Correlation between structure and electrical resistivity of W-Cu thin films prepared by GLAD co-sputtering (Englisch)
- Neue Suche nach: El Beainou, Raya
- Neue Suche nach: Martin, Nicolas
- Neue Suche nach: Potin, Valérie
- Neue Suche nach: Pedrosa, Paulo
- Neue Suche nach: Yazdi, Mohammad Arab Pour
- Neue Suche nach: Billard, Alain
- Neue Suche nach: El Beainou, Raya
- Neue Suche nach: Martin, Nicolas
- Neue Suche nach: Potin, Valérie
- Neue Suche nach: Pedrosa, Paulo
- Neue Suche nach: Yazdi, Mohammad Arab Pour
- Neue Suche nach: Billard, Alain
In:
Surface & coatings technology
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313
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1-7
;
2017
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ISSN:
- Aufsatz (Zeitschrift) / Print
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Titel:Correlation between structure and electrical resistivity of W-Cu thin films prepared by GLAD co-sputtering
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Beteiligte:El Beainou, Raya ( Autor:in ) / Martin, Nicolas ( Autor:in ) / Potin, Valérie ( Autor:in ) / Pedrosa, Paulo ( Autor:in ) / Yazdi, Mohammad Arab Pour ( Autor:in ) / Billard, Alain ( Autor:in )
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Erschienen in:Surface & coatings technology ; 313 ; 1-7
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Verlag:
- Neue Suche nach: Elsevier Science B.V., Amsterdam.
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Erscheinungsdatum:01.01.2017
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Format / Umfang:7 pages
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ISSN:
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Medientyp:Aufsatz (Zeitschrift)
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Format:Print
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Sprache:Englisch
- Neue Suche nach: 671.73
- Weitere Informationen zu Dewey Decimal Classification
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Klassifikation:
DDC: 671.73 -
Datenquelle:
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- IFC
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Editorial Board| 2017