Evaluation of Warpage Behavior of SMD-Packages and Boards During Soldering (Englisch)
- Neue Suche nach: Meier, Karsten
- Neue Suche nach: Wohlrabe, Heinz
- Neue Suche nach: Albrecht, Oliver
- Neue Suche nach: Trodler, Jörg
- Neue Suche nach: Meier, Karsten
- Neue Suche nach: Wohlrabe, Heinz
- Neue Suche nach: Albrecht, Oliver
- Neue Suche nach: Trodler, Jörg
In:
SMTA International Conference 2019 ; Volume 1 of 2
; 12
;
2020
- Aufsatz (Konferenz) / Print
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Titel:Evaluation of Warpage Behavior of SMD-Packages and Boards During Soldering
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Beteiligte:Meier, Karsten ( Autor:in ) / Wohlrabe, Heinz ( Autor:in ) / Albrecht, Oliver ( Autor:in ) / Trodler, Jörg ( Autor:in )
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Kongress:SMTA International Conference ; 2019 ; Rosemont, Ill.
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Erschienen in:
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Verlag:
- Neue Suche nach: Curran Associates, Inc.
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Erscheinungsort:Red Hook, NY
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Erscheinungsdatum:2020
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Medientyp:Aufsatz (Konferenz)
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Format:Print
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Sprache:Englisch
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Datenquelle:
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