Microstructure of Cu-C interface in Cu-based metal matrix composite (Englisch)
- Neue Suche nach: Berner, A.
- Neue Suche nach: Mundim, K. C.
- Neue Suche nach: Ellis, D. E.
- Neue Suche nach: Dorfman, S.
- Neue Suche nach: Fuks, D.
- Neue Suche nach: Evenhaim, R.
- Neue Suche nach: Berner, A.
- Neue Suche nach: Mundim, K. C.
- Neue Suche nach: Ellis, D. E.
- Neue Suche nach: Dorfman, S.
- Neue Suche nach: Fuks, D.
- Neue Suche nach: Evenhaim, R.
In:
SENSORS AND ACTUATORS A
;
74
, 1/3
;
86-90
;
1999
-
ISSN:
- Aufsatz (Zeitschrift) / Print
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Titel:Microstructure of Cu-C interface in Cu-based metal matrix composite
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Beteiligte:Berner, A. ( Autor:in ) / Mundim, K. C. ( Autor:in ) / Ellis, D. E. ( Autor:in ) / Dorfman, S. ( Autor:in ) / Fuks, D. ( Autor:in ) / Evenhaim, R. ( Autor:in )
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Erschienen in:SENSORS AND ACTUATORS A ; 74, 1/3 ; 86-90
-
Verlag:
- Neue Suche nach: ELSEVIER SEQUOIA S A
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Erscheinungsdatum:01.01.1999
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Format / Umfang:5 pages
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ISSN:
-
Medientyp:Aufsatz (Zeitschrift)
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Format:Print
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Sprache:Englisch
- Neue Suche nach: 681.2
- Weitere Informationen zu Dewey Decimal Classification
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Klassifikation:
DDC: 681.2 -
Datenquelle:
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- 13
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Recent advances in silicon etching for MEMS using the ASE^T^M processHynes, A. M. / Ashraf, H. / Bhardwaj, J. K. / Hopkins, J. / Johnston, I. / Shepherd, J. N. et al. | 1999
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Femtosecond laser-based technology for fast development of micromechanical devicesBähnisch, R. et al. | 1999
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Growth of piezoelectric thin films with fine grain microstructure by high energy pulsed laser depositionCraciun, F. et al. | 1999
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Pulsed laser deposition of multilayer TiN-Pb(ZrxTi1-x)O3 for piezoelectric microdevicesVerardi, P. et al. | 1999
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Some particular aspects of the thin membrane by boron diffusion processesManea, Elena et al. | 1999
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Permeated porous silicon for hydrocarbon sensor fabricationAngelucci, R. et al. | 1999
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- 169
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- 169
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- 178
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Selection of materials for reduced stress packaging of a microsystemMorrissey, A. et al. | 1999
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Silicon compatible materials for harsh environment sensorsKroetz, Gerhard H. et al. | 1999
- 190
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- 193
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- 198
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- 203
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- 207
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- 211
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- 216
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Electrostatically actuated micromirror devices in silicon technologyLang, W. et al. | 1999
- 219
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- 225
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Integration of a sensitive material to a silicon-based device for CO detectionRenault, O. et al. | 1999
- 229
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- 233
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- 237
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- 251
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Index| 1999