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The authors carried out a life-cycle assessment of packaging materials designed to protect LSIs (large-scale integration devices) from shock and static electricity when they are transported from the semiconductor factory to the printed-circuit-board factory. CO2 emissions from the production and incineration process were found to be reduced by 11 % when plastic tape made from non-renewable sources was replaced by material made from plant-based resin. In addition, the environmental burden of embossed tape, which is a light packaging material, was less than that of tray-type packaging, but when the recycling rate for the trays was improved from 0 (disposable) to 90 %, the environmental burden of the trays was reduced by 65 %. When the recovery rate was 90 % or higher, the trays and embossed tape were shown to impose the same level of environmental burden.