Effectiveness of a hardware-based approach to detect resistive-open defects in SRAM cells under process variations (English)
- New search for: Gomez, A.F.
- New search for: Lavratti, F.
- New search for: Medeiros, G.
- New search for: Sartori, M.
- New search for: Poehls, L. Bolzani
- New search for: Champac, V.
- New search for: Vargas, F.
- New search for: Gomez, A.F.
- New search for: Lavratti, F.
- New search for: Medeiros, G.
- New search for: Sartori, M.
- New search for: Poehls, L. Bolzani
- New search for: Champac, V.
- New search for: Vargas, F.
In:
Microelectronics and reliability
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67
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150-158
;
2016
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ISSN:
- Article (Journal) / Print
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Title:Effectiveness of a hardware-based approach to detect resistive-open defects in SRAM cells under process variations
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Contributors:Gomez, A.F. ( author ) / Lavratti, F. ( author ) / Medeiros, G. ( author ) / Sartori, M. ( author ) / Poehls, L. Bolzani ( author ) / Champac, V. ( author ) / Vargas, F. ( author )
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Published in:Microelectronics and reliability ; 67 ; 150-158
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Publisher:
- New search for: Elsevier Science B.V., Amsterdam.
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Publication date:2016-01-01
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Size:9 pages
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ISSN:
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Type of media:Article (Journal)
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Type of material:Print
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Language:English
- New search for: 621.3815
- Further information on Dewey Decimal Classification
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Classification:
DDC: 621.3815 -
Source:
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Table of contents – Volume 67
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
- 1
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To the Special section constructed from the selected papers of Thermal investigations of integrated circuits and systems, THERMINIC’15Rencz, Marta et al. | 2016
- 2
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Impact of thinning stacked dies on the thermal resistance of bump-bonded three-dimensional integrated circuitsMelamed, Samson / Watanabe, Naoya / Nemoto, Shunsuke / Shimamoto, Haruo / Kikuchi, Katsuya / Aoyagi, Masahiro et al. | 2016
- 9
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The distributed thermal model of fin field effect transistorZubert, Mariusz / Raszkowski, Tomasz / Samson, Agnieszka / Janicki, Marcin / Napieralski, Andrzej et al. | 2016
- 15
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Analysis of nonlinear heat exchange phenomena in natural convection cooled electronic systemsDe Mey, Gilbert / Torzewicz, Tomasz / Kawka, Piotr / Czerwoniec, Andrzej / Janicki, Marcin / Napieralski, Andrzej et al. | 2016
- 21
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Enhanced thermal characterization method of microscale heatsink structuresTakács, G. / Szabó, P.G. / Bognár, Gy. et al. | 2016
- 29
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The influence of the phosphor layer as heat source and up-stream thermal masses on the thermal characterization by transient thermal analysis of modern wafer level high power LEDsLiu, E / Hanss, Alexander / Schmid, Maximilian / Elger, Gordon et al. | 2016
- 38
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Advanced thermal simulation of SiGe:C HBTs including back-end-of-lined'Alessandro, Vincenzo / Magnani, Alessandro / Codecasa, Lorenzo / Rinaldi, Niccolò / Aufinger, Klaus et al. | 2016
- 46
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Multilevel logic and thermal co-simulationJani, Lázár / Poppe, András et al. | 2016
- 54
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Experimental characterization of the predictive thermal behaviour model of a surface-mounted soft magnetic composite inductorMonier-Vinard, Eric / Rogié, Brice / Dia, Cheikh Tidiane / Bissuel, Valentin / Laraqi, Najib / Daniel, Olivier / Kotelon, Marie-Cécile / Fahad, Aben-Ibrahim et al. | 2016
- 64
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Analysis of aging effects - From transistor to system levelTaddiken, Maike / Hellwege, Nico / Heidmann, Nils / Peters-Drolshagen, Dagmar / Paul, Steffen et al. | 2016
- 74
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The impact of BTI aging on the reliability of level shifters in nano-scale CMOS technologyHalak, Basel / Tenentes, Vasileios / Rossi, Daniele et al. | 2016
- 82
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A 2D compact model for lightly doped DG MOSFETs (P-DGFETs) including negative bias temperature instability (NBTI) and short channel effects (SCEs)Samy, Omnia / Abdelhamid, Hamdy / Ismail, Yehea / Zekry, Abdelhalim et al. | 2016
- 89
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Influence of fin number on hot-carrier injection stress induced degradation in bulk FinFETsZhang, Wenqi / Wang, Tzuo-Li / Huang, Yan-Hua / Cheng, Tsu-Ting / Chen, Shih-Yao / Li, Yi-Ying / Hsu, Chun-Hsiang / Lai, Chih-Jui / Yeh, Wen-Kuan / Yang, Yi-Lin et al. | 2016
- 94
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Enhancement of light-emitting diode reliability using silicone microsphere in encapsulantJang, Inseok / Kim, Wan-Ho / Jeon, Sie-Wook / Kim, Hyeon / Kim, Jae-Pil et al. | 2016
- 99
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Rail to rail radiation hardened operational amplifier in standard CMOS technology with standard layout techniquesAgostinho, Peterson R. / Gonçalez, Odair L. / Wirth, Gilson et al. | 2016
- 104
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Study of total ionizing dose induced read bit errors in magneto-resistive random access memoryZhang, Haohao / Bi, Jinshun / Wang, Haibin / Hu, Hongyang / Li, Jin / Ji, Lanlong / Liu, Ming et al. | 2016
- 111
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Similarity approach for reducing qualification tests of electronic componentsStoyanov, Stoyan / Bailey, Chris / Tourloukis, Georgios et al. | 2016
- 120
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Failure and stress analysis of through-aluminum-nitride-via substrates during thermal reliability tests for high power LED applicationsTsai, M.Y. / Lin, C.H. / Chuang, K.F. / Chang, Y.H. / Wu, C.T. / Hu, S.C. et al. | 2016
- 129
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X-ray inspection of TSV defects with self-organizing map network and Otsu algorithmShen, Junjie / Chen, Pengfei / Su, Lei / Shi, Tielin / Tang, Zirong / Liao, Guanglan et al. | 2016
- 135
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Constitutive modeling of solder alloys for drop-impact applicationsWong, E.H. / Chrisp, J. / Selvanayagam, C.S. / Seah, S.K.W. et al. | 2016
- 143
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Statistical distributions of row-hammering induced failures in DDR3 componentsPark, Kyungbae / Yun, Donghyuk / Baeg, Sanghyeon et al. | 2016
- 150
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Effectiveness of a hardware-based approach to detect resistive-open defects in SRAM cells under process variationsGomez, A.F. / Lavratti, F. / Medeiros, G. / Sartori, M. / Poehls, L. Bolzani / Champac, V. / Vargas, F. et al. | 2016
- 159
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Corrigendum to “A subgap density of states modeling for the transient characteristics in oxide-based thin-film transistors” [Microelectron. Reliab. 60 (2016) 67–69]Wang, Weiliang / Khan, Karim / Zhang, Xingye / Qin, Haiming / Jiang, Jun / Miao, Lijing / Jiang, Kemin / Wang, Pengjun / Dai, Mingzhi / Chu, Junhao et al. | 2016
- IFC
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Editorial board| 2016