METHOD AND STRUCTURE FOR DIE BONDING USING ENERGY BEAM (English)
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2020
- Patent / Electronic Resource
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Title:METHOD AND STRUCTURE FOR DIE BONDING USING ENERGY BEAM
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Patent number:US2020243737
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Patent applicant:
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Patent family:
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Contributors:HSIEH MIN-HSUN ( author ) / LIAO SHIH-AN ( author ) / SU YING-YANG ( author ) / LIU HSIN-MAO ( author ) / WANG TZU-HSIANG ( author ) / PU CHI-CHIH ( author )
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Publisher:
- New search for: Europäisches Patentamt
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Publication date:2020-07-30
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Type of media:Patent
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Type of material:Electronic Resource
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Language:English
- New search for: H01L
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Classification:
IPC: H01L Halbleiterbauelemente, SEMICONDUCTOR DEVICES -
Source: