Special issue for the 2017 IEEE International Symposium on EMC + SIPI (English)
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- New search for: Spadacini, Giordano
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2018
- Conference Proceedings / Print
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Title:Special issue for the 2017 IEEE International Symposium on EMC + SIPI
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Contributors:Spadacini, Giordano ( editor ) / Fan, Jun ( editor ) / IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity ( author ) / IEEE Electromagnetic Compatibility Society ( organizer )
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Conference:IEEE International Symposium on EMC + SIPI ; 2017 ; Washington, DC
IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity ; 2017 ; Washington, DC -
Published in:IEEE transactions on electromagnetic compatibility ; volume 60, number 4, part II (August 2018)
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Publisher:
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Place of publication:Piscataway, NJ
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Publication date:2018
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Size:Seite 1036-1146
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Remarks:Illustrationen, Diagramme
Vorwort: Presented at the IEEE International Symposium on Electromagnetic Compatibility (EMC), Signal and Power Integrity (SIPI), held in Washington, DC, USA, in August 2017. -
Type of media:Conference Proceedings
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Type of material:Print
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Language:English
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Source: