Thermomigration and electromigration in Sn8Zn3Bi solder joints (Englisch)
- Neue Suche nach: Gu, X.
- Neue Suche nach: Yung, K.C.
- Neue Suche nach: Chan, Y.C.
- Neue Suche nach: Yang, D.
- Neue Suche nach: Gu, X.
- Neue Suche nach: Yung, K.C.
- Neue Suche nach: Chan, Y.C.
- Neue Suche nach: Yang, D.
In:
Journal of Materials Science - Materials in Electronics
;
22
, 3
;
217-222
;
2011
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ISSN:
- Aufsatz (Zeitschrift) / Print
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Titel:Thermomigration and electromigration in Sn8Zn3Bi solder joints
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Beteiligte:
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Erschienen in:Journal of Materials Science - Materials in Electronics ; 22, 3 ; 217-222
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Verlag:
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Erscheinungsdatum:2011
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Format / Umfang:6 Seiten, 4 Bilder, 1 Tabelle, 17 Quellen
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ISSN:
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Coden:
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DOI:
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Medientyp:Aufsatz (Zeitschrift)
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Format:Print
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Sprache:Englisch
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Schlagwörter:
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Datenquelle:
Inhaltsverzeichnis – Band 22, Ausgabe 3
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Thermomigration and electromigration in Sn8Zn3Bi solder jointsGu, X. / Yung, K. C. / Chan, Y. C. / Yang, D. et al. | 2010
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