Conference proceedings from the 37th International Symposium for Testing and Failure Analysis : November 13 - 17, 2011, San Jose Convention Center, San Jose, California, USA (Englisch)
- Neue Suche nach: Electronic Device Failure Analysis Society
- Weitere Informationen zu Electronic Device Failure Analysis Society:
- http://d-nb.info/gnd/6015594-2
- Neue Suche nach: Electronic Device Failure Analysis Society
- Weitere Informationen zu Electronic Device Failure Analysis Society:
- http://d-nb.info/gnd/6015594-2
2011
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ISBN:
- Konferenzband / Print
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Titel:Conference proceedings from the 37th International Symposium for Testing and Failure Analysis : November 13 - 17, 2011, San Jose Convention Center, San Jose, California, USA
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Weitere Titelangaben:Proceedings from the 37th International Symposium for Testing and Failure Analysis
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Beteiligte:
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Kongress:International Symposium for Testing and Failure Analysis ; 37 ; 2011 ; San Jose, Calif.
ISTFA ; 37 ; 2011 ; San Jose, Calif. -
Verlag:
- Neue Suche nach: ASM Internat.
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Erscheinungsort:Materials Park, Ohio
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Erscheinungsdatum:2011
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Format / Umfang:XIX, 456 S.
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Anmerkungen:Ill., graph. Darst.
Auf d. Haupttitels. auch bez. als: ISTFA 2011
Parallel als CD-ROM-Ausg. erschienen -
ISBN:
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Medientyp:Konferenzband
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Format:Print
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Sprache:Englisch
- Neue Suche nach: 51.30 / 53.09
- Weitere Informationen zu Basisklassifikation
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Schlagwörter:
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Klassifikation:
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Datenquelle:
Inhaltsverzeichnis Konferenzband
Die Inhaltsverzeichnisse werden automatisch erzeugt und basieren auf den im Index des TIB-Portals verfügbaren Einzelnachweisen der enthaltenen Beiträge. Die Anzeige der Inhaltsverzeichnisse kann daher unvollständig oder lückenhaft sein.
- 1
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Electrical Failure and Damage Analysis of Multi-Layer Metal Films on Flexible Substrate during Cyclic Bending DeformationKim, B.-J. / Shin, H.-A.-S. / Choi, I.-S. / Joo, Y.-C. et al. | 2011
- 5
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A Position-Sensitive, Single-Photon Detector with Enhanced NIR ResponseStellari, F. / Song, P. / Weger, A.J. / Nakamura, T. / Kim, S. / Roche, R. et al. | 2011
- 12
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Advanced Scan Chain Failure Analysis Using Laser Modulation Mapping and Continuous Wave ProbingKasapi, S. / Lo, W. / Liao, J. / Cory, B. / Marks, H. et al. | 2011
- 18
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Thermal Frequency Imaging: A New Application of Laser Voltage Imaging Applied on 40nm TechnologyCeli, G. / Dudit, S. / Parrassin, T. / Perdu, P. / Reverdy, A. / Lewis, D. / Vallet, M. et al. | 2011
- 24
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Local Lattice Strain Measurement Using Geometric Phase Analysis of Dark Field Images from Scanning Transmission Electron MicroscopyChung, J. / Lian, G. / Rabenberg, L. et al. | 2011
- 26
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Correcting for Spherical Aberrations in Solid Immersion Microscopy Using a Deformable MirrorLu, Y. / Ramsay, E. / Stockbridge, C. / Koklu, F.H. / Yurt, A. / Mertz, J. / Bifano, T.G. / Unlu, M.S. / Goldberg, B.B. et al. | 2011
- 31
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The Challenges of Backside Focused Ion Beam (FIB) Editing in the Presence of Deep Trench Decoupling CapacitorsHerschbein, S.B. / Worth, C.F.S.G.K. / Hermann, E.S. et al. | 2011
- 35
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State of the Art Substrate Manipulation as a Tool for Enhancing Product PerformanceGonzales, M.A. / Cabanillas, J. et al. | 2011
- 40
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Neon Ion Microscope Nanomachining ConsiderationsTan, S. / Livengood, R.H. / Hallstein, R. / Shima, D. / Greenzweig, Y. / Notte, J. / McVey, S. et al. | 2011
- 46
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Instant Solid Immersion Lens Creation in Silicon with a Focused Ion Beam - Comparing Refractive and Diffractive MethodsScholz, P. / Kerst, U. / Boit, C. / Kujawa, T. / Lundquist, T. et al. | 2011
- 54
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Circuit Edit and Optical Probe Development and Validation for Next Generation Process NodesGiacobbe, J.A. / Pardy, P. / Peterson, C.A. / Shykind, D. / Zickel, S.E. et al. | 2011
- 60
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3DIC Fault Isolation Using the OBIRCH ApproachHsu, M.-S. / Kuo, Y.-L. / Lin, Y.-T. / Huang, R.-Y. / Ku, M.-F. / Chang, C.-H. et al. | 2011
- 64
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Improving Wire Sweep Performance by Measuring Degree of Cure of Epoxy Mold CompoundsDal, S.L.B. et al. | 2011
- 68
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Use of Lock-In Thermography for Non-Destructive 3D Defect Localization on System in Package and Stacked-Die TechnologySchlangen, R. / Motegi, S. / Nagatomo, T. / Schmidt, C. / Altmann, F. / Murakami, H. / Hollingshead, S. / West, J. et al. | 2011
- 74
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Quantitative Phase Shift Analysis for 3D Defect Localization Using Lock-in ThermographySchmidt, C. / Altmann, F. et al. | 2011
- 81
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Failure Analysis of Flip Chip C4 Package Using Focused Ion Beam Milling TechniqueCao, L. / Tran, L. / Donna, W. et al. | 2011
- 86
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Layout-Aware Diagnosis Leads to Efficient and Effective Physical Failure AnalysisSharma, M. / Schwarz, S. / Schmerberg, J. / Yang, K. / Tai, T.-P. / Chen, Y.-S. / Chuang, C.-Y. / Kuo, F.-M. / Brennan, M. / Yeh, J. et al. | 2011
- 91
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Device Selection for Failure Analysis of Chain Fails Using Diagnosis Driven Yield AnalysisSchuermyer, C. / Benware, B. / Rhodes, G. / Appello, D. / Tancorre, V. / Riewer, O. et al. | 2011
- 98
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Debugging an Invisible Flaky Scan Chain DefectShukla, R. / Billings, R. / Bakhshi, A. / Schulze, J. / Gorti, A. / Tamarapalli, N. et al. | 2011
- 103
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Diagnose Compound Hold Time Faults Caused by Spot Delay Defects at Clock TreeHuang, Y. / Cheng, W.-T. / Tai, T.-P. / Lai, L. / Guo, R. / Kuo, F.-M. / Chen, Y.-S. et al. | 2011
- 112
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A Comprehensive Analysis Methodology for Gate Oxide Integrity Failure Using Combined FA TechniquesYounan, H. / Rao, N.R. / Shuting, C. / Lei, Z. / Ning, C.C. / Jianming, Z. / Yanhua, H. / Ping, N.S. et al. | 2011
- 118
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Al Bondpads, Halogens, and an ESCA-Based Search for the Invisible Cause of Poor Throughput at Wafer ProbeNiles, D.W. / Kee, R.W. et al. | 2011
- 127
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Whisker Formation in Copper ElectroplatingHan, T. / Cho, E. / Heo, J. / Lee, S.J. et al. | 2011
- 132
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Comprehensive Nano-Structural Approach of SSRM Nanocontact on Silicon through TEM-STEM StudyDomenges, B. / Delaroque, T. / Danilo, K. / Colder, A. et al. | 2011
- 137
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Highly Automated Transmission Electron Microscopy Tomography for Defect UnderstandingDemarest, J.J. / Zhai, H.-Y. et al. | 2011
- 141
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Transmission Electron Microscopy Characterization of FinFET - Understanding the 3D Structure by 2D Imaging TechniqueZhu, Y. / Gonsalves, J. et al. | 2011
- 146
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A Comparison of Lock-in Thermography and Magnetic Current Imaging for Localizing Buried Short-CircuitsVallett, D.P. et al. | 2011
- 153
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Scan Chain Debug Using Dynamic Lock-In ThermographyForli, L. / Picart, B. / Reverdy, A. / Schlangen, R. et al. | 2011
- 158
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Practical Implementation of Soft Defect Localization (SDL) in Mixed Signal and Analog ICsBarbian, E. / Crow, G. / Swe, W.T. / Phillips, M.C. et al. | 2011
- 164
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Photon Emission Spectra through Silicon of Various ThicknessesGlowacki, A. / Pagano, C. / Boit, C. / Yokoyama, Y. / Jankowski, A. / Perdu, P. et al. | 2011
- 170
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Characterization of MOS Transistors Using Dynamic Backside Reflectance Modulation TechniqueTeo, J.K.J. / Chua, C.M. / Koh, L.S. / Phang, J.C.H. et al. | 2011
- 176
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Effective Fault Isolation Using Memory BIST and Logic BIST Diagnostic TechniquesKinger, R. / Tong, C. / Chaudhry, A. / Chowdhury, V. / Sun, W. / Deng, H. / Smith, S. et al. | 2011
- 182
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DRAM Static Refresh Weak Cell Characterization and Structure AnalysisLee, S.H. / Yoo, Y.H. / Park, T.J. / Choi, J. / Ahn, J.H. / Kim, S.S. / Kang, C.-J. / Nam, S.W. / Lee, J.Y. / Jin, G.Y. et al. | 2011
- 185
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A Systematic Failure Analysis to Reveal the Mystery of Lower N-Well ResistanceZhu, D. / Neo, S.P. / Quah, A. / Ang, G.B. / Zhu, L. / Huang, Y. / Koo, H.T. / Yau, M.K. / Hninhnin, M. / Dayanand, N. et al. | 2011
- 189
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From the Store Shelf to Device-Level Atom Probe Analysis: An Exercise in FeasibilityLarson, D.J. / Lawrence, D. / Olson, D. / Prosa, T.J. / Ulfig, R.M. / Reinhard, D.A. / Clifton, P.H. / Kelly, T.F. / Lefebvre, W. et al. | 2011
- 198
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Non-Visible Defect Analysis of OTP DeviceChen, C.Q. / Ang, G.B. / Xing, Z.X. / Hua, Y.N. / Mo, Z.Q. / Ramesh, R. / Li, Y. et al. | 2011
- 202
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Addressing Stress-Memorization-Technology (SMT) Induced DefectsKane, T. / Wang, Y.Y. / Tenney, M. / Oldrey, R. / Villalobos, M. / Sylvestri, J. / Tverskoy, G. et al. | 2011
- 207
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Flash Single Bit Cycling Fail Due to Charge Accumulation from Incorrect Lateral Drain Junction FormationHarber, K. / Subramanian, S. / Chrastecky, T. / Ly, K. / Mu, F. et al. | 2011
- 212
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Identification of Extension Implant Defect in Sub-Micron CMOS ICs - Analysis Technique, Model, and SolutionTsang, Y.L. / Nallapati, G. / Skarupa, R. / Anthony, B. et al. | 2011
- 218
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A Sample Preparation Technique to Localize Gate Oxide Defects in Memory Arrays Using Conducting Atomic Force MicroscopyLakshmanan, L. / Herlinger, L. / Miller, K. et al. | 2011
- 223
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Failure Analysis on Power Trench MOSFET Devices with Copper Wire BondsWu, H. / Chiang, A. / Le, D. / Pratchayakun, W. / Siliconix, V. / Clara, S. et al. | 2011
- 230
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Infrared Thermography Developments for III-V Transistors and MMICsCarisetti, D. / Bouya, M. / Bezencenet, O. / Servet, B. / Clement, J.-C. / Lambert, B. / Caille, L. / Malbert, N. / Labat, N. et al. | 2011
- 234
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Detection of a Counterfeit OTA Device and Certification of a Replacement SourceHong, Y. et al. | 2011
- 238
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DNA to Safeguard Electrical Components and Protect Against Counterfeiting and DiversionHayward, J.A. / Meraglia, J. et al. | 2011
- 242
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Backside De-Processing of Integrated Circuits 40 nm and BelowLi, Y. / Scott, S. / Marks, H.L. et al. | 2011
- 248
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New Method for Decapsulation of Copper Wire Devices Using LASER and Subambient Temperature Chemical EtchLefevre, M.J. / Beauquis, F. / Obein, M. / Gounet, P. / Barberan, S. et al. | 2011
- 256
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New Front Side Access Approach for Low-k Dielectric/Cu Technologies in Plastic PackageAubert, A. / de Morais, L.D. / Petremont, S. / Labat, N. / Fremont, H. et al. | 2011
- 262
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A Novel Low Cost Technique to Perform Concurrent Topside and Backside Analysis of a Bare DieKabadi, R. / Swe, W.T. et al. | 2011
- 269
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Electrical Signature Verification and Fault Localization in High-Density DRAM Device Using Atomic Force ProbeWang, W.-C. / Liew, S.-L. / Chen, H.-S. / Chen, K.-L. / Luo, J.-S. et al. | 2011
- 275
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Advanced Backside Defect Isolation Techniques Using Electron Beam Absorbed Current to Locate Metal Defectivity on Bulk and SOI TechnologyErington, K. / Dickson, K. / Lange, G. / Garcia, J.Z. / Ybarra, J. / Wetterling, N. et al. | 2011
- 287
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A Study of a Characteristics Variability Evaluation in an Actual LSI Circuit with Nanoprobing TechniqueFukui, M. / Nara, Y. / Tsunomura, T. / Nishida, A. / Fuse, J. et al. | 2011
- 293
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Fault Isolation of Dense High Rc Array by Using Conductive Atomic Force MicroscopyHu, W.-S. / Yang, H.-W. / Huang, Y.-S. et al. | 2011
- 296
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Development of a Protective Coating for Application of Ion Cross-Section Polishing on Thermal Inkjet Printhead Heater ChipsZhang, Q. / Wu, X.M. et al. | 2011
- 301
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Impacts of Sample Preparation Methodology on TEM Failure Analysis of Advanced Semiconductor DevicesZhou, Y. / Zhu, J. / Teo, H.W. / Quah, A.C.T. / Zhu, L. / Du, A. / Hua, Y. et al. | 2011
- 305
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TEM Sample Preparation by Single-Sided Low-Energy Ion Beam EtchingNan, L.K. / Lung, L.M. et al. | 2011
- 308
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Multiple-Post In-Situ Lift-Out Grids Preparation Using a Dicing SawLuo, J.-S. / Lee, H.-T. / Liew, S.-L. / Sung, C.-S. / Wu, Y.-J. et al. | 2011
- 316
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Scanning Capacitance Microscopy: A Valuable Tool to Diagnose Current Paths in 3D-Capacitors ProcessDelaroque, T. / Danilo, K. / Voiron, F. / Bunel, C. / Domenges, B. / Laflutte, M. / Dalmolin, R. et al. | 2011
- 322
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Nano Probe Analysis of Device Characteristics Affected by Ring Type Crystalline DefectLee, J.H. / Lee, Y.J. / Kim, J.S. / Jeong, S.K. / Kim, M.S. / Oh, S.H. / Jung, K.W. / Son, S.Y. / Kim, C.R. et al. | 2011
- 327
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Electroless Cobalt Plating on Copper Structures for Nano-ProbingChuang, W.-H. / Zhong, T. / Niu, B. et al. | 2011
- 330
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Can Illuminated IV-Characteristics of Micro-Regions in Solar Cells be Measured by Laser-Induced Stimulation?Boostandoost, M. / Glowacki, A. / Bakaeva, O. / Kerst, U. / Boit, C. et al. | 2011
- 336
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Setup for Locating PV-Cell Defects through I~S~C MeasurementsShankar, S. / Bernhardt, A. / Srinivasan, B. / Enimidisetty, S. / Versen, M. et al. | 2011
- 340
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All-Contactless Measurement of Series Resistance Distributions on Solar Cells with Photoluminescence ImagingKasemann, M. / Reindl, L.M. / Michl, B. / Warta, W. / Schutt, A. / Carstensen, J. et al. | 2011
- 345
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Fast Diagnosis and Failure Mechanism of Phosphorous Contamination in Arsenic-Implanted SiliconZhu, L. / Teo, H.W. / Ong, K. / Huang, Y.H. / Koh, R. / Chew, P.Y. / Hua, Y.N. et al. | 2011
- 349
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Failure Analysis Methodology on Unique 68mm Single Ring Pattern Due to Load Lock BurrQuah, A.C.T. / Ang, G.B. / Chen, C.Q. / Zhu, D. / Gunawardana, M. / Indahwan, J. / Lee, M.T. / Neo, S.P. / Chen, Y. et al. | 2011
- 354
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Influence of Laser Radiation on Embedded Non Volatile Memories and Its Application for Descrambling VerificationOsterreicher, I. / Skuras, J. / Haase, A. et al. | 2011
- 359
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Systematic EFA Approach in Locating Floating Nodes in Analog Mixed Signal DevicesKarki, S. et al. | 2011
- 362
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Challenges and Benefits of Product-Like SRAM in Technology DevelopmentBeaudoin, F. / Lucarini, S. / Towler, F. / Wu, S. / Song, Z. / Albert, D. / Safran, L. / Sylvestri, J. / Karve, G. / Yu, X. et al. | 2011
- 367
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Activity Analysis at Low Power Supply on 45nm TechnologyBascoul, G. / Perdu, P. / Sanchez, K. / Lewis, D. / Dudit, S. / Celi, G. et al. | 2011
- 373
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CHIPSCANNER: Reverse Engineering Solution for Microchips at the Nanometer-ScaleKlingfus, J. / Burcham, K. / Rasche, M. / Borchert, T. / Damnik, N. et al. | 2011
- 377
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Acoustic Micro Imaging of Large ObjectsSullivan, D.J.D. / Guzman, J.A. et al. | 2011
- 382
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Design Based Failure Analysis of a Voltage Sensitive Memory DefectBowsher, A. / Gloor, C.A. / Griffiths, B. / McMahon, C. et al. | 2011
- 387
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Failure Analysis Method of Using Laser Nano Electrostaticfield Probe Sensor (L-NEPS)Ito, S. / Sodeyama, H. / Takiguchi, K. / Matsumoto, T. et al. | 2011
- 393
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Split-Gate Flash Memory Cell Odd/Even Fail Pattern Failure AnalysisChiu, R.-L. / Higgins, J. / Ying, S.-L. / Chung, J. / Wang, G. / Liu, X. / Lim, T. et al. | 2011
- 396
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Failure Localization by Using a Novel Backside Passive Voltage Contrast MethodologyChen, K.H. / Chang, C.-C. / Lin, J.C. et al. | 2011
- 399
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Novel Gox Inspection Methodology in Advanced Silicon ProcessWang, K.Y. / Chen, K.H. / Lin, J.C. / Wu, W.S. et al. | 2011
- 403
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A Novel ONO Inspection Methodology for DRAM Deep Trench StructureChen, K.H. / Chang, C.-C. / Lin, J.C. et al. | 2011
- 406
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Chromatic Aberration Correction of Silicon Aplanatic Solid Immersion Lens for Photon Emission Microscopy of Integrated CircuitsYurt, A. / Ramsay, E. / Koklu, F.H. / Unlu, M.S. / Goldberg, B.B. et al. | 2011
- 410
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Development of an Automated TDR System for Package Failure AnalysisBasilio, C.C. / Nguyen, H.T. / Aguinaldo, A. / Arboleda, J.P. / Ang, R. / Ano, D. / Paranal, P. / Magpantay, A. et al. | 2011
- 414
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Hardness of Rinse Water and Swelling Behavior of Dry Film Photo-ResistKim, S.-I. / Heo, J. / Kim, Y. / Yu, Y. / Choi, C. / Yu, J. et al. | 2011
- 419
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A New Failure Analysis Roadmap for Power Semiconductor Modules and DevicesJacob, P. / Kunz, A. / Nicoletti, G. et al. | 2011
- 424
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A Method of Stress Reduction during Silicon ThinningMulholland, M.M. / Wadell, R.P. et al. | 2011
- 428
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Methodology and Application of Backside Physical Failure AnalysisLai, L.-L. / Chen, H. / Gao, H. et al. | 2011
- 434
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A Study of SRAM Device Soft Failures Caused by Contact Volcano Defects Using Nanoprobing AnalysisShu, Y.H. / Huang, V. / Chao, C.H. et al. | 2011
- 439
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New Failure Analysis Method for Laser Voltage Probing (LVP) Utilizing System Evaluation Board and SoftwareLee, S.H. / Lee, Y.W. / Hong, M.J. / Yun, S.J. / Lee, E.C. / Hong, K.S. et al. | 2011
- 443
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Evaluation of Electrical Properties of Cell Area on the Semiconductor Devices by FIB TechniqueOh, J. / Kim, J. / Lee, J. / Back, T. / Kim, W. / Kim, H. / Kim, C. et al. | 2011
- 446
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The ``Perfect Storm'' Now Appearing in FA Labs EverywhereShade, G.F. / Sood, B. et al. | 2011