20th European Conference on Mask Technology for Integrated Circuits and Microcomponents : 12 - 14 January 2004, Dresden, Germany (Englisch)
- Neue Suche nach: EMC, Gesellschaft Mikroelektronik, Mikro- und Feinwerktechnik
- Weitere Informationen zu EMC, Gesellschaft Mikroelektronik, Mikro- und Feinwerktechnik:
- http://d-nb.info/gnd/10071586-2
- Neue Suche nach: Gesellschaft Mikroelektronik, Mikro- und Feinwerktechnik
- Weitere Informationen zu Gesellschaft Mikroelektronik, Mikro- und Feinwerktechnik:
- http://d-nb.info/gnd/5182076-6
- Neue Suche nach: Institut für Mikrostrukturtechnik
- Weitere Informationen zu Institut für Mikrostrukturtechnik:
- http://d-nb.info/gnd/2105949-4
- Neue Suche nach: Behringer, Uwe F. W.
- Neue Suche nach: EMC, Gesellschaft Mikroelektronik, Mikro- und Feinwerktechnik
- Weitere Informationen zu EMC, Gesellschaft Mikroelektronik, Mikro- und Feinwerktechnik:
- http://d-nb.info/gnd/10071586-2
- Neue Suche nach: Gesellschaft Mikroelektronik, Mikro- und Feinwerktechnik
- Weitere Informationen zu Gesellschaft Mikroelektronik, Mikro- und Feinwerktechnik:
- http://d-nb.info/gnd/5182076-6
- Neue Suche nach: Institut für Mikrostrukturtechnik
- Weitere Informationen zu Institut für Mikrostrukturtechnik:
- http://d-nb.info/gnd/2105949-4
2004
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ISBN:
- Konferenzband / Print
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Titel:20th European Conference on Mask Technology for Integrated Circuits and Microcomponents : 12 - 14 January 2004, Dresden, Germany
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Beteiligte:
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Kongress:European Conference on Mask Technology for Integrated Circuits and Microcomponents ; 20 ; 2004 ; Dresden
European Mask Conference ; 20 ; 2004 ; Dresden
EMC ; 20 ; 2004 ; Dresden -
Erschienen in:SPIE proceedings series ; 5504
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Verlag:
- Neue Suche nach: SPIE
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Erscheinungsort:Bellingham, Wash.
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Erscheinungsdatum:2004
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Format / Umfang:XXIV, 210 S
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ISBN:
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Medientyp:Konferenzband
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Format:Print
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Sprache:Englisch
- Neue Suche nach: 621.3815
- Weitere Informationen zu Dewey Decimal Classification
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Schlagwörter:
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Klassifikation:
DDC: 621.3815 -
Datenquelle:
Inhaltsverzeichnis Konferenzband
Die Inhaltsverzeichnisse werden automatisch erzeugt und basieren auf den im Index des TIB-Portals verfügbaren Einzelnachweisen der enthaltenen Beiträge. Die Anzeige der Inhaltsverzeichnisse kann daher unvollständig oder lückenhaft sein.
- 1
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Hard pellicle investigation for 157-nm lithography: impact on overlay [5504-01]Bruls, R. / Uitterdijk, T. / Cicilia, O. / De Bisschop, P. / Kocsis, M. K. / Grenville, A. / Van Peski, C. K. / Engelstad, R. L. / Chang, J. / Cotte, E. P. et al. | 2004
- 1
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Hard pellicle investigation for 157-nm lithography: impact on overlayBruls, Richard / Uitterdijk, Tammo / Cicilia, Orlando / De Bisschop, Peter / Kocsis, Michael K. / Grenville, Andrew / Van Peski, Chris K. / Engelstad, Roxann L. / Chang, Jaehyuk / Cotte, Eric P. et al. | 2004
- 12
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Aerial image measurement technique for today's and future 193-nm lithography mask requirements [5504-02]Zibold, A. M. / Scherubl, T. / Menck, A. / Brunner, R. / Greif, J. / SPIE / VDE/VDI / Forschungszentrum Karlsruhe et al. | 2004
- 12
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Aerial image measurement technique for today's and future 193-nm lithography mask requirementsZibold, Axel M. / Scheruebl, Thomas / Menck, Alexander / Brunner, Robert / Greif, J. et al. | 2004
- 19
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Measurement results on after-etch resist coated features on the new Leica Microsystems' LWM270 DUV critical dimension metrology systemWhittey, John M. / Steinberg, Walter et al. | 2004
- 19
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Measurement results on after-etch resist coated features on the new Leica Microsystems' LWM270 DUV critical dimension metrology system [5504-03]Whittey, J. M. / Steinberg, W. / SPIE / VDE/VDI / Forschungszentrum Karlsruhe et al. | 2004
- 26
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Semi-transparent isolated defect detection by die-to-database mask inspection using virtual scanning algorithms for sub-pixel resolutionAvakaw, Syarhei M. et al. | 2004
- 26
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Semi-transparent isolated defect detection by die-to-database mask inspection using virtual scanning algorithms for sub-pixel resolution [5504-04]Avakaw, S. M. / SPIE / VDE/VDI / Forschungszentrum Karlsruhe et al. | 2004
- 36
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Determining the transfer function of a mask fabrication process [5504-05]Leunissen, P. L. H. A. / Philipsen, V. / Jonckheere, R. M. / SPIE / VDE/VDI / Forschungszentrum Karlsruhe et al. | 2004
- 36
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Determining the transfer function of a mask fabrication processLeunissen, Peter L. H. A. / Philipsen, Vicky / Jonckheere, Rik M. et al. | 2004
- 46
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Towards systematic CD process control for e-beam lithographyKalus, Christian K. et al. | 2004
- 46
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Towards systematic CD process control for e-beam lithography [5504-06]Kalus, C. K. / SPIE / VDE/VDI / Forschungszentrum Karlsruhe et al. | 2004
- 53
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OASIS: progress on implementing the new stream format for containing data size explosionSchulze, Steffen F. / Nakagawa, Kent H. / Buck, Peter D. et al. | 2004
- 53
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OASIS: progress on implementing the new stream format for containing data size explosion [5504-07]Schulze, S. F. / Nakagawa, K. H. / Buck, P. D. / SPIE / VDE/VDI / Forschungszentrum Karlsruhe et al. | 2004
- 60
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The guideline of reticle data management (Ver. 2) [5504-08]Iriki, N. / Miyazaki, N. / Homma, M. / Sato, T. / Onodera, T. / Matsuda, T. / Uga, T. / Higashino, H. / Higashikawa, I. / Yoshioka, N. et al. | 2004
- 60
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The guideline of reticle data management (Ver. 2)Iriki, Nobuyuki / Miyazaki, Norihiko / Homma, M. / Sato, T. / Onodera, Toshio / Matsuda, T. / Uga, T. / Higashino, Hidehiro / Higashikawa, Iwao / Yoshioka, Nobuyuki et al. | 2004
- 70
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January 2004 update on the SEMI standards task force on photomask qualification terminology [5504-09]Jonckheere, R. M. / SPIE / VDE/VDI / Forschungszentrum Karlsruhe et al. | 2004
- 70
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January 2004 update on the SEMI standards task force on photomask qualification terminologyJonckheere, Rik M. et al. | 2004
- 75
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Looking back: artwork and mask making in Dresden for the East German megabit chip project [5504-10]Becker, H. W. / SPIE / VDE/VDI / Forschungszentrum Karlsruhe et al. | 2004
- 75
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Looking back: artwork and mask making in Dresden for the East German megabit chip projectBecker, Hans W. et al. | 2004
- 86
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Monitoring strategy to match the advanced fabs (Invited Paper) [5504-11]Ackmann, P. W. / SPIE / VDE/VDI / Forschungszentrum Karlsruhe et al. | 2004
- 86
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Monitoring strategy to match the advanced fabsAckmann, Paul W. et al. | 2004
- 94
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Production challenges of making an EUV mask blankAschke, Lutz / Becker, Hans W. / Friemel, Falk / Leutbecher, Thomas / Olschewski, Nathalie / Renno, Markus / Rueggeberg, Frauke / Schiffler, Mario / Schmidt, Frank / Sobel, Frank et al. | 2004
- 94
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Production challenges of making an EUV mask blank (Invited Paper) [5504-12]Aschke, L. / Becker, H. W. / Friemel, F. / Leutbecher, T. / Olschewski, N. / Renno, M. / Ruggeberg, F. / Schiffler, M. / Schmidt, F. / Sobel, F. et al. | 2004
- 105
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Optimized processes and absorber-stack materials for EUV masks [5504-13]Mathuni, J. / Rau, J. / Kamm, F.-M. / Ruhl, G. G. / Holfeld, C. / Letzkus, F. / Kopernik, C. / Butschke, J. / SPIE / VDE/VDI et al. | 2004
- 105
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Optimized processes and absorber-stack materials for EUV masksMathuni, Josef / Rau, Jenspeter / Kamm, Frank-Michael / Ruhl, Guenther G. / Holfeld, Ch. / Letzkus, Florian / Koepernik, C. / Butschke, Joerg et al. | 2004
- 111
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The impact of EUV mask defects on lithographic process performance [5504-14]Evanschitzky, P. / Erdmann, A. / SPIE / VDE/VDI / Forschungszentrum Karlsruhe et al. | 2004
- 111
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The impact of EUV mask defects on lithographic process performanceEvanschitzky, Peter / Erdmann, Andreas et al. | 2004
- 120
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Effect of electrostatic chucking on EUVL mask flatness [5504-15]Mikkelson, A. R. / Engelstad, R. L. / Lovell, E. G. / Aschke, L. / Ruggeberg, F. / Sobel, F. / SPIE / VDE/VDI / Forschungszentrum Karlsruhe et al. | 2004
- 120
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Effect of electrostatic chucking on EUVL mask flatnessMikkelson, Andrew R. / Engelstad, Roxann L. / Lovell, Edward G. / Aschke, Lutz / Rueggeberg, Frauke / Sobel, Frank et al. | 2004
- 129
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Investigation of Cr etch chamber seasoningNesladek, Pavel / Ruhl, Guenther G. / Kristlib, Marcel et al. | 2004
- 129
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Investigation of Cr etch chamber seasoning [5504-16]Nesladek, P. / Ruhl, G. G. / Kristlib, M. / SPIE / VDE/VDI / Forschungszentrum Karlsruhe et al. | 2004
- 139
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Implementation of a transparent etch stop layer for an improved alternating PSMCangemi, Michael J. / Taylor, Darren / Lassiter, Matthew et al. | 2004
- 139
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Implementation of a transparent etch stop layer for an improved alternating PSM [5504-17]Cangemi, M. J. / Taylor, D. / Lassiter, M. / SPIE / VDE/VDI / Forschungszentrum Karlsruhe et al. | 2004
- 146
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Metrological characterization of new CD photomask standards [5504-18]Mirande, W. / Bodermann, B. / Hassler-Grohne, W. / Frase, C. G. / Czerkas, S. / Bosse, H. / SPIE / VDE/VDI / Forschungszentrum Karlsruhe et al. | 2004
- 146
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Metrological characterization of new CD photomask standardsMirande, Werner / Bodermann, Bernd / Haessler-Grohne, W. / Frase, Carl G. / Czerkas, Slawomir / Bosse, Harald et al. | 2004
- 155
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Predicting microfluidic response during immersion lithography scanningWei, Alexander C. / Dicks, Gerald A. / Abdo, Amr Y. / Nellis, Gregory F. / Engelstad, Roxann L. / Chang, Jaehyuk / Lovell, Edward G. / Beckman, William A. et al. | 2004
- 155
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Predicting microfluidic response during immersion lithography scanning [5504-19]Wei, A. C. / Dicks, G. A. / Abdo, A. Y. / Nellis, G. F. / Engelstad, R. L. / Chang, J. / Lovell, E. G. / Beckman, W. A. / SPIE / VDE/VDI et al. | 2004
- 164
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Low-energy electron beam proximity projection lithography (LEEPL): the world's first e-beam production tool, LEEPL 3000Behringer, Uwe F. W. et al. | 2004
- 164
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Low-energy electron beam proximity projection lithography (LEEPL): the world's first e-beam production tool, LEEPL 3000 [5504-20]Behringer, U. F. W. / SPIE / VDE/VDI / Forschungszentrum Karlsruhe et al. | 2004
- 173
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Proposal for a distributed parallel system for high-throughput maskless e-beam lithographyGroves, Timothy R. / Pickard, Daniel S. et al. | 2004
- 173
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Proposal for a distributed parallel system for high-throughput maskless e-beam lithography (Invited Paper) [5504-21]Groves, T. R. / Pickard, D. S. / SPIE / VDE/VDI / Forschungszentrum Karlsruhe et al. | 2004
- 178
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Contact layer printing using alternating phase-shifting masks: mask making, patterning results, and production implementationPforr, Rainer / Dettmann, Wolfgang / Eisenhut, M. / Hennig, Mario / Hofmann, Detlef / Thiele, Joerg / Thielscher, Guido et al. | 2004
- 178
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Contact layer printing using alternating phase-shifting masks: mask making, patterning results, and production implementation [5504-22]Pforr, R. / Dettmann, W. / Eisenhut, M. / Hennig, M. / Hofmann, D. / Thiele, J. / Thielscher, G. / SPIE / VDE/VDI / Forschungszentrum Karlsruhe et al. | 2004
- 188
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Avoidance/reduction of charging effects in case of partially insufficient substrate conductivity when using ESPACER 300ZPlontke, Rainer / Bettin, Lutz / Beyer, Dirk / Butschke, Joerg / Irmscher, Mathias / Koepernik, Corinna / Leibold, Bernd / Vix, Armelle B. E. / Voehringer, Peter et al. | 2004
- 188
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Avoidance/reduction of charging effects in case of partially insufficient substrate conductivity when using ESPACER 300Z [5504-23]Plontke, R. / Bettin, L. / Beyer, D. / Butschke, J. / Irmscher, M. / Koepernik, C. / Leibold, B. / Vix, A. B. E. / Voehringer, P. / SPIE et al. | 2004
- 197
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Dynamic mask defects in hot embossing lithography [5504-24]Bogdanski, N. / Schulz, H. / Wissen, M. / Scheer, H.-C. / SPIE / VDE/VDI / Forschungszentrum Karlsruhe et al. | 2004
- 197
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Dynamic mask defects in hot embossing lithographyBogdanski, N. / Schulz, Hubert / Wissen, Matthias / Scheer, Hella-Christin et al. | 2004
- 204
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Shaped beam technology for nano-imprint mask lithography [5504-25]Hudek, P. / Beyer, D. / Groves, T. R. / Fortagne, O. K. / Dauksher, W. J. / Mancini, D. P. / Nordquist, K. J. / Resnick, D. J. / SPIE / VDE/VDI et al. | 2004
- 204
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Shaped beam technology for nano-imprint mask lithographyHudek, Peter / Beyer, Dirk / Groves, Timothy R. / Fortagne, Olaf K. / Dauksher, William J. / Mancini, David P. / Nordquist, Kevin J. / Resnick, Douglas J. et al. | 2004