E-Books durchsuchen
Foldable Flex and Thinned Silicon Multichip Packaging Technology [2003]
- 1
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3-D Assemblies of Stacked Chips and other Thin Packages
- 15
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Multi-Chip Carriers in a System-on-a Chip-World
- 49
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Packaging Technologies for Flexible Systems
- 69
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Low-Profile and Flexible Electronic Assemblies Using Ultra-Thin Silicon — The European FLEX-SI Project
- 101
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Thin Chips for Flexible and 3D-Integrated Electronic Systems
- 149
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Flexible, Microarray Interconnection Technique Applied to Biomedical Microdevices
- 177
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Folded Flex and other Structures for System-in-a-Package
- 217
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Valtronic CSP3D
- 235
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3D Packaging Technologies: Are Flex Based Solutions the Answer?
- 247
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Availability of High Density Interconnect Flexible Circuits
- 257
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Recent Advancements in Flex Circuit Technology Using Liquid Crystal Polymer Substrates
- 289
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Flex and the Interconnected Mesh Power System (IMPS)
- 311
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Thermal Management and Control of Electromagnetic Emissions
- 327
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Conclusion