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Title:用于半导体晶片的贯通开口的保护方法
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Patent number:CN112447881
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Patent family:
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Publisher:
- New search for: Europäisches Patentamt
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Publication date:2023-12-05
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Type of media:Patent
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Type of material:Electronic Resource
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Language:Chinese
- New search for: H01L
- Further information on International Patent Classification
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Classification:
IPC: H01L Halbleiterbauelemente, SEMICONDUCTOR DEVICES -
Source: