REDUCED INTEGRATED CIRCUIT PACKAGE LID HEIGHT (English)

2012
  • Patent  /  Electronic Resource

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One embodiment of the present invention sets forth an integrated circuit package that includes a substrate, one or more devices mounted on the substrate, and a lid having a top portion and an end portion and configured to encapsulate the one or more devices. The top portion is thinner than the end portion. One advantage of the disclosed design is that the overall height of an IC package may be reduced without significantly impacting the structural integrity or co-planarity of the IC package.

  • Title:
    REDUCED INTEGRATED CIRCUIT PACKAGE LID HEIGHT
  • Patent number:
    US2014117527
  • Application date:
    2012-11-01
  • Patent applicant:
  • Patent family:
  • Author / Creator:
  • Publisher:
    Europäisches Patentamt
  • Year of publication:
    2012
  • Type of media:
    Patent
  • Type of material:
    Electronic Resource
  • Language:
    English
  • Classification:
    IPC:    H01L Halbleiterbauelemente, SEMICONDUCTOR DEVICES
  • Source:
    European Patent Office