Microelectronic engineering : an international journal of semiconductor manufacturing technology
Die Inhaltsverzeichnisse werden automatisch erzeugt und basieren auf den im Index des TIB-Portals verfügbaren Einzelnachweisen der enthaltenen Beiträge. Die Anzeige der Inhaltsverzeichnisse kann daher unvollständig oder lückenhaft sein.
Inhaltsverzeichnis
- 1969
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Interfacial reaction and shear strength of SnAgCu–xNi/Ni solder joints during aging at 150°CYao, Pei / Liu, Ping / Liu, Jim et al. | 2008
- 1969
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Interfacial reaction and shear strength of SnAgCu-xNi/Ni solder joints during aging at 150 deg CYao, Pei / Liu, Ping / Liu, Jim et al. | 2009
- 1969
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Interfacial reaction and shear strength of SnAgCu-xNi/Ni solder joints during aging at 150degreeCYao, P. / Liu, P. / Liu, J. et al. | 2009
- 1975
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Computational and experimental investigation on the performance characteristics of the micro gas compressorYoon, Jae Sung / Choi, Jong Won / Kim, Min Soo et al. | 2008
- 1983
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Development of a very large-area ultraviolet imprint lithography processKim, Ki-don / Jeong, Jun-ho / Park, Sang-hu et al. | 2008
- 1989
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MicroPen direct-write deposition of polyimideCao, Yu / Zhou, Liangwen / Wang, Xiaoye et al. | 2008
- 1994
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Influences of bottom electrode TaN on electrical characteristics for metal–HfO2–metal capacitorsKang, Tsung-Kuei / Chang, Chia-Tung / Lin, Cheng-Li et al. | 2009
- 1999
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Analysis of nitride storage non-volatile memories with HfSiOx blocking dielectric and TiN metal gate for low power embedded applicationsGolubović, Dušan S. / van Duuren, Michiel J. / Akil, Nader et al. | 2009
- 2005
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Two dimensional simulation and analytical modeling of a novel ISE MOSFET with gate stack configurationKaur, Ravneet / Chaujar, Rishu / Saxena, Manoj et al. | 2008
- 2015
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Large area nanosize array stamp for UV-based nanoimprint lithography fabricated by size reduction processLi, Xiaoli / Wang, Qingkang / Zhang, Jing et al. | 2008
- 2020
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Fabrication and characterization of surface micromachined stacked transformer on glass substrateYunas, Jumril / Hamzah, Azrul Azlan / Majlis, Burhanuddin Yeop et al. | 2008
- 2026
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Environmentally sustainable composite resistors with low temperature coefficient of resistanceJagtap, Shweta / Rane, Sunit / Amalnerkar, Dinesh et al. | 2008
- 2030
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N-channel thin-film transistors constructed on plastic by solution processes of HgSe nanocrystalsJang, Jaewon / Cho, Kyoungah / Yun, Junggwon et al. | 2009
- 2034
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Characterization of ZrO2 thin films deposited by MOCVD for high-density 3D capacitorsBrunet, Magali / Scheid, Emmanuel / Galicka-Fau, Karolina et al. | 2009
- 2038
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Electrochemical behavior of copper and cobalt in post-etch cleaning solutionsBilouk, S. / Broussous, L. / Nogueira, R.P. et al. | 2009
- 2045
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Formation of Ge nanocrystals in a silicon dioxide layer using pulsed plasma-immersion ion implantationKim, Young Min / Jeong, Min-Kyu / Park, Ki-Heung et al. | 2008
- 2049
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Photo-mask fabrication by low-energy microcolumn lithographyKim, H.S. / Ahn, S. / Kim, D.W. et al. | 2008
- 2053
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TLM method for thermal investigation of IGBT modules in PWM modeHocine, R. / Pulko, S.H. / Stambouli, A. Boudghene et al. | 2009
- 2063
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The law of ultrasonic energy conversion in thermosonic flip chip bonding interfacesJunhui, Li / Ruishan, Wang / Hu, He et al. | 2009
- 2067
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Analytical model for the high-temperature behaviour of the subthreshold slope in MuGFETsLee, Chi-Woo / Lederer, Dimitri / Afzalian, Aryan et al. | 2009
- 2072
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Determination of the electronic parameters of nanostructure SnO2/p-Si diodeCaglar, Yasemin / Caglar, Mujdat / Ilican, Saliha et al. | 2009
- 2078
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Improving bulk FinFET DC performance in comparison to SOI FinFETPoljak, Mirko / Jovanović, Vladimir / Suligoj, Tomislav et al. | 2009
- 2086
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Effect of Ag micro-particles content on the mechanical strength of the interface formed between Sn–Zn binary solder and Au/Ni/Cu bond padsDas, S.K. / Sharif, A. / Chan, Y.C. et al. | 2009
- 2094
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Effect of electronic flame off parameters on copper bonding wire: Free-air ball deformability, heat affected zone length, heat affected zone breaking forceHang, C.J. / Song, W.H. / Lum, I. et al. | 2009
- 2104
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A direct-write microfluidic fabrication process for CMOS-based Lab-on-Chip applicationsGhafar-Zadeh, Ebrahim / Sawan, Mohamad / Therriault, Daniel et al. | 2009
- 2110
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Chemical modification of carbon nanotube for improvement of field emission propertyLee, Sunwoo / Oda, Tetsuji / Shin, Paik-Kyun et al. | 2009
- 2114
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Performance optimizing on multi-function MMIC designTu, M.C. / Wang, Y.C. / Ueng, H.Y. et al. | 2009
- 2119
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Reducing Cu diffusion in SiCOH low-k films by O2 plasma treatmentYuan, Jing / Ye, Chao / Xing, Zhenyu et al. | 2009
- 2123
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Gate dielectric degradation in CMOS invertersMartín-Martínez, J. / Gerardin, S. / Rodríguez, R. et al. | 2009
- 2127
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ZnO as a dielectric for organic thin film transistor-based non-volatile memorySalim, N. Tjitra / Aw, K.C. / Gao, W. et al. | 2009
- 2132
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Computational analysis of the interfacial effect on electromigration in flip chip solder jointsKim, Dongchoul et al. | 2009
- 2138
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Erratum to “Infrared spectroscopy and X-ray diffraction studies on the crystallographic evolution of La2O3 films upon annealing” Microelectronic Engineering 85 (2008) 2411–2413Tsoutsou, D. / Scarel, G. / Debernardi, A. et al. | 2008
- IFC
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Inside Front Cover - Editorial Board| 2009
- II
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Contents Continued| 2009