Porosity Analysis on the Performance of Heatsink with Microchannels (Englisch)
- Neue Suche nach: Jang, J.
- Neue Suche nach: Chiu, H.
- Neue Suche nach: Yeh, H.
- Neue Suche nach: Wu, M.
- Neue Suche nach: Jang, J.
- Neue Suche nach: Chiu, H.
- Neue Suche nach: Yeh, H.
- Neue Suche nach: Wu, M.
- Neue Suche nach: Wu, H.
In:
China semiconductor technology
1
;
851-856
;
2010
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ISBN:
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ISSN:
- Aufsatz (Konferenz) / Print
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Titel:Porosity Analysis on the Performance of Heatsink with Microchannels
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Beteiligte:
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Kongress:International conference, China semiconductor technology ; 2010 ; Shanghai, China
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Erschienen in:China semiconductor technology , 1 ; 851-856ECS TRANSACTIONS ; 27, 1 ; 851-856
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Verlag:
- Neue Suche nach: Electrochemical Society
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Erscheinungsort:Pennington, N.J.
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Erscheinungsdatum:01.01.2010
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Format / Umfang:6 pages
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Anmerkungen:Includes bibliographical references and author index
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ISBN:
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ISSN:
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Medientyp:Aufsatz (Konferenz)
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Format:Print
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Sprache:Englisch
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Schlagwörter:
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Datenquelle:
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Inhaltsverzeichnis Konferenzband
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Thin Wafer Handling Challenges and Emerging SolutionsFarrens, S.N. / Bisson, P. / Sood, S. / Hermanowski, J. et al. | 2010
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3D IC Designs: Myth vs. RealityTang, J. / Wu, J. et al. | 2010
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Cu-Cu Thermo-Compression Bonding for TSV IntegrationKim, B. / Matthias, T. / Burgstaller, D. / Zhu, S. / Kettner, P. / Jang, E. / Kim, J. / Park, Y. et al. | 2010
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Interconnect Technologies and Advanced Packaging for High Performance ComputingShi, J. / Sze, T. / Song, D. / Huang, D. / Cunningham, J.E. et al. | 2010
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Flip Chip Assembly Using Carbon Nanotube Bumps and Anisotropic Conductive Adhesive FilmZhang, X. / Wang, T. / Berggren, P. / Chen, S. / Liu, J. et al. | 2010
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Advancements in Packaging Technology Driven by Global Market ReturnTodd, M. et al. | 2010
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Studies on Cure Kinetics of a Novel Imidazole Derivative Curing Agent for Epoxy ResinLiu, L. / Li, M. / Gao, T. et al. | 2010
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UV Curable Adhesives for Making Image Sensor PackagesKenmochi, T. et al. | 2010
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Porosity Analysis on the Performance of Heatsink with MicrochannelsJang, J. / Chiu, H. / Yeh, H. / Wu, M. et al. | 2010
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Improving Cost of Ownership for Underfill ApplicationsAshley, D. et al. | 2010
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Power SO-8: An Interconnect Case StudyWong, G. et al. | 2010
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PBGA Cost Reduction by Reducing Plated Au Thickness of Substrate PadsWang, R.Q. et al. | 2010
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Bond Ball Optimization on UCP Die for Chip Card ModuleShen, J. / Shan, K. et al. | 2010
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First Multi Beam Full Cut Laser Dicing of Thin Low K WafersBorkulo, J.V. / Hendriks, R. et al. | 2010
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Electrostatic Control and the Need of Feedback Control Ionization in Critical Environment of MEMS Manufacturing ProcessChakkaew, A. / Titiroongruang, W. et al. | 2010
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Solutions for Extending Capillary Life Correlated to Build-Up during Wire BondingLevinson, T. / Billert, O. et al. | 2010
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Packaging of High-Temperature Power Semiconductor ModulesAng, S.S. / Rowden, B.L. / Blada, J.C. / Mantooth, H.A. et al. | 2010
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Packaging Challenges on Shrink Chip TechnologyYang, X. / Soh, Y. / Wu, H. et al. | 2010
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DDR2/DDR3 Interface Signal Integrity Analysis Based on IBM Generic Package ModelYin, W. / Pang, Z. / Han, H. et al. | 2010
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Chip Card Globe Top Module Robustness StudyTan, C. / Zhang, Y. / Juan, S. / Haimerl, A. / Gisela, W. et al. | 2010
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RF, Microwave, and Optoelectronic Packaging Die and Wire Bonding Case StudiesEvans, D.D. et al. | 2010
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Large Graphite Films Exolved from Molten Metal CatalystChang, K. / Hsu, K. / Hu, S. / Lin, I. / Yu, C. / Sung, M. / Sung, J.C. et al. | 2010
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Challenges and Solutions of Extremely Thin SOI (ETSOI) for CMOS Scaling to 22nm Node and BeyondCheng, K. / Khakifirooz, A. / Kulkarni, P. / Edge, L.F. / Reznicek, A. / Adam, T. / He, H. / Seo, S. / Kanakasabapathy, S. / Schmitz, S. et al. | 2010
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Selective Epitaxial Growth of InP in STI Trenches on Off-Axis Si (001) SubstratesWang, G. / Nguyen, D. / Leys, M. / Loo, R. / Brammertz, G. / Richard, O. / Bender, H. / Dekoster, J. / Meuris, M. / Heyns, M. et al. | 2010
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Amorphous Diamond Solar Cells with Nanodiamond Quantum WellsSung, J.C. / Kan, M. / Sung, M. et al. | 2010
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Diamond Islands Wafer for Super LED ManufactureSung, J.C. / Kan, M. / Hu, S. / Yuan, J.C. / Sung, M. et al. | 2010
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Moisture and Oxygen Control in Wafer Microenvironments: Challenges and System SolutionsWang, H. / Liu, Y. / Lee, P. et al. | 2010
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Multivariate Statistical Process Control in Etching ProcessXie, K. et al. | 2010
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Recent Advances in Thermal Processing for c-Si Solar Cell ManufacturingBao, T. / Guo, Y. / Li, L. / Zheng, X. / Bottari, F. et al. | 2010
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Polysilicon Materials FBR Technology for Solar and Semiconductor SiliconFisher, G.R. / Kulkarni, M. et al. | 2010
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Best in Class Polysilicon TechnologyHamilton, J.R. / Rami, A.C. et al. | 2010
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Numerical Analysis of Oxygen and Carbon Transport in a Unidirectional Solidification FurnaceGao, B. / Kakimoto, K. / Nakano, S. et al. | 2010
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Modeling the Early Stages of Oxygen AgglomerationKissinger, G.Z. / Dabrowski, J. / Kot, D. / Akhmetov, V. / Sattler, A. / Von Ammon, W. et al. | 2010
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Oxygen Precipitate Nucleation in Heavily Antimony-Doped Czochralski SiliconZhu, W. / Ma, X. / Chen, J. / Zeng, Y. / Yang, D. et al. | 2010
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Modeling of the 3D Unsteady Melt Flow in an Industrial-Scale Cz-Si Crystal Growth Using LES MethodLiu, X. / Liu, L. / Wang, Y. / Kakimoto, K. et al. | 2010
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Germanium Doping of Si Substrates for Improved Device Characteristics and YieldVanhellemont, J. / Chen, J. / Xu, W. / Yang, D. / Rafi, J. / Ohyama, H. / Simoen, E. et al. | 2010
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Development and Application of a Structured/Unstructured Combined Mesh Scheme for Global Modeling of a Directional Solidification Process of SiliconLi, Z. / Liu, L. / Kakimoto, K. et al. | 2010
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Optimization on Junction Formation by Three-Stack Furnace POCl~3 Diffusion and Analysis on Solar Cell PerformanceCheow, S. / Salwa, A. / Khairy, M. / Shahrul, A.W. / Amin, N. / Sopian, K. / Zaidi, S.H. et al. | 2010
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Wet Etching Technology for Semiconductor and Solar Silicon Manufacturing: Part 1 - FundamentalsErk, H.F. et al. | 2010
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Wet Etching Technology for Semiconductor and Solar Silicon Manufacturing: Part 2 - Process, Equipment and ImplementationErk, H.F. et al. | 2010
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Polishing of Semiconductor MaterialsRhoades, R.L. et al. | 2010
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An Overview of Current Research on Simultaneous Double Side Grinding of Silicon WafersLin, B. / Li, Z. / Sun, W. / Zhang, X. et al. | 2010
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The Application of Reactive Ion Etching (RIE) in Texturing of Multicrystalline Silicon Wafers for Solar CellsHu, L. / Zhao, L. / Tan, Z. et al. | 2010
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An Extraction Method of Solar Cell Parameters with Improved Particle Swarm OptimizationYe, M. / Zeng, S. / Xu, Y. et al. | 2010
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Fabrication of SB-MOSFETs on SOI Substrate Using Ni Silicide Containing Er InterlayerHosoda, W. / Ozawa, K. / Kakushima, K. / Ahmet, P. / Tsutsui, K. / Nishiyama, A. / Sugii, N. / Natori, K. / Hattori, T. / Iwai, H. et al. | 2010
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Performance of Silicon Ballistic Nanowire MOSFET with Diverse Orientations and DiametersAbudukelimu, A. / Kakushima, K. / Ahmet, P. / Tsutsui, K. / Nishiyama, A. / Sugii, N. / Natori, K. / Hattori, T. / Iwai, H. et al. | 2010
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The Optimization Aspect of Screen Printed Si Solar CellShahrul, A.W. / Cheow, S. / Khairy, M. / Salwa, A. / Amin, N. / Sopian, K. et al. | 2010
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Novel Mechanically Stacked Multi-Junction Solar Cells Applying Ultra-Thin III-V Cells and Wafer Based Germanium CellZhao, L. / Flamand, G. / Mols, Y. / Van der Heide, J. / Poortmans, J. et al. | 2010
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Electrical Characteristics of Rare Earth (La, Ce, Pr and Tm) Oxides/Silicates Gate DielectricMatano, K. / Funamizu, K. / Kouda, M. / Kakushima, K. / Ahmet, P. / Tsutsui, K. / Nishiyama, A. / Sugii, N. / Natori, K. / Hattori, T. et al. | 2010
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Copper Precipitates in Multicrystalline Silicon for Solar CellsLi, X. / Yang, D. / Yu, X. / Que, D. et al. | 2010
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Analysis of Elemental Impurities in Photovoltaic Silicon by Inductively Coupled Plasma Mass SpectrometryChen, J. / You, W. / Du, J. / Pan, H. et al. | 2010
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Laser Annealing and Local Heating Effects during Raman Measurement of Hydrogenated Amorphous Silicon FilmsYang, Y. / Peng, C. / Liu, C. et al. | 2010
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A Research on Thick PIN Detector with High Breakdown VoltageWu, D. / Yu, M. / Ma, S. / Zhang, L. / Wei, C. / Zhang, X. / Li, Q. / Li, G. / Wang, H. / Wang, J. et al. | 2010
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A Comparison of Avalanche Injection of Holes and Total Dose Radiation Effects in RadFETsTang, H. / Wang, Y. / Wang, J. / Zheng, Y. / Jin, Y. et al. | 2010