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Pre-plated strips covered with Sn and Sn-Pb alloys are used for electric and electronic components including connectors, terminals, lead frames, and circuit conductors. This report gives the results of investigation and analysis of their quality and properties for reference for material designing. They cover (1) effect of plating thickness, (2) effect of Sn and Sn-Pb alloying composition, (3) solder wettability and solder joint strength varying with time, (4) electrical connectability, (5) long-time observation of whisker and nodule generation, (6) long-time reliability in cohesion of plating film, (7) effect on springing property, (8) problems in plating treatment and (9) features and selection of base materials.