Effect of thermal cycling on the solder joints' reliability of ceramic ball grid array (Englisch)
- Neue Suche nach: Sarkar, G.
- Neue Suche nach: Wee, P.H.
- Neue Suche nach: Masrena
- Neue Suche nach: Kuo, M.
- Neue Suche nach: Mukherjee, S.N.
- Neue Suche nach: Sarkar, G.
- Neue Suche nach: Wee, P.H.
- Neue Suche nach: Masrena
- Neue Suche nach: Kuo, M.
- Neue Suche nach: Mukherjee, S.N.
In:
Journal of Materials Science Letters
;
21
, 1
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61-63
;
2002
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ISSN:
- Aufsatz (Zeitschrift) / Print
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Titel:Effect of thermal cycling on the solder joints' reliability of ceramic ball grid array
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Weitere Titelangaben:Einfluß der thermischen Wechselbeanspruchung auf die Zuverlässigkeit der Lötverbindungen der Keramikkugel-Gitteranordnung
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Beteiligte:Sarkar, G. ( Autor:in ) / Wee, P.H. ( Autor:in ) / Masrena ( Autor:in ) / Kuo, M. ( Autor:in ) / Mukherjee, S.N. ( Autor:in )
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Erschienen in:Journal of Materials Science Letters ; 21, 1 ; 61-63
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Verlag:
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Erscheinungsdatum:2002
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Format / Umfang:3 Seiten, 7 Bilder, 7 Quellen
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ISSN:
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Coden:
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DOI:
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Medientyp:Aufsatz (Zeitschrift)
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Format:Print
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Sprache:Englisch
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Schlagwörter:
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Datenquelle:
Inhaltsverzeichnis – Band 21, Ausgabe 1
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