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Foldable Flex and Thinned Silicon Multichip Packaging Technology [2003]

1
3-D Assemblies of Stacked Chips and other Thin Packages
15
Multi-Chip Carriers in a System-on-a Chip-World
49
Packaging Technologies for Flexible Systems
69
Low-Profile and Flexible Electronic Assemblies Using Ultra-Thin Silicon — The European FLEX-SI Project
101
Thin Chips for Flexible and 3D-Integrated Electronic Systems
149
Flexible, Microarray Interconnection Technique Applied to Biomedical Microdevices
177
Folded Flex and other Structures for System-in-a-Package
217
Valtronic CSP3D
235
3D Packaging Technologies: Are Flex Based Solutions the Answer?
247
Availability of High Density Interconnect Flexible Circuits
257
Recent Advancements in Flex Circuit Technology Using Liquid Crystal Polymer Substrates
289
Flex and the Interconnected Mesh Power System (IMPS)
311
Thermal Management and Control of Electromagnetic Emissions
327
Conclusion
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