REGULAR PAPERS - Advanced Packaging Structures - Numerical Stress Analysis of Resin Cracking in LSI Plastic Packages under Temperature Cyclic Loading -- Part III: Material Properties and Package Geometries (Englisch)
- Neue Suche nach: Saitoh, T.
- Neue Suche nach: Saitoh, T.
- Neue Suche nach: Matsuyama, H.
- Neue Suche nach: Toya, M.
In:
IEEE transactions on components, packaging and manufacturing technology / B
;
21
, 4
; 407-412
;
1998
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ISSN:
- Aufsatz (Zeitschrift) / Print
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Titel:REGULAR PAPERS - Advanced Packaging Structures - Numerical Stress Analysis of Resin Cracking in LSI Plastic Packages under Temperature Cyclic Loading -- Part III: Material Properties and Package Geometries
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Beteiligte:
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Erschienen in:
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Verlag:
- Neue Suche nach: IEEE
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Erscheinungsort:New York, NY
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Erscheinungsdatum:1998
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ISSN:
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ZDBID:
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Medientyp:Aufsatz (Zeitschrift)
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Format:Print
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Sprache:Englisch
- Neue Suche nach: 53.56 / 53.51 / 53.12
- Weitere Informationen zu Basisklassifikation
- Neue Suche nach: 770/5600/5620
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Schlagwörter:
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Klassifikation:
BKL: 53.56 Halbleitertechnologie / 53.51 Bauelemente der Elektronik / 53.12 Bauelemente der Elektrotechnik Lokalklassifikation TIB: 770/5600/5620 -
Datenquelle:
Inhaltsverzeichnis – Band 21, Ausgabe 4
Zeige alle Jahrgänge und Ausgaben
Die Inhaltsverzeichnisse werden automatisch erzeugt und basieren auf den im Index des TIB-Portals verfügbaren Einzelnachweisen der enthaltenen Beiträge. Die Anzeige der Inhaltsverzeichnisse kann daher unvollständig oder lückenhaft sein.
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ContentsHenning, A.K. / Firch, J.S. / Harris, J.M. / Dehan, E.B. / Cozad, B.A. / Christel, L. / Fathi, Y. / Hopkins, D.A. / Lilly, L.J. / McCulley, W. et al. | 1998
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1998 Index: IEEE Transactions on Components, Packaging, and Manufacturing Technology — Part B: Advanced packaging Vol. 21| 1998
- 322
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CONTRIBUTIONS FROM THE 2ND IEEE INTERNATIONAL CONFERENCE ON INNOVATIVE SYSTEMS IN SILICON - ForewordBolouri, H. et al. | 1998
- 322
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Foreword: Microelectronics system integrationBolouri, Hamid / Laforge, Laurence E. et al. | 1998
- 324
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CONTRIBUTIONS FROM THE 2ND IEEE INTERNATIONAL CONFERENCE ON INNOVATIVE SYSTEMS IN SILICON - Review and Summary of a Silicon Micromachined Gas Chromatography SystemKolesar, E.S. et al. | 1998
- 324
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Review and summary of a silicon micromachined gas chromatography systemKolesar, Edward S. / Reston, Rocky R. et al. | 1998
- 329
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CONTRIBUTIONS FROM THE 2ND IEEE INTERNATIONAL CONFERENCE ON INNOVATIVE SYSTEMS IN SILICON - Microfluidic MEMS for Semiconductor ProcessingHenning, A.K. et al. | 1998
- 329
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Microfluidic MEMS for semiconductor processingHenning, Albert K. / Fitch, John S. / Harris, James M. / Dehan, Edward B. / Cozad, Bradford A. / Christel, Lee / Fathi, Youssof / Hopkins, Dean A. / Lilly, Les J. / McCulley, Wendell et al. | 1998
- 338
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CONTRIBUTIONS FROM THE 2ND IEEE INTERNATIONAL CONFERENCE ON INNOVATIVE SYSTEMS IN SILICON - Architecture, Defect Tolerance, and Buffer Design for a New ATM SwitchJain, V.K. et al. | 1998
- 338
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Architecture, defect tolerance, and buffer design for a new ATM switchJain, Vijay K. / Lin, Lei / Horiguchi, Susumu et al. | 1998
- 346
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CONTRIBUTIONS FROM THE 2ND IEEE INTERNATIONAL CONFERENCE ON INNOVATIVE SYSTEMS IN SILICON - Programmable Neural LogicBohossian, V. et al. | 1998
- 346
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Programmable neural logicBohossian, Vasken / Hasler, Paul / Bruck, Jehoshua et al. | 1998
- 352
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CONTRIBUTIONS FROM THE 2ND IEEE INTERNATIONAL CONFERENCE ON INNOVATIVE SYSTEMS IN SILICON - Possibilities and Limitations of IDDQ Testing in Submicron CMOSFigueras, J. et al. | 1998
- 352
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Possibilities and limitations of IDDQ testing in submicron CMOSFigueras, Joan / Ferre, Antoni et al. | 1998
- 360
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CONTRIBUTIONS FROM THE 2ND IEEE INTERNATIONAL CONFERENCE ON INNOVATIVE SYSTEMS IN SILICON - Economics Modeling of Multichip Modules Testing StrategiesAbadir, M. et al. | 1998
- 360
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Economics modeling of multichip modules testing strategiesAbadir, Magdy et al. | 1998
- 371
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Solder-jetted eutectic PbSn bumps for flip-chipBaggerman, Antal F. J. / Schwarzbach, Daniel et al. | 1998
- 371
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REGULAR PAPERS - Chip and Package Connections - Solder-Jetted Eutectic PbSn Bumps for Flip-ChipBaggerman, A.F.J. et al. | 1998
- 382
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Polymeric conductive pastes as solder replacement for flip-chip attachmentManer, Kaoru U. / Ang, Simon S. / Schaper, Leonard W. / Brown, William D. et al. | 1998
- 382
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REGULAR PAPERS - Chip and Package Connections - Polymeric Conductive Pastes as Solder Replacement for Flip-Chip AttachmentManer, K.U. et al. | 1998
- 394
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REGULAR PAPERS - Chip and Package Connections - Interface Reaction between Ag-Pd Conductor and Pd-Sn SolderMoriya, Y. et al. | 1998
- 394
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Interface reaction between Ag-Pd conductor and Pd-Sn solderMoriya, Yoichi / Yamade, Yoshiaki / Shinya, Ryuji et al. | 1998
- 398
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REGULAR PAPERS - Chip and Package Connections - Aging Effects on Shear Fatigue Life and Shear Strength of Soldered Thick Film JointsLi, G.Y. et al. | 1998
- 398
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Aging effects on shear fatigue life and shear strength of soldered thick film jointsLi, G. Y. / Chan, Y. C. et al. | 1998
- 407
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REGULAR PAPERS - Advanced Packaging Structures - Numerical Stress Analysis of Resin Cracking in LSI Plastic Packages under Temperature Cyclic Loading -- Part III: Material Properties and Package GeometriesSaitoh, T. et al. | 1998
- 407
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Numerical stress analysis of resin cracking in LSI plastic packages under temperature cyclic loading — Part III: Material properties and package geometriesSaitoh, Takehiro / Matsuyama, Hidehito / Toya, Masayuki et al. | 1998
- 413
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REGULAR PAPERS - Advanced Packaging Structures - Effective Material Properties and Thermal Stress Analysis of Epoxy Molding Compound in Electronic PackagingShin, D.K. et al. | 1998
- 413
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Effective material properties and thermal stress analysis of epoxy molding compound in electronic packagingShin, Dong Kil / Lee, Jung Ju et al. | 1998
- 422
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Linear fracture mechanics analysis on growth of interfacial delamination in lsi plastic packages under temperature cyclic loadingSaitoh, Takehiro / Matsuyama, Hidehito / Toya, Masayuki et al. | 1998
- 422
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REGULAR PAPERS - Advanced Packaging Structures - Linear Fracture Mechanics Analysis on Growth of Interfacial Delamination in LSI Plastic Packages under Temperature Cyclic LoadingSaitoh, T. et al. | 1998
- 428
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REGULAR PAPERS - Electrical Modeling and Performance - A Low-Cost Technique for Reducing the Simultaneous Switching Noise in Sub-Board Packaging ConfigurationsKoike, S. et al. | 1998
- 428
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A low-cost technique for reducing the simultaneous switching noise in sub-board packaging configurationsKoike, Shinji / Kaizu, Katsumi et al. | 1998
- 434
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REGULAR PAPERS - Electrical Modeling and Performance - Effects of Floating Planes in Three-Dimensional Packaging Structures on Simultaneous Switching NoiseVakanas, L. et al. | 1998
- 434
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Effects of floating planes in three-dimensional packaging structures on simultaneous switching noiseVakanas, Loizos / Hasan, Samil / Cangellaris, Andreas / Prince, John L. et al. | 1998
- 441
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Dielectric constant and loss tangent measurement using a stripline fixtureYue, Heping / Virga, Kathleen L. / Prince, John L. et al. | 1998
- 441
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REGULAR PAPERS - Electrical Modeling and Performance - Dielectric Constant and Loss Tangent Measurement Using a Stripline FixtureYue, H. et al. | 1998
- 447
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An 8-bit 2-gigasample/second A/D converter multichip module for digital receiver demonstration on Navy AN/APS-145 E2-C airborne early warning aircraft radarThompson, Rick L. / Degerstrom, Michael J. / Walters, Wayne L. / Vickberg, Mark E. / Riemer, Paul J. / Amundsen, Eric L. H. / Gilbert, Barry K. et al. | 1998
- 447
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REGULAR PAPERS - Packaging and Interconnects - An 8-Bit 2-Gigasample-Second A-D Converter Multichip Module for Digital Receiver Demonstration on Navy AN-APS-145 E2-C Airborne Early Warning Aircraft RadarThompson, R.L. et al. | 1998
- 463
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REGULAR PAPERS - Packaging and Interconnects - Microstrip-to-Microstrip Interconnects with Adhesive Bonded Ribbons for Micro- and Millimeterwave ApplicationsPohlmann, W. et al. | 1998
- 463
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Microstrip-to-microstrip interconnects with adhesive bonded ribbons for micro- and millimeterwave applicationsPohlmann, Wolfgang / Jacob, Arne F. / Schafer, Helmut et al. | 1998
- 471
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REGULAR PAPERS - Optoelectronic Packaging - Multidimensional VCSEL-Array Push-Pull Module Fabricated Using the Self-Alignment Mounting TechniqueKosaka, H. et al. | 1998
- 471
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Multidimensional VCSEL-array push/pull module fabricated using the self-alignment mounting techniqueKosaka, Hideo / Kajita, Mikihiro / Sugimoto, Yoshimasa et al. | 1998
- 479
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ANNOUNCEMENTS - Editor-in-Chief s StatementKrusius, J.A. et al. | 1998
- 479
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Editor's statementKrusius, J. Peter et al. | 1998
- 480
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Foreword contributions from the sixth topical meeting on electrical performance of electronic packagingDeutsch, Alina / Prince, John L. et al. | 1998
- 480
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ANNOUNCEMENTS - Foreword -- Contributions from the 6th Topical Meeting on Electrical Performance of Electronic PackagingDeutsch, A. et al. | 1998
- 482
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ANNOUNCEMENTS - Correction -- 1997 List of ReviewersKrusius, J.P. et al. | 1998
- 482
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Correction to “1997 list of reviewers”Krusius, J. Peter et al. | 1998
- 483
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1998 INDEX| 1998
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[Front cover]Bolouri, H. / Laforge, L.E. et al. | 1998
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Inside front coverKolesar, E.S. / Reston, R.R. et al. | 1998
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[Back inside cover]| 1998
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[Back cover]| 1998