Microelectronic engineering : an international journal of semiconductor manufacturing technology
Die Inhaltsverzeichnisse werden automatisch erzeugt und basieren auf den im Index des TIB-Portals verfügbaren Einzelnachweisen der enthaltenen Beiträge. Die Anzeige der Inhaltsverzeichnisse kann daher unvollständig oder lückenhaft sein.
Inhaltsverzeichnis
- 3049
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A new ultrasonic precise bonding method with ultrasound propagation feedback for polymer MEMSSun, Yibo / Luo, Yi / Wang, Xiaodong et al. | 2011
- 3054
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Experiment-based estimation of point spread function in electron-beam lithography: Forward-scattering partDai, Q. / Lee, S.-Y. / Lee, S.-H. et al. | 2011
- 3062
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Low cost, rapid fabrication of durable molds of grating arrays for nanoimprint lithographyLi, Hsun-Yuan / Chen, Chia-Wei / Yang, Huang-Chin et al. | 2011
- 3067
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Fabrication and characterization of p–n junctions based on ZnO and CuPcGupta, R.K. / Yakuphanoglu, F. / Ghosh, K. et al. | 2011
- 3070
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Sub-5keV electron-beam lithography in hydrogen silsesquioxane resistManfrinato, Vitor R. / Cheong, Lin Lee / Duan, Huigao et al. | 2011
- 3075
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Temperature dependent current–voltage characteristics of the Zn/ZnO/n-Si/Au–Sb structure with ZnO interface layer grown on n-Si substrate by SILAR methodAli Yıldırım, M. / Güzeldir, B. / Ateş, A. et al. | 2011
- 3080
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Increasing bondability and ball-shear force of gold balls thermosonic bonding to flex substrates by depositing a nickel layerChuang, Cheng-Li / Fan, Huang-Feng et al. | 2011
- 3087
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Photosensitive sacrificial polymer with low residueChen, Yu-Chun / Kohl, Paul A. et al. | 2011
- 3094
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In vivo electrochemical impedance measurement on single cell membraneBai, Seoung-Jai / Prinz, Fritz B. et al. | 2011
- 3101
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High-powered thermal gel degradation evaluation on board-level HFCBGA subjected to reliability testsWang, Tong Hong / Chen, Hsuan-Yu / Lee, Chang-Chi et al. | 2011
- 3108
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Fabrication and characterization of bilayer metal wire-grid polarizer using nanoimprint lithography on flexible plastic substrateMeng, Fantao / Luo, Gang / Maximov, Ivan et al. | 2011
- 3113
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A study on three-dimensional electrode arrays fabricated by PolyMUMPs® for AC electro-osmotic pumpingGuo, Xin / Xie, Kongying / Campbell, Robert J. et al. | 2011
- 3119
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Formation of lateral thin-film 700-V insulated-gate bipolar transistors by using retrograde p-well double implantation schemeJuang, M.-H. / Shen, D.-H. / Jang, S.-L. et al. | 2011
- 3123
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Platinum zone plates for hard X-ray applicationsChubarova, E. / Nilsson, D. / Lindblom, M. et al. | 2011
- 3127
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Top-down fabrication of very-high density vertically stacked silicon nanowire arrays with low temperature budgetZervas, Michael / Sacchetto, Davide / De Micheli, Giovanni et al. | 2011
- 3133
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Formation speed of atomically flat surface on Si (100) in ultra-pure argonLi, Xiang / Teramoto, Akinobu / Suwa, Tomoyuki et al. | 2011
- 3140
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Temperature dependence of Al/Ti-based Ohmic contact to GaN devices: HEMT and MOSFETFontserè, A. / Pérez-Tomás, A. / Placidi, M. et al. | 2011
- 3145
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Analysis of the line pattern width and exposure efficiency in maskless lithography using a digital micromirror deviceRyoo, Hoonchul / Kang, Dong Won / Hahn, Jae W. et al. | 2011
- 3150
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Transfer printing approach to all-carbon nanoelectronicsSangwan, V.K. / Southard, A. / Moore, T.L. et al. | 2011
- 3155
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Facilitating intermetallic formation in wire bonding by applying a pre-ultrasonic energyXu, H. / Acoff, V.L. / Liu, C. et al. | 2011
- 3158
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Microwave FinFET modeling based on artificial neural networks including lossy silicon substrateMarinković, Zlatica / Crupi, Giovanni / Schreurs, Dominique M.M.-P. et al. | 2011
- 3164
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Enhancement of light output power of GaN-based vertical light emitting diodes by optimizing n-GaN thicknessJeong, Hwan Hee / Lee, Sang Youl / Choi, Kwang Ki et al. | 2011
- 3168
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The UV and blue light emission properties of Mn doped ZnO nanocrystalsMa, Xiying / Wang, Zui et al. | 2011
- 3172
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Micro-patterning of LiPON and lithium iron phosphate material deposited onto silicon nanopillars array for lithium ion solid state 3D micro-batteryLethien, C. / Zegaoui, M. / Roussel, P. et al. | 2011
- 3178
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Fabrication of submicron photon sieve using E-beam lithography and X-ray lithographyJiang, Wenbo / Hu, Song / Xie, Changqing et al. | 2011
- 3182
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Study on the fluid/structure interaction at different inlet pressures in molded packagingKhor, C.Y. / Abdullah, M.Z. / Che Ani, F. et al. | 2011
- IFC
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Inside Front Cover - Editorial Board| 2011