Isothermal aging effects on the microstructure and solder bump shear strength of eutectic Sn37Pb and Sn3.5Ag solders (Englisch)
- Neue Suche nach: Chen, W.M.
- Neue Suche nach: McCloskey, P.
- Neue Suche nach: O'Mathuna, S.C.
- Neue Suche nach: Chen, W.M.
- Neue Suche nach: McCloskey, P.
- Neue Suche nach: O'Mathuna, S.C.
In:
Microelectronics Reliability
;
46
, 5-6
;
896-904
;
2006
-
ISSN:
- Aufsatz (Zeitschrift) / Print
-
Titel:Isothermal aging effects on the microstructure and solder bump shear strength of eutectic Sn37Pb and Sn3.5Ag solders
-
Beteiligte:
-
Erschienen in:Microelectronics Reliability ; 46, 5-6 ; 896-904
-
Verlag:
-
Erscheinungsdatum:2006
-
Format / Umfang:9 Seiten, 30 Quellen
-
ISSN:
-
Coden:
-
DOI:
-
Medientyp:Aufsatz (Zeitschrift)
-
Format:Print
-
Sprache:Englisch
-
Schlagwörter:
-
Datenquelle:
Inhaltsverzeichnis – Band 46, Ausgabe 5-6
Zeige alle Jahrgänge und Ausgaben
Die Inhaltsverzeichnisse werden automatisch erzeugt und basieren auf den im Index des TIB-Portals verfügbaren Einzelnachweisen der enthaltenen Beiträge. Die Anzeige der Inhaltsverzeichnisse kann daher unvollständig oder lückenhaft sein.
- 655
-
Introduction to special section on selected papers from EOS/ESD Symposium 2004Iyer, Natarajan Mahadeva et al. | 2005
- 656
-
Gate oxide failures due to anomalous stress from HBM ESD testersDuvvury, Charvaka / Steinhoff, Robert / Boselli, Gianluca / Reddy, Vijay / Kunz, Hans / Marum, Steve / Cline, Roger et al. | 2005
- 666
-
Study of CDM specific effects for a smart power input protection structureEtherton, M. / Qu, N. / Willemen, J. / Wilkening, W. / Mettler, S. / Dissegna, M. / Stella, R. / Zullino, L. / Andreini, A. / Gieser, H. et al. | 2005
- 677
-
ESD protection solutions for high voltage technologiesKeppens, Bart / Mergens, Markus P.J. / Trinh, Cong Son / Russ, Christian C. / Van Camp, Benjamin / Verhaege, Koen G. et al. | 2005
- 689
-
Physical fundamentals of external transient latch-up and corrective actionsDomański, K. / Półtorak, B. / Bargstädt-Franke, S. / Stadler, W. / Bała, W. et al. | 2005
- 702
-
Implementation of plug-and-play ESD protection in 5.5GHz 90nm RF CMOS LNAs—Concepts, constraints and solutionsThijs, S. / Natarajan, M.I. / Linten, D. / Jeamsaksiri, W. / Daenen, T. / Degraeve, R. / Scholten, Andries / Decoutere, S. / Groeseneken, G. et al. | 2005
- 713
-
Reliability and performance limitations in SiC power devicesSingh, Ranbir et al. | 2005
- 731
-
Understanding threshold voltage in undoped-body MOSFETs: An appraisal of various criteriaSánchez, F.J. Garcı́a / Ortiz-Conde, A. / Muci, J. et al. | 2005
- 743
-
Characterisation of the Al2O3 films deposited by ultrasonic spray pyrolysis and atomic layer deposition methods for passivation of 4H–SiC devicesWolborski, Maciej / Bakowski, Mietek / Ortiz, Armando / Pore, Viljami / Schöner, Adolf / Ritala, Mikko / Leskelä, Markku / Hallén, Anders et al. | 2005
- 756
-
Vertically high-density interconnection for mobile applicationKatahira, Takayoshi / Kartio, Ilkka / Segawa, Hiroshi / Takahashi, Michimasa / Sagisaka, Katsumi et al. | 2005
- 763
-
Development of bulk nanostructured copper with superior hardness for use as an interconnect material in electronic packagingPan, M.Y. / Gupta, M. / Tay, A.A.O. / Vaidyanathan, K. et al. | 2005
- 768
-
Investigation of the influence of thermal treatment on interconnect-barrier interfaces in copper metallization systemsAubel, Oliver / Bugiel, Eberhard / Krüger, Dietmar / Hasse, Wolfgang / Hommel, Martina et al. | 2005
- 774
-
Effects of different bonding parameters on the electrical performance and peeling strengths of ACF interconnectionChen, Xu / Zhang, Jun / Jiao, Chunlei / Liu, Yanmin et al. | 2005
- 786
-
Comparative studies of Pt and Ir schottky contacts on undoped Al0.36Ga0.64NGuhel, Y. / Boudart, B. / Delos, E. / Germain, M. / Bougrioua, Z. et al. | 2005
- 794
-
The effect of die attach voiding on the thermal resistance of chip level packagesFleischer, Amy S. / Chang, Li-hsin / Johnson, Barry C. et al. | 2005
- 805
-
Nano-mechanical electro-thermal probe array used for high-density storage based on NEMS technologyYang, Zunxian / Yu, Ying / Li, Xinxin / Bao, Haifei et al. | 2005
- 811
-
Resolution improvement of acoustic microimaging by continuous wavelet transform for semiconductor inspectionZhang, Guang-Ming / Harvey, David M. / Braden, Derek R. et al. | 2005
- 822
-
Stress analysis and bending tests for GaAs wafersDreyer, W. / Duderstadt, F. / Eichler, S. / Jurisch, M. et al. | 2005
- 836
-
Effect of wafer thinning methods towards fracture strength and topography of silicon dieJiun, Hoh Huey / Ahmad, Ibrahim / Jalar, Azman / Omar, Ghazali et al. | 2005
- 846
-
Statistical analysis of tin whisker growthFang, Tong / Osterman, Michael / Pecht, Michael et al. | 2005
- 850
-
Improvement in high-temperature degradation by isotropic conductive adhesives including Ag–Sn alloy fillersYamashita, M. / Suganuma, K. et al. | 2005
- 859
-
On solution schemes for time-independent thermomechanical analysis for structures containing polymeric materialsLai, Yi-Shao et al. | 2005
- 864
-
A quantitative method of reliability estimation for surface mount solder joints based on heating factor QetaDing, Han / Tao, Bo / Wu, Yiping / Xiong, Y.L. et al. | 2006
- 864
-
A quantitative method of reliability estimation for surface mount solder joints based on heating factor QηTao, Bo / Wu, Yiping / Ding, Han / Xiong, Y.L. et al. | 2005
- 873
-
Interfacial thermal stresses in solder joints of leadless chip resistorsGhorbani, H.R. / Spelt, J.K. et al. | 2005
- 885
-
Transient fracturing of solder joints subjected to displacement-controlled impact loadsYeh, Chang-Lin / Lai, Yi-Shao et al. | 2005
- 896
-
Isothermal aging effects on the microstructure and solder bump shear strength of eutectic Sn37Pb and Sn3.5Ag soldersChen, W.-M. / McCloskey, P. / O’Mathuna, S.C. et al. | 2005
- 905
-
High temperature reliability and interfacial reaction of eutectic Sn–0.7Cu/Ni solder joints during isothermal agingYoon, Jeong-Won / Jung, Seung-Boo et al. | 2005
- 915
-
Characteristics of current crowding in flip-chip solder bumpsLai, Yi-Shao / Kao, Chin-Li et al. | 2005
- 923
-
Experimental study on the thermo-mechanical effects of underfill and low-CTE substrate in a flip-chip deviceMorita, Yasuyuki / Arakawa, Kazuo / Todo, Mitsugu / Kaneto, Masayuki et al. | 2005
- 930
-
New insights into board level drop impactWong, E.H. / Mai, Y.-W. et al. | 2005
- 939
-
Feasibility study of the application of voltage contrast to printed circuit boardTan, Cher Ming / Gan, Zhenghao / Chai, Tai Chong et al. | 2005
- 949
-
Integrated CMOS GSM baseband channel selecting filters realized using switched capacitor finite impulse response techniqueDąbrowski, A. / Długosz, R. / Pawłowski, P. et al. | 2005
- 959
-
CFCET: A hardware-based control flow checking technique in COTS processors using execution tracingRajabzadeh, Amir / Miremadi, Seyed Ghassem et al. | 2005
- 973
-
A reliability-driven placement procedure based on thermal-force modelLee, Jing et al. | 2005
- 984
-
Investigation of increased performance of close series stacked tube axial fans due to inclusion of diffuser elementJilesen, J. / Lien, F.S. / Ahn, H. et al. | 2005
- 994
-
Study of RF N− LDMOS critical electrical parameter drifts after a thermal and electrical ageing in pulsed RFMaanane, H. / Masmoudi, M. / Marcon, J. / Belaid, M.A. / Mourgues, K. / Tolant, C. / Ketata, K. / Eudeline, Ph. et al. | 2005
- 1001
-
Study of the power capability of LDMOS and the improved methodsSun, Zhilin / Sun, Weifeng / Yi, Yangbo / Shi, Longxing et al. | 2005
- 1006
-
Critical dimension control in photolithography based on the yield by a simulation programKang, H.Y. / Lee, A.H.I. et al. | 2005
- 1013
-
Life margin assessment with Physics of Failure Tools application to BGA packagesFoucher, B. / Tomas, J. / Mounsi, F. / Jeremias, M. et al. | 2005
- 1019
-
Distributed collaborative design of IP components in the TRMS environmentSiekierska, K. / Fraś, P. / Kokoszka, A. / Kostienko, T. / Ługowski, N. / Obrębski, D. / Pawlak, A. / Penkala, P. / Stachańczyk, D. / Szlęzak, M. et al. | 2005
- 1025
-
Book reviewStojcev, M. et al. | 2006