Packaging structure including interconnecs and packaging method thereof (English)
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- New search for: WANG CHONG
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2019
- Patent / Electronic Resource
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Title:Packaging structure including interconnecs and packaging method thereof
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Patent number:US10236273
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Patent applicant:
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Patent family:
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Contributors:
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Publisher:
- New search for: Europäisches Patentamt
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Publication date:2019-03-19
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Type of media:Patent
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Type of material:Electronic Resource
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Language:English
- New search for: H01L
- Further information on International Patent Classification
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Classification:
IPC: H01L Halbleiterbauelemente, SEMICONDUCTOR DEVICES -
Source: