang, X.-m. et al. | 2006
- 31
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Chemical Deburring Process for High-Carbon Steel PartsDing, J.-g. / Li, B.-l. / Shi, Z.-f. et al. | 2006
- 31
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A Study of Chemical Blackening of Aluminium AlloysPeng, Y.-t. et al. | 2006
- 33
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A Study of Environment-friendly Acid Pickling Solution for Magnesium AlloysGuo, Y.-t. / Li, J.-s. / Chen, K.-j. et al. | 2006
- 33
-
A Study of Properties of Oxide Film by Pulse Current Anodizing Aluminum and Its AlloyYang, C.-l. et al. | 2006
- 33
-
Troubleshooting for Powder SprayingTang, C.-h. / Tang, B. et al. | 2006
- 33
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Measurement of Coating and Oxide Film Thickness by Microscopical MethodZhang, D.-z. et al. | 2006
- 33
-
Thermodynamics Analysis on the Nucleation and Phase Transition Behavior of Al Alloy during Microarc Fuse and SolidificationZhao, Z.-l. / Liu, Y.-y. / He, Y.-s. et al. | 2006
- 34
-
Polishing of Stainless SteelZhang, S.-l. / Wang, X.-p. / Chen, S.-p. et al. | 2006
- 35
-
Ion Plating as the Substitutive Technique of ElectroplatingChen, B.-q. / Dong, C. / Huang, L. et al. | 2006
- 36
-
Electroplating Wastewater Reducing TechnologyWang, W.-p. et al. | 2006
- 36
-
Determination of Chromium (VI) in Electroplating Wastewater by Resonance Light ScatteringZhong, M.-h. et al. | 2006
- 36
-
A Research on Microhardness of Ni-ZrO~2 Nano Composite Deposits Electroformed under Direct and Pulse CurrentsZhang, W.-f. / Zhu, D. et al. | 2006
- 36
-
An Example of Troubleshooting for Acid Bright Copper PlatingTian, C.-c. / Tian, X.-m. et al. | 2006
- 36
-
Ion Exchange Technology and Nickel Electroplating Wastewater TreatmentFu, D. et al. | 2006
- 36
-
A Study of the Regeneration of FeCl~3 Etching SolutionLiu, P. / Du, Y.-g. / Zhang, W.-j. et al. | 2006
- 37
-
Hard Chromium Plating for Common MetalsWang, W.-z. et al. | 2006
- 38
-
Determination of Photocatalyst TiO~2 in Composite CoatingsQi, X.-h. / Wang, H.-j. / Yang, F.-x. et al. | 2006
- 38
-
Applications of PAM Anionic Flocculent in Treating of Heavy Metal Containing WastewatersChu, R.-b. / Chu, C.-j. et al. | 2006
- 39
-
Improvement on Olive Green Passivation Process for Zincate Zinc PlatingLi, B.-j. et al. | 2006
- 39
-
Application of Heavy Metal Chelate in Treatment of Cu Containing PCB WastewaterFeng, A.-h. / Chi, D.-m. et al. | 2006
- 40
-
Troubleshooting for Hard Anodization of Wing PanelsWu, P.-f. et al. | 2006
- 40
-
Electroless Nickel Plating on Nd-Fe-B MaterialLuo, J.-d. et al. | 2006
- 40
-
A Brife Discussion about the Practice of Potassium Chloride Zinc PlatingWen, S.-x. et al. | 2006
- 40
-
Two Cases of the Troubles in Zinc PlatingXi, B. et al. | 2006
- 41
-
Direct Silver Plating on Copper AlloyCheng, Y.-h. et al. | 2006
- 41
-
Cleaner Production in Electronics FinishingChen, C.-c. et al. | 2006
- 41
-
Barrier Plating Process for Tinplated Copper WireWang, M.-f. et al. | 2006
- 41
-
Research and Applications of Dehyrated Antirust OilTang, C.-h. / Tang, B. et al. | 2006
- 42
-
A Brief Discussion on Discoloration of Barrel Plated Fog-like Sulfate Tin CoatingWeng, Y.-s. et al. | 2006
- 42
-
Applications of Trivalent Chromium Passivation in ProductionLi, X.-y. et al. | 2006
- 42
-
A Comparision of the Additives for KCl Zinc Electroplating of Different SystemsZhang, W.-q. et al. | 2006
- 43
-
Surface Cleaning Engineering of the 21st CenturyFei, X.-y. et al. | 2006
- 43
-
Chemical Polishing of Stainless SteelWang, W.-z. et al. | 2006
- 43
-
Cases of Anode Condition Affecting Electroplating ProductionZhang, S.-l. et al. | 2006
- 44
-
Troubleshooting for Low-Chromium Chromatizing in Zinc PlatingXi, B. et al. | 2006
- 44
-
Barrel Plating of White Cu-Sn AlloyLv, J.-c. et al. | 2006
- 44
-
Black Phosphating Process for Cast-Iron FittingsTang, C.-h. / Tang, B. et al. | 2006
- 45
-
Chemical Conversion Coating Process for Zinc Alloy Die CastingsWen, S.-x. et al. | 2006
- 45
-
A Brief Discussion on Some Troubleshooting Cases in AnodizationChou, Q.-x. et al. | 2006
- 45
-
A Process for Plating Antique TinTao, S. et al. | 2006
- 45
-
Nickel-free Gun-Color PlatingTao, S. et al. | 2006
- 46
-
Black Cobalt Barrel PlatingLv, J.-c. et al. | 2006
- 46
-
Ruthenium Plating for Reed PipeLiu, Y.-l. et al. | 2006
- 46
-
A Troubleshooting in Cynide Silver PlatingKong, Z.-b. / Hai, H.-a. / Mei, R. et al. | 2006
- 46
-
Removal of Organic Impurities from Potassium Salt Zinc Plating BathCai, Y.-x. / Ren, G.-c. / Jia, Y.-x. et al. | 2006
- 47
-
A Brief Discussion on Reasonable Use of Water in Electroplating IndustryChen, Y.-f. et al. | 2006
- 47
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A Brief Discussion on Determination of Nickel by Dimethylglyoxime Colorimetric MethodWu, Q.-h. et al. | 2006
- 47
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A Brief Discussion about Pores of Chromium CoatingXi, B. et al. | 2006
- 47
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A Mordern Alkaline Cynide-free Zinc PlatingYu, X.-y. et al. | 2006
- 48
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Some Troubleshooting Cases of ElectroplatingChen, W.-c. et al. | 2006
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Some Cases of Electroplating TroubleshootingChen, W.-c. et al. | 2006