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The advent of additives to RCA cleaning which prevent and remove metallic impurities have paved the way for single step (SC-1 only) RCA replacement cleans. However, the need to clean faster and remove smaller and smaller particles cannot be met by these additives alone. The addition of a surfactant to the SC-1 solution can greatly improve thc particle removal ability of the SC-1 liquid. Surfactants increase a cleaning solution's effectiveness by helping it wet the wafer surface and by dispersing (or carrying) particles from the wafer surface; all at very low concentrations. In this work we have investigated several types of surfactants and their ability to enhance the particle removal capability of a modified SC-1 only clean. The enhancement of the surfactant coupled with fast single wafer cleaning reduces cyclic time and defect densities for advanced 300 mm wafer processing.