Cooling of mobile electronic devices using phase change materials (Englisch)
- Neue Suche nach: Tan, F.L.
- Neue Suche nach: Tso, C.P.
- Neue Suche nach: Tan, F.L.
- Neue Suche nach: Tso, C.P.
In:
Applied Thermal Engineering
;
24
, 2-3
;
159-169
;
2004
-
ISSN:
- Aufsatz (Zeitschrift) / Print
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Titel:Cooling of mobile electronic devices using phase change materials
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Beteiligte:
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Erschienen in:Applied Thermal Engineering ; 24, 2-3 ; 159-169
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Verlag:
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Erscheinungsdatum:2004
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Format / Umfang:11 Seiten, 6 Quellen
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ISSN:
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Coden:
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DOI:
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Medientyp:Aufsatz (Zeitschrift)
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Format:Print
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Sprache:Englisch
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Schlagwörter:
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Datenquelle:
Inhaltsverzeichnis – Band 24, Ausgabe 2-3
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