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Both encapsulated and unencapsulated Ti-Pd-Au thin-film conductors on Al2O3 substrates were biased in an 85 C 80% RH environment contaminated with Cl2. The encapsulant was an RTV silicone rubber. During exposure to the corrosive environment, leakage currents between adjacent conductors were periodically measured and recorded. Leakage currents for the unencapsulated specimens increased with time, and many were shorted approximately 400 h. There were no increases in leakage currents for the silicone rubber encapsulated conductors. At the end of the test, selected specimens were examined using a light microscope and an SEM with X-ray capability. No metal migration was observed on the encapsulated samples. The unencapsulated conductors showed dendritic growth between the electrodes. It is concluded that the RTV silicone encapsulant effectively prevents high leakage currents and subsequent metal migration on biased Ti-Pd-Au conductor specimens exposed to a moist Cl2 environment.