Packaging parameter analysis and optimization design on solder joint reliability for twin die stacked packages by variance in strain energy density (SED) of each solder joint (Englisch)
- Neue Suche nach: Mao, Chao-Yang
- Neue Suche nach: Chen, Rong-Sheng
- Neue Suche nach: Mao, Chao-Yang
- Neue Suche nach: Chen, Rong-Sheng
In:
Microelectronics Reliability
;
48
, 1
;
119-131
;
2008
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ISSN:
- Aufsatz (Zeitschrift) / Print
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Titel:Packaging parameter analysis and optimization design on solder joint reliability for twin die stacked packages by variance in strain energy density (SED) of each solder joint
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Weitere Titelangaben:Analyse der Gehäuseparameter und des Optimierungsentwurfs für die Lötverbindungszuverlässigkeit von Twin-Die-Stacked-Packages durch Varianz in der Dehnungsenergiedichte jeder Lötverbindung
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Beteiligte:Mao, Chao-Yang ( Autor:in ) / Chen, Rong-Sheng ( Autor:in )
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Erschienen in:Microelectronics Reliability ; 48, 1 ; 119-131
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Verlag:
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Erscheinungsdatum:2008
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Format / Umfang:13 Seiten, 14 Bilder, 4 Tabellen, 8 Quellen
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ISSN:
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Coden:
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DOI:
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Medientyp:Aufsatz (Zeitschrift)
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Format:Print
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Sprache:Englisch
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Schlagwörter:
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Datenquelle:
Inhaltsverzeichnis – Band 48, Ausgabe 1
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