Packaging for Next Generation Automotive Electronics (English)

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This paper describes the packaging impacts of forecast advances in automotive electronics in two significant areas: The need for a much higher processing performance than is currently found in automotive applications. The need for a much higher network performance within a vehicle. In particular, the thermal and EMC issues resulting from these advances are discussed, and practical, cost effective, automotive relevant, solutions are proposed. To illustrate these issues in a realistic situation, a prototype implementation of a network vehicle controller has been developed.