Prediction of electromigration-void formation in copper conductors based on the electron configuration of matrix and solute atoms (English)
- New search for: Zehe, A.
- New search for: Zehe, A.
In:
MICROELECTRONICS RELIABILITY
;
42
, 12
;
1849-1855
;
2002
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ISSN:
- Article (Journal) / Print
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Title:Prediction of electromigration-void formation in copper conductors based on the electron configuration of matrix and solute atoms
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Contributors:Zehe, A. ( author )
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Published in:MICROELECTRONICS RELIABILITY ; 42, 12 ; 1849-1855
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Publisher:
- New search for: Elsevier Science B.V., Amsterdam.
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Publication date:2002-01-01
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Size:7 pages
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ISSN:
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Type of media:Article (Journal)
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Type of material:Print
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Language:English
- New search for: 621.381
- Further information on Dewey Decimal Classification
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Classification:
DDC: 621.381 -
Source:
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Table of contents – Volume 42, Issue 12
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
- 1823
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Atomic-layer-deposited silicon-nitride-SiO2 stack--a highly potential gate dielectrics for advanced CMOS technologyNakajima, Anri et al. | 2002
- 1823
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Atomic-layer-deposited silicon-nitride/SiO2 stack - a high potential gate dielectric for advanced CMOS technologyNakajima, A. / Khosru, Q.D.M. / Yoshimoto, T. / Yokoyama, S. et al. | 2002
- 1837
-
Solder joint reliability of a polymer reinforced wafer level packageKim, Deok-Hoon et al. | 2002
- 1849
-
Prediction of electromigration-void formation in copper conductors based on the electron configuration of matrix and solute atomsZehe, A. et al. | 2002
- 1857
-
An analytical effective channel-length modulation model for velocity overshoot in submicron MOSFETs based on energy-balance formulationLim, K.Y. et al. | 2002
- 1865
-
On the correlation between radiation-induced oxide- and border-trap effects in the gate-oxide nMOSFET'sDjezzar, Boualem et al. | 2002
- 1875
-
On-state and off-state stress-induced degradation in unhydrogenated solid phase crystallized polysilicon thin film transistorsKouvatsos, Dimitrios N. et al. | 2002
- 1883
-
Effect of substrate flexibility on solder joint reliabilityLiu, Xingsheng et al. | 2002
- 1893
-
The optimization design of bump interconnections in flip chip packages from the electrical standpointLiu, De-Shin et al. | 2002
- 1903
-
Procedure for design optimization of a T-cap flip chip packageNi, Chin-Yu et al. | 2002
- 1913
-
Anisotropic conductive film flip chip joining using thin chipsJokinen, Erja et al. | 2002
- 1921
-
Failure criteria of flip chip joints during accelerated testingStepniak, Frank et al. | 2002
- 1931
-
Reliability studies and design improvement of mirror image CSP assemblyXie, Dongji et al. | 2002
- 1939
-
Encapsulation of naked dies for bulk silicon etching with TMAHLiebert, Silke et al. | 2002
- 1945
-
Study of short-circuiting between adjacent joints under electric field effects in fine pitch anisotropic conductive adhesive interconnectsChiu, Y.W. et al. | 2002
- 1953
-
Thin film, thick film microstrip band pass filter: a comparison and effect of bulk overlayRane, Sunit et al. | 2002
- 1959
-
Aging of the over-voltage protection elements caused by over-voltagesOsmokrovic, Predrag et al. | 2002
- 1967
-
Analysis of burn-in time using the general law of reliabilityBaskin, E.M. et al. | 2002
- 1975
-
Testing process capability for one-sided specification limit with application to the voltage level translatorLin, P.C. et al. | 2002
- 1985
-
Ultra-shallow n+p junction formed by PH3 and AsH3 plasma immersion ion implantationYang, B.L. et al. | 2002
- 1991
-
An IGBT DC subcircuit model with non-destructive parameters extraction and comparison with measurementsYuan, Shoucai et al. | 2002
- 1997
-
Open contact analysis of single bit failure in 0.18 mu m technologySong, Zhigang / Dai, Jiyan / Redkar, S. et al. | 2002
- 1997
-
Open contact analysis of single bit failure in 0.18 mm technologySong, Z. / Dai, J. / Redkar, S. et al. | 2002
- 1997
-
Open contact analysis of single bit failure in 0.18 (micro)m technologySong, Zhigang et al. | 2002
- 2003
-
On the analytical description of ageing kinetics in ceramic manganite-based NTC thermistorsBalitska, V.O. et al. | 2002
- 2009
-
Integrated process capability analysis with an application in backlight moduleHuang, M.L. et al. | 2002
- 2029
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Author Index to Volume 42| 2002
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International IEEE conference on the business of electronic product reliability and liability| 2002