A Numerical Model to Predict the Thermal and Psychrometric Response of Electronic Packages (Englisch)
- Neue Suche nach: Vargas, J. V. C.
- Neue Suche nach: Stanescu, G.
- Neue Suche nach: Florea, R.
- Neue Suche nach: Campos, M. C.
- Neue Suche nach: Vargas, J. V. C.
- Neue Suche nach: Stanescu, G.
- Neue Suche nach: Florea, R.
- Neue Suche nach: Campos, M. C.
In:
TRANSACTIONS- AMERICAN SOCIETY OF MECHANICAL ENGINEERS JOURNAL OF ELECTRONIC PACKAGING
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123
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200-210
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2001
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ISSN:
- Aufsatz (Zeitschrift) / Print
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Titel:A Numerical Model to Predict the Thermal and Psychrometric Response of Electronic Packages
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Beteiligte:Vargas, J. V. C. ( Autor:in ) / Stanescu, G. ( Autor:in ) / Florea, R. ( Autor:in ) / Campos, M. C. ( Autor:in )
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Erschienen in:
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Verlag:
- Neue Suche nach: AMERICAN SOCIETY MECHANICAL ENGINEERS
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Erscheinungsdatum:01.01.2001
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Format / Umfang:11 pages
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ISSN:
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Medientyp:Aufsatz (Zeitschrift)
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Format:Print
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Sprache:Englisch
- Neue Suche nach: 621.38104
- Weitere Informationen zu Dewey Decimal Classification
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Klassifikation:
DDC: 621.38104 -
Datenquelle:
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Inhaltsverzeichnis – Band 123
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- 1
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Comparison of First-Order Shear and Plane Strain Assumptions in Warpage Prediction of Simply Supported Printed Wiring BoardsPolsky, Yarom et al. | 2001
- 101
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Viscoelastic Warpage Analysis of Surface Mount PackageMiyake, Kiyoshi et al. | 2001
- 05
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Die Attachment for -120^oC to +20^oC Thermal Cycling of Microelectronics for Future Mars Rovers-An OverviewKirschman, R. K. / Sokolowski, W. M. / Kolawa, E. A. et al. | 2001
- 6
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Evaluation of Smear and Its Effect on the Mechanical Integrity of Plated Through Hole-Inner Plane Interface in Thick Printed Wiring BoardsVenkatraman, R. et al. | 2001
- 112
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Modeling Electronic Cooling Axial Fan FlowsGrimes, R. et al. | 2001
- 16
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Evaluation of the Moisture Sensitivity of Molding Compounds of IC's PackagesFrémont, H. et al. | 2001
- 19
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Review of Models and the Disturbed State Concept for Thermomechanical Analysis in Electronic PackagingDesai, Chandra S. et al. | 2001
- 120
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Forced Convection Board Level Thermal Design Methodology for Electronic SystemsCole, Reena et al. | 2001
- 127
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A Comparison of Thermal Stress-Strain Behavior of Elliptical-Round Solder PadsChiang, Kuo-Ning et al. | 2001
- 132
-
Applications of a Decomposed Analysis Procedure for Area-Array PackagesThompson, Terrace B. et al. | 2001
- 34
-
Effect of Tool Wear on Force and Quality in Dam-Bar Cutting of Integrated Circuit PackagesCheung, C.F. et al. | 2001
- 42
-
Microwave Imaging for the Integrity Assessment of IC PackagesJu, Y. et al. | 2001
- 47
-
Moisture Diffusion in Epoxy Molding Compounds Filled With ParticlesUschitsky, M. et al. | 2001
- 52
-
A Dual-Phase-Lag Diffusion Model for Predicting Intermetallic Compound Layer Growth in Solder JointsChen, J.K. et al. | 2001
- 58
-
Flip-Chip BGA Design to Avert Die CrackingHan, J.-B. et al. | 2001
- 64
-
Development of Glass-Free Metal Electrically Conductive Thick FilmsLiu, Zongrong et al. | 2001
- 70
-
The Maximum Stress in Optical Glass Fibers Under Two-Point BendingMuraoka, Mikio et al. | 2001
- 74
-
Phase Structure and Cyclic Deformation in Eutectic Tin-Lead Alloy: A Numerical AnalysisShen, Y.-L. et al. | 2001
- 79
-
Autoclave Reliability of MEMS Pressure and Temperature Sensors Embedded in Carbon Fiber CompositesJavidinejad, Amir et al. | 2001
- 79
-
Autoclave Reliability of MEMS Pressure and Temperatures Sensors Embedded in Carbon Fiber CompositesJavidinejad, A. / Joshi, S. P. et al. | 2001
- 83
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Thermal and Mechanical Loading Effects on the Reliability of Organic Flip Chip PackageGoh, Teck Joo et al. | 2001
- 88
-
Development of Reliability and Moldability on Fine Pitch Ball Grid Array by Optimizing MaterialsAihara, Takashi et al. | 2001
- 105
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Die Attachment for -120(degree)C to +20(degree)C Thermal Cycling of Microelectronics for Future Mars Rovers-An OverviewKirschman, Randall K. et al. | 2001
- 141
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A Nested Finite Element Methodology (NFEM) for Stress Analysis of Electronic Products-Part I: Theory and FormulationDarbha, Krishna et al. | 2001
- 147
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A Nested Finite Element Methodology (NFEM) for Stress Analysis of Electronic Products-Part II: Durability Analysis of Flip Chip and Chip Scale InterconnectsDarbha, Krishna et al. | 2001
- 156
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Conjugate Heat Transfer From a Two-Layer Substrate Model of a Convectively Cooled Circuit BoardHarman, S.A. et al. | 2001
- 159
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Erratum: "Sodium Silicate Based Thermal Interface Material for High Thermal Contact Conductances" (ASME J. Electron. Packag., 122, No. 2, pp. 128-131)Xu, Yunsheng et al. | 2001
- 159
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Erratum: "Development of Glass-Free Metal Electrically Conductive Thick Films" (ASME J. Electron. Packag., 123, No. 1, pp. 64-69)Liu, Zongrong et al. | 2001
- 165
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Local Heat Transfer Distributions in Confined Multiple Air Jet ImpingementGarimella, Suresh V. et al. | 2001
- 173
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Sizing of Heat Spreaders Above Dielectric LayersChen, Calvin et al. | 2001
- 182
-
Simplified Analytical Models for Forced Convection Heat Transfer From Cuboids of Arbitrary ShapeCulham, J.R. et al. | 2001
- 189
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Thermal Performance of Integrated Plate Heat Pipe With a Heat SpreaderTake, Koichiro et al. | 2001
- 196
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An Optical Method for Measuring the Two-Dimensional Surface Curvatures of Electronic Packages During Thermal CyclingDu, Yong et al. | 2001
- 200
-
A Numerical Model to Predict the Thermal and Psychrometric Response of Electronic PackagesVargas, J.V.C. et al. | 2001
- 211
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Temperature Distribution in Advanced Power Electronics Systems and the Effect of Phase Change Materials on Temperature Suppression During Power PulsesEvans, A.G. et al. | 2001
- 218
-
Mesh Sensitivity and FEA for Multi-Layered Electronic PackagingBasaran, Cemal et al. | 2001
- 225
-
Identification of Minimum Air Flow Design for a Desktop Computer Using CFD ModelingChang, J.Y. et al. | 2001
- 232
-
A Comparative Study of the Performance of Compact Model Topologies and Their Implementation in CFD for a Plastic Ball Grid Array PackageShidore, Sarang et al. | 2001
- 238
-
Thermomechanical Behavior of 96Sn-4Ag and Castin AlloyNeu, R.W. et al. | 2001
- 247
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Applying Anand Model to Represent the Viscoplastic Deformation Behavior of Solder AlloysWang, G.Z. et al. | 2001
- 254
-
Free Abrasive Machining in Slicing Brittle Materials With WiresawYang, Fuqian et al. | 2001
- 260
-
Thermoelastic Behavior of Filled Molding Compounds: Composite Mechanics ApproachUschitsky, M. et al. | 2001
- 268
-
Warpage of Plastic IC Packages as a Function of Processing ConditionsYeung, Dickson T.S. et al. | 2001
- 273
-
Orientation Specific Thermal Properties of Polyimide FilmSamuels, Robert J. et al. | 2001
- 278
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Characteristics of Creep Damage for 60 Sn-40 Pb Solder MaterialWei, Y. et al. | 2001
- 284
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The Effect of Solder Paste Volume and Reflow Ambient Atmosphere on Reliability of CBGA AssembliesWu, Y.P. et al. | 2001
- 290
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Fatigue Lifetimes of PBGA Solder Joints Reflowed at Different Conveyor SpeedsFan, S.H. et al. | 2001
- 295
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Interfacial Delamination Near Solder Bumps and UBM in Flip-Chip PackagesGu, Yu et al. | 2001
- 302
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Fatigue of Chip Scale Package Interconnects Due to Cyclic BendingShetty, S. et al. | 2001
- 309
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Thermal Stability of Thermal Interface Pastes, Evaluated by Thermal Contact Conductance MeasurementLuo, Xiangcheng et al. | 2001
- 311
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Effect of Stress Ratio on Fatigue Crack Growth in 95Pb-5Sn SolderZhao, J. et al. | 2001
- 315
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Numerical Analysis of Impinging Air Flow and Heat Transfer in Plate-Fin Type Heat SinksSasao, Keiji et al. | 2001
- 319
-
Industrial Electronics: Devices and Systems, Second EditionPatrick, D. R. / Fardo, S. W. et al. | 2001
- 319
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Industrial Electonics: Devices and Systems, Second EditionPatrick, Dale R. et al. | 2001
- 321
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ForewordRencz, Marta et al. | 2001
- 323
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A Scalable Multi-Functional Thermal Test Chip Family: Design and EvaluationBenedek, Zs et al. | 2001
- 331
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Process Modeling and Thermal-Mechanical Behavior of ACA-ACF Type Flip-Chip PackagesChiang, K.N. et al. | 2001
- 338
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IGBT Package Design for High Power Aircraft Electronic SystemsSarvar, Farhad et al. | 2001
- 344
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Transverse Temperature Gradient Effect on Fin Efficiency for Micro-Channel DesignSabry, Mohamed-Nabil et al. | 2001
- 351
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Constitutive and Cyclic Damage Model of 63Sn-37Pb SolderStolkarts, V. et al. | 2001
- 356
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Experimental Evaluation of Air-Cooling Electronics at High AltitudesWong, Henry et al. | 2001
- 366
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Using Computer Simulation to Validate and Optimize the Design of an Innovative Electronic Packaging ConceptBeyerlein, Dagmar et al. | 2001
- 372
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Thermal Math Modeling and Analysis of an Electronic AssemblyShukla, K.N. et al. | 2001
- 379
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Viscoplastic Deformation of 40 Pb-60Sn Solder Alloys-Experiments and Constitutive ModelingSasaki, Katsuhiko et al. | 2001
- 388
-
Displacement Theory for Fixturing Design of Thin Flexible Circuit Board AssemblyChen, Ruijun et al. | 2001
- 394
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A Methodology for Fatigue Prediction of Electronic Components Under Random Vibration LoadLi, Ron S. et al. | 2001
- 401
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Adhesion and Reliability of Epoxy-Glass InterfacesRitter, John E. et al. | 2001
- 405
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A Cause of Cracking in the Under-Bump-Metallurgy Area of Flip ChipsMirman, Boris et al. | 2001
- 406
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Mechanics of Materials and Interfaces: The Disturbed State ConceptDesai, Chandrakant S. et al. | 2001