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This paper investigates the piezo fan technology and its application for thermal management of small form factor, low power consumption and low acoustic noise cooling devices. Piezo fan provides another option in the electronic devices that the traditional rotary axial fan or blower may not be suitable due to space, power consumption or acoustic noise constraints. In this study, 3 different designs were proposed for different electronics application. The effect of piezo fan is first verified first by using removing air boundary as well as the air flow of a piezo fan. Then, A design using piezo fan and heat sink was proposed to cool multiple heat sources. This design reduces the volume of heat sink to 25 % of the volume that uses natural convection. The last design is a multiple blade piezo fan heat sink so called 'raked piezo fan. In this design, the blades were designed to thin the thermal boundary layer proximity to the heat sink fin surfaces in addition to the airflow generation. This design reduces the height of the thermal module for the small factor electronics component. Furthermore, the design provides higher cooling performance and is tested by using by 15 W and 35 W heater.