Anodic Bonding of a Substrate of Glass having Contact Vias to a Substrate of Silicon (English)
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2020
- Patent / Electronic Resource
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Title:Anodic Bonding of a Substrate of Glass having Contact Vias to a Substrate of Silicon
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Patent number:US2020258862
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Patent applicant:
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Patent family:
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Contributors:
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- New search for: Europäisches Patentamt
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Publication date:2020-08-13
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Type of media:Patent
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Type of material:Electronic Resource
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Language:English
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Classification:
IPC: H01L Halbleiterbauelemente, SEMICONDUCTOR DEVICES -
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