Ultra clean processing of semiconductor surfaces XI : selected, peer reviewed papers from the 11th International Symposium on Ultra Clean Processing of Semiconductor Surfaces (UCPSS), September 17 - 19, 2012, Gent, Belgium (Englisch)
- Neue Suche nach: Interuniversity Micro-Electronics Center, Löwen
- Weitere Informationen zu Interuniversity Micro-Electronics Center, Löwen:
- http://d-nb.info/gnd/5047943-X
- Neue Suche nach: Mertens, Paul
- Neue Suche nach: Meuris, Marc
- Neue Suche nach: Interuniversity Micro-Electronics Center, Löwen
- Weitere Informationen zu Interuniversity Micro-Electronics Center, Löwen:
- http://d-nb.info/gnd/5047943-X
2013
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ISBN:
- Konferenzband / Print
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Titel:Ultra clean processing of semiconductor surfaces XI : selected, peer reviewed papers from the 11th International Symposium on Ultra Clean Processing of Semiconductor Surfaces (UCPSS), September 17 - 19, 2012, Gent, Belgium
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Beteiligte:
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Kongress:International Symposium on Ultra Clean Processing of Semiconductor Surfaces ; 11 ; 2012 ; Gent
UCPSS ; 11 -
Erschienen in:Solid state phenomena ; 195
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Verlag:
- Neue Suche nach: TTP, Trans Tech Publ.
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Erscheinungsort:Durnten-Zurich [u.a.]
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Erscheinungsdatum:2013
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Format / Umfang:XIV, 332 S.
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Anmerkungen:Ill., graph. Darst.
Conference organized by IMEC -
ISBN:
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Medientyp:Konferenzband
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Format:Print
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Sprache:Englisch
- Neue Suche nach: 53.56 / 52.78 / 35.18
- Weitere Informationen zu Basisklassifikation
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Schlagwörter:
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Klassifikation:
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Datenquelle:
Inhaltsverzeichnis Konferenzband
Die Inhaltsverzeichnisse werden automatisch erzeugt und basieren auf den im Index des TIB-Portals verfügbaren Einzelnachweisen der enthaltenen Beiträge. Die Anzeige der Inhaltsverzeichnisse kann daher unvollständig oder lückenhaft sein.
- 3
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Silicon & beyond CMOS: The Path of Advanced Electronic Structure Engineering for Low-Voltage TransistorsThean, A. et al. | 2013
- 7
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Cleaning Technology for Advanced Devices beyond 20 nm NodeOgawa, Y. et al. | 2013
- 13
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Dummy Oxide Removal in High-K Last Process Integration how to Avoid Silicon Corrosion IssueSebaai, F. / Veloso, A. / Takahashi, H. / Pacco, A. / Claes, M. / Schaekers, M. / de Gendt, S. / Mertens, P.W. / Struyf, H. et al. | 2013
- 17
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Implanted Photoresist Remover for Advanced Nodes Including SiGe, Ge and High K-MetalsBraun, S. / Vos, R. / Klipp, A. / Claes, M. / Bittner, C. / Albert, J. / Horiguchi, N. / Struyf, H. et al. | 2013
- 21
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Development of a Integrated Dry/Wet Hybrid Cleaning SystemLee, J.S. / Choi, G.M. / Jung, J.N. / Lee, D.D. / Hur, G.Y. / Lee, J.H. / Chi, C.H. / Gimm, D.H. et al. | 2013
- 25
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New Chemical Vapor Delivery Systems for Surface CleaningAlvarez, D. / Spiegelman, J. / Heinlein, E. / Ramos, C. / Holmes, R.J. / Shamsi, Z. et al. | 2013
- 30
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Removal of UV Cured Resin Using Hybrid Cleaning MethodKim, M.S. / Kang, B.K. / Kim, J.K. / Lee, B.K. / Park, J.G. et al. | 2013
- 37
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Selective Nickel Silicide Wet Etchback Chemistry for Low Temperature Anneal ProcessSiang, T.Y. / Meng, S.B. / San, L.L. / Huang, L. / Ismail, Z. / See, A. et al. | 2013
- 42
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Wet Etching Behavior of Poly-Si in TMAH SolutionTakahashi, H. / Otsuji, M. / Snow, J. / Sebaai, F. / Arai, K. / Sato, M. / Nadahara, S. et al. | 2013
- 46
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Novel Wet Etching of Silicon Nitride in a Single Wafer Spin ProcessorYu, B. / Huang, S. / Yeh, M. / Chen, C.C. / Jang, S.M. / Ratkovich, A. / Yang, D. / Lauerhaas, J.M. / Butterbaugh, J.W. et al. | 2013
- 50
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Selective Nitride Etch by Using Fluorides in High Boiling Point SolventWu, H.C. / Cooper, E.I. / Hsu, H.K. et al. | 2013
- 55
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SiO~2 Etch Rate Modification by Ion ImplantationBellandi, E. / Soncini, V. et al. | 2013
- 58
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Surface Preparations Impact on 248nm Deep UV Photo Resists Adhesion during a Wet EtchFoucaud, M. / Garnier, P. / Joseph, V. / Pargon, E. / Rochat, N. / Tiron, R. et al. | 2013
- 65
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Chemical Control of Surfaces: From Fundamental Understanding to Practical ApplicationHines, M.A. et al. | 2013
- 71
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Surface Preparation of Poly-Si Using Dry Cleaning for Minimizing Interfacial ResistanceSeong, C.K. / Lim, T.S. / Lee, J.G. / Lee, J.I. / Park, K.J. / Kim, K.H. / Shin, Y.G. et al. | 2013
- 75
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A Comparative Study for the Backside Illumination (BSI) Technology Using Bonding Wafer Cleaning Process for Advanced CMOS Image SensorJung, C.K. / Joo, S.W. / Jeong, S.H. / Ryu, S.W. / Lee, H.C. / Cho, J.Y. / Park, G.W. / Lee, Y.J. / Cha, Y.W. / Han, J.W. et al. | 2013
- 79
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Clean Process Mechanism of HKMG during N-PMOS PatterningYeh, A. / Wang, K.P. / Wang, Z.J. / Chien, C.C. / Guo, T. / Chan, M. / Yang, C.L. / Wu, J.Y. / Tan, S.S.H. / Kabansky, A. et al. | 2013
- 82
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Study of Highly Selective and Sensitive Microarray Structure Based on Hydrophilic/Hydrophobic SAMs (Self-Assembled Monolayers)Lee, J.H. / Cho, S.H. / Lim, H.W. / Kim, S.W. / Busnaina, A.A. / Lee, H.Y. / Park, J.G. et al. | 2013
- 86
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Evaluation of CD Fluctuation on QC MonitorYen, C.Y. / Luo, M.C. / Huang, K.B. / Wang, T.C. et al. | 2013
- 90
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In Situ Studies of III-V Surfaces and High-K Atomic Layer DepositionBrennan, B. / McDonnell, S. / Zhernokletov, D. / Dong, H. / Hinkle, C.L. / Kim, J. / Wallace, R.M. et al. | 2013
- 95
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ALD Growth Behavior of High-K Nanolayers on Various Substrates Characterized by X-Ray Spectrometry in Gracing Incidence GeometryMuller, M. / Sioncke, S. / Delabie, A. / Beckhoff, B. et al. | 2013
- 98
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Cleaning of III-V Materials: Surface Chemistry Considerationsvan Dorp, D.H. / Cuypers, D. / Arnauts, S. / Mertens, P.W. / de Gendt, S. et al. | 2013
- 103
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Unique Size-Dependent Challenges for BEOL Cleans in the Patterning of Sub-20 nm FeaturesSingh, K.J. et al. | 2013
- 107
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The Risk of Pattern Collapse for Structures in Future Logic DevicesSankarapandian, M. / Peethala, B. / Canaperi, D. / Peter, D. / Engesser, P. / Okorn-Schmidt, H. et al. | 2013
- 110
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Determination of Surface Energy Characteristics of Plasma Processed Ultra Low-K Dielectrics for Optimized Wetting in Wet Chemical Plasma Etch Residue RemovalAhner, N. / Zimmermann, S. / Schaller, M. / Schulz, S.E. et al. | 2013
- 114
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Wet Removal of Post-Etch Residues by a Combination of UV Irradiation and a SC1 ProcessKesters, E. / Le, Q.T. / Simms, I. / Nafus, K. / Struyf, H. / de Gendt, S. et al. | 2013
- 119
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Analysis of Oxidized Copper Surface and its EvolutionMilanesi, F. / Pipia, F. / Spadoni, S. / Grasso, S. / Ravizza, E. / Pistoni, M. / Alessandri, M. et al. | 2013
- 124
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Introduction of a Dynamic Corrosion Inhibitor for Copper Interconnect CleaningOtake, A. / Kuroda, A. / Luo, R. / Bernatis, P.R. et al. | 2013
- 128
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Removing W Polymer Residue from BEOL Structures Using DSP^+ (Dilute Sulfuric-Peroxide-HF) Mixture - A Case StudyLee, H.H. / Yun, M.S. / Lee, H.W. / Park, J.G. et al. | 2013
- 132
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UV-Induced Modification of Fluorocarbon Polymer: Effect of Treatment Atmosphere and Aging on Dissolution in Organic SolventLe, Q.T. / Kesters, E. / Conard, T. / Struyf, H. / de Gendt, S. et al. | 2013
- 136
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One-Step Wet Clean Removal of Post-Etch Fluoropolymer ResiduesGemmill, W.R. / Kesters, E. / Le, Q.T. et al. | 2013
- 139
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Determination of Fluoride Concentration on Aluminum Bond Pads Using Liquid Phase Extraction Ion ChromatographyBrake, R.T. / Knotter, D.M. / Hees, M.L.-v. et al. | 2013
- 143
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Selective High-Throughput TiN Etching MethodsCooper, E.I. / Rajaram, R. / Payne, M. / Lippy, S. et al. | 2013
- 146
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The Effect of Ar/H2 Plasma Pretreatments on Porous K=2.0 Dielectrics for Pore Sealing by Self-Assembled Monolayers DepositionSun, Y. / Swerts, J. / Verdonck, P. / Maheshwari, A. / Prado, J.L. / de Feyter, S. / Armini, S. et al. | 2013
- 150
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Development of Integrated Wet Cleans for 3D-SIC TechnologiesSuhard, S. / Simms, I. / Brown, I. / Shogo, M. / Koji, K. / Claes, M. / Buisson, T. / Jourdain, A. / Beyer, G. / de Gendt, S. et al. | 2013
- 154
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Post Chemical Mechanical Polish Cleaning Chemistry for through Silicon via ProcessShang, C. / Maw, T. / Coder, F. et al. | 2013
- 161
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Acoustic Bubbles: Control and Interaction with Particles Adhered to a Solid SubstrateMettin, R. / Frommhold, P.E. / Xi, X. / Cegla, F. / Okorn-Schmidt, H. / Lippert, A. / Holsteyns, F. et al. | 2013
- 165
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Single Bubble Cleaning and Vortex FlowReuter, F. / Mettin, R. / Lippert, A. / Holsteyns, F. / Okorn-Schmidt, H. et al. | 2013
- 169
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Acoustic Cavitation Behavior in Isopropyl Alcohol Added Cleaning SolutionKang, B.K. / Jeong, J.H. / Kim, M.S. / Sohn, H.S. / Busnaina, A.A. / Park, J.G. et al. | 2013
- 173
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Towards an Improved Megasonic Cleaning Process: Influence of Surface Tension on Bubble Activity in Acoustic FieldsCamerotto, E. / Brems, S. / Hauptmann, M. / Lurquin, J. / Struyf, H. / Mertens, P.W. / de Gendt, S. et al. | 2013
- 177
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Influence of Dissolved CO~2 on Bubble Activity in Pulsed Acoustic FieldsBrems, S. / Hauptmann, M. / Camerotto, E. / Pacco, A. / Struyf, H. / Heyns, M.M. / Mertens, P.W. / de Gendt, S. / Gottschalk, C. et al. | 2013
- 181
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Evaluation of Very Dilute Alkaline Solutions for Wafer Cleaning with Megasonic IrradiationJeong, J.H. / Kang, B.K. / Kim, M.S. / Sohn, H.S. / Busnaina, A.A. / Park, J.G. et al. | 2013
- 185
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Removal of Fine Particle Using SAPS Technology and Functional WaterWang, D.H. / Ma, Y. / Chen, F.P. / Xie, L.Z. / Wang, X. / Zhang, X.Y. / Lee, J.Y. / Kim, D.J. / Leem, P. et al. | 2013
- 191
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Non Destructive Nanoparticle Removal from Submicron Structures Using Megasonic CleaningKarimi, P. / Busnaina, A.A. / Kang, B.K. / Park, J.G. et al. | 2013
- 195
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Physical Cleaning Enhancement Using Advanced Spray with Uniform Droplet ControlChien, Y.H.C. / Yeh, M. / Ku, S. / Yang, C.M. / Chen, C.C. / Jang, S.M. / Izumoto, K. / Sotoku, K. / Tanaka, T. / Sato, M. et al. | 2013
- 198
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CO~2-Dissolved Water Cleans for 2xnm-Node Silicon Devices in a Single Wafer Megasonic SystemPark, C.G. / Sohn, H.S. et al. | 2013
- 201
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Direct vs. Indirect Megasonic Tank Cleaning Systems; Uniformity, Cleaning Efficiency and Cost of OwnershipDesagher, J. / Dussault, D. / Beck, M. / Lillard, R. / Liebscher, E. et al. | 2013
- 205
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Development of a Near-Field Megasonic Cleaning System for Nano-Particle RemovalKim, H.S. / Lee, Y.L. / Lim, E.S. et al. | 2013
- 209
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Megasonic Cleaning to Remove Nano-Dimensional Contaminants from Wafer Surfaces: An Analytical StudyNagarajan, R. / Jain, S. / Prabhudesai, M.A. / Khanolkar, A. / Reddy, M.P. / Kumar, M.S. / Vetrimurugan, R. / Sundin, P. / Thottathil, S. / Goodson, M.J. et al. | 2013
- 213
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Frictional Analysis of PVA Brush for Post CMP Cleaning: Effects of Rotation Speed, Compression Distance, and Fluid ViscosityFujiwara, T. / Sanada, T. / Fukunaga, A. / Hiyama, H. et al. | 2013
- 217
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A New Retention Method for Sub-10 nm Liquid Filtration Using Fluorescent CdSe QDsLiu, S.W. / Zhang, H.Z. et al. | 2013
- 223
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Investigation of the Evaporation and Wetting Mechanism of IPA-DIW MixturesXu, X.M. / Smeers, J. / Vereecke, G. / Struyf, H. et al. | 2013
- 227
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Effect of the Surface/Water Chemistry on the Creation of WatermarksBelmiloud, N. / Tamaddon, A.H. / Mertens, P.W. / Struyf, H. et al. | 2013
- 231
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Influence of Ammonia Gas Ambient in IPA Drying Process of the Single Wafer Cleaning SystemHagimoto, Y. / Iwamoto, H. / Kawabuchi, Y. / Minami, T. et al. | 2013
- 235
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Wetting Challenges in Cleaning of High Aspect Ratio Nano-StructuresXu, X.M. / Vereecke, G. / van den Hoogen, E. / Smeers, J. / Armini, S. / Delande, T. / Struyf, H. et al. | 2013
- 239
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Evaluation of High-Speed Linear Air-Knife Based Wafer DryerTamaddon, A.H. / Belmiloud, N. / Doumen, G. / Struyf, H. / Mertens, P.W. / Heyns, M.M. et al. | 2013
- 243
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Improved Drying Technology of Single Wafer Tool by Using Hot IPA/DIWKim, C.H. / Yun, M.S. / Hwang, T.H. / Nam, C.H. / Kim, S.C. / Roh, J.H. / Lee, M.S. / An, J.S. et al. | 2013
- 247
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Effects of Substrate Temperature on the Leaning of Micropatterns during Rinse-Dry ProcessKim, T.H. / Kim, J.C. / Kim, S.H. / Kim, H.Y. et al. | 2013
- 252
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Advanced Vacuum Wafer Drying for Thermal Laser Separation Dicing Assessment Results from European Collaborative ``SEAL'' ProjectLe Barillec, O. / Davenet, M. / Favre, A. / Bellet, B. / Koitzsch, M. / Lewke, D. / Schellenberger, M. / Zuhlke, H.U. et al. | 2013
- 261
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Diffusion Behavior of Transition Metals Penetrating Silicon Substrate through Silicon Dioxides by Dopant Ion ImplantationSaga, K. et al. | 2013
- 265
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Evaluation of Hafnium Contamination on Wafer Surfaces after the Wet Cleaning ProcessSaito, S. / Hagimoto, Y. / Iwamoto, H. et al. | 2013
- 269
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Real-Time Analyses of Metal Contaminations in the ppb-RangeHutterer, A. / Bauhuber, M. / Hummel, H. / Lechner, A. et al. | 2013
- 274
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X-Ray Induced Depth Profiling of Ion Implantations into Various Semiconductor MaterialsHonicke, P. / Muller, M. / Beckhoff, B. et al. | 2013
- 277
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Characterization of Surface Metal Contaminations on Fused QuartzLiu, S. / Liu, B. et al. | 2013
- 283
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Cleaning in Crystalline Si Solar Cell ManufacturingSchweckendiek, J. / Hoyer, R. / Patzig-Klein, S. / Delahaye, F. / Knoch, G. / Nussbaumer, H. et al. | 2013
- 289
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How to Overcome the Effects of Silicon Build-Up during Solar Cell Wet Chemical ProcessingKashkoush, I. / Rieker, J. / Chen, G. / Nemeth, D. / Danel, A. et al. | 2013
- 293
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`Just Clean Enough': Wet Cleaning for Solar Cell Manufacturing ApplicationsWostyn, K. / Baekelant, W. / Rip, J. / Haslinger, M. / Kenis, K. / Struyf, H. / Claes, M. / Mertens, P.W. / de Gendt, S. et al. | 2013
- 297
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Optimized Wet Processes and PECVD for High-Efficiency Solar CellsKashkoush, I. / Chen, G. / Nemeth, D. / Rieker, J. et al. | 2013
- 301
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Wet-Chemical Conditioning of H-Terminated Silicon Solar Cell Substrates Investigated by Surface Photovoltage MeasurementsAngermann, H. / Sturzebecher, U. / Kegel, J. / Gottschalk, C. / Wolke, K. / Laades, A. / Conrad, E. / Klimm, C. / Stegemann, B. et al. | 2013
- 305
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Combined Ozone/HF/HCI Based Cleaning and Adjusted Emitter Etch-Back for Silicon Solar CellsMoldovan, A. / Birmann, K. / Rentsch, J. / Zimmer, M. / Gitte, T. / Fittkau, J. et al. | 2013
- 310
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Wet Chemical Oxidation of Silicon Surfaces Prior to the Deposition of All-PECVD AlO~x/a-SiN~x Passivation Stacks for Silicon Solar CellsLaades, A. / Angermann, H. / Sperlich, H.P. / Sturzebecher, U. / Alvarez, C.A.D. / Bahr, M. / Lawerenz, A. et al. | 2013
- 314
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Surface Charge and Interface State Density on Silicon Substrates after Ozone Based Wet-Chemical Oxidation and Hydrogen-TerminationAngermann, H. / Wolke, K. / Gottschalk, C. / Moldovan, A. / Roczen, M. / Fittkau, J. / Zimmer, M. / Rentsch, J. et al. | 2013
- 318
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Aspects of Surface Conditioning for High-Efficient Hetero-Junction Silicon Solar CellsBreitenstein, L. / Ritzau, K.U. / Hermle, M. / Warta, W. et al. | 2013
- 321
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Improved Surface Cleaning by In Situ Hydrogen Plasma for Amorphous/Crystalline Silicon Heterojunction Solar CellsGranata, S.N. / Bearda, T. / Dross, F. / Gordon, I. / Poortmans, J. / Mertens, R.P. et al. | 2013