Microelectronic engineering : an international journal of semiconductor manufacturing technology
Die Inhaltsverzeichnisse werden automatisch erzeugt und basieren auf den im Index des TIB-Portals verfügbaren Einzelnachweisen der enthaltenen Beiträge. Die Anzeige der Inhaltsverzeichnisse kann daher unvollständig oder lückenhaft sein.
Inhaltsverzeichnis
- 1
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Resonance enhancement of micromachined resonators with strong mechanical-coupling between two degrees of freedomLi, Xinxin / Ono, Takahito / Lin, Rongming et al. | 2002
- 13
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Effect of mechanical process parameters on chemical mechanical polishing of Al thin filmsCho, Woong / Ahn, Yoomin / Baek, Chang-Wook et al. | 2002
- 25
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Determination of SF6 reactive ion etching end point of the SiO2/Si system by plasma impedance monitoringDewan, M.N.A. / McNally, P.J. / Perova, T. et al. | 2001
- 47
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A novel fast capillary discharge system emitting intense EUV radiationMohanty, S.R / Robert, E / Dussart, R et al. | 2002
- 47
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A novel fast capillary discharge system emitting intense EUV radiation; possible source for EUV lithographyMohanty, S.R. / Robert, E. / Dussart, R. et al. | 2003
- 61
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Robust operation of copper chemical mechanical polishingKao, Yi-Chung / Yu, Cheng-Ching / Shen, Shih-Haur et al. | 2002
- 77
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Characterisation of the electroless nickel deposit as a barrier layer/under bump metallurgy on IC metallisationRohan, James F / O’Riordan, Gerald et al. | 2002
- 87
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Study on linearity of a micromachined convective accelerometerLuo, X.B. / Li, Z.X. / Guo, Z.Y. et al. | 2002
- 103
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Characterisation of charge trapping at the Si–SiO2 (100) interface using high-temperature conductance spectroscopyDuval, E / Lheurette, E et al. | 2002
- 113
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Effect of solvent on the preparation of ambient pressure-dried SiO2 aerogel filmsJung, Sang-Bae / Kim, Jung-Ho / Kim, Hong-Ryul et al. | 2002
- 123
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Characterization of porous structure in ultra-low-κ dielectrics by depositing thin conductive cap layersIacopi, F / Tökei, Zs / Stucchi, M et al. | 2002
- 123
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Characterization of porous structure in ultra-low-k dielectrics by depositing thin conductive cap layersIacopi, F. / Tokei, Z. / Stucchi, M. et al. | 2003
- 123
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Characterization of porous structure in ultra-low- kappa dielectrics by depositing thin conductive cap layersIacopi, F. / Tokei, Z. / Stucchi, M. et al. | 2003
- 133
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A virtual 3-D fast extractor for interconnect capacitance of multiple dielectricsYang, Zhaozhi / Wang, Zeyi et al. | 2002
- 145
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An overview of supercritical CO2 applications in microelectronics processingWeibel, Gina L / Ober, Christopher K et al. | 2002
- 153
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Micro/nano machining of polymeric substrates by ion beam techniquesHe, W / Poker, D.B / Gonsalves, K.E et al. | 2002
- 163
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3D-microstructure replication processes using UV-curable acrylatesElsner, C / Dienelt, J / Hirsch, D et al. | 2002
- 171
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Characterization of barrier/seed layer stacks of Cu interconnects by electron tomographic three-dimensional object reconstructionStegmann, Heiko / Engelmann, Hans-Jürgen / Zschech, Ehrenfried et al. | 2002
- 185
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A study on the Pt electrode etching for 0.15 mu m technologiesKim, Hyoun-Woo / Ju, Byong-Sun / Kang, Chang-Jin et al. | 2003
- 185
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A study on the Pt electrode etching for 0.15 mm technologiesKim, H. W. / Ju, B. S. / Kang, C. J. et al. | 2003
- 185
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A study on the Pt electrode etching for 0.15 μm technologiesKim, Hyoun-Woo / Ju, Byong-Sun / Kang, Chang-Jin et al. | 2002
- 197
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Electroless and sputtered silver–tungsten thin films for microelectronics applicationsInberg, A / Ginsburg, E / Shacham-Diamand, Y et al. | 2002
- 209
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Evaluation of mechanical stresses in silicon substrates due to lead–tin solder bumps via synchrotron X-ray topography and finite element modelingKanatharana, J. / Pérez-Camacho, J.J. / Buckley, T. et al. | 2003
- 223
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Performances of planar GaAs and InGaAs Schottky diodes fabricated by Pr2O3-added liquid phase epitaxyCheng, Y.C / Hu, Z.W / Yang, J.N et al. | 2002
- 231
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Nanomechanical properties of copper thin films on different substrates using the nanoindentation techniqueFang, Te-Hua / Chang, Win-Jin et al. | 2002
- 239
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Molecular-dynamics study of mechanical properties of nanoscale copper with vacancies under static and cyclic loadingChang, Win-Jin et al. | 2002
- 247
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Erratum to: Recent progress in EUV source development at GREMIMohanty, Smruti Ranjan / Cachoncinlle, Christophe / Fleurier, Claude et al. | 2002
- ii
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Editorial Board| 2002