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Modern Electroplating [2010]
- 1
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Fundamental Considerations
- 33
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Electrodeposition of Copper
- 79
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Electrodeposition of Nickel
- 115
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Electrodeposition of Gold
- 131
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Electroless and Electrodeposition of Silver
- 139
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Tin and Tin Alloys for Lead‐Free Solder
- 205
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Electrodeposition of Chromium
- 249
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Electrodeposition of Lead and Lead Alloys
- 265
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Electrodeposition of Tin–Lead Alloys
- 285
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Electrodeposition of Zinc and Zinc Alloys
- 309
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Electrodeposition of Iron and Iron Alloys
- 327
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Palladium Electroplating
- 369
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Electrochemical Deposition Process for ULSI Interconnection Devices
- 383
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Electrodeposition of Semiconductors
- 413
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Deposition on Nonconductors
- 421
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Conductive Polymers: Electroplating of Organic Films
- 433
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Electroless Deposition of Copper
- 447
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Electroless Deposition of Nickel
- 459
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Electrochemical Synthesis of Metal Alloys for Magnetic Recording Systems
- 477
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Electroless Deposition of Palladium and Platinum
- 483
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Electroless Deposition of Gold
- 499
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Electroless Deposition of Alloys
- 507
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Preparation for Deposition
- 513
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Manufacturing Tools
- 527
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Monitoring and Control
- 555
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Environmental Aspects of Electrodeposition
- 573
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Applications to Magnetic Recording and Microelectronic Technologies
- 617
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Microelectromechanical Systems
- 637
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Analysis of Electroplated Films Using Dual‐Beam FIB/SEM and TEM Techniques
- 665
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Ionic Liquid Treatments for Enhanced Corrosion Resistance of Magnesium‐Based Substrates
- 687
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Appendix
- 701
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Index
- i
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Frontmatter
