Investigating condensation heat transfer during vapour phase soldering on round-shaped PCB plates (Englisch)
- Neue Suche nach: Geczy, Attila
- Neue Suche nach: Illes, Balazs
- Neue Suche nach: Darnai, Tamas
- Neue Suche nach: Geczy, Attila
- Neue Suche nach: Illes, Balazs
- Neue Suche nach: Darnai, Tamas
In:
International Journal of Heat and Mass Transfer
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86
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639-647
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2015
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ISSN:
- Aufsatz (Zeitschrift) / Print
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Titel:Investigating condensation heat transfer during vapour phase soldering on round-shaped PCB plates
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Beteiligte:
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Erschienen in:International Journal of Heat and Mass Transfer ; 86 ; 639-647
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Verlag:
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Erscheinungsdatum:2015
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Format / Umfang:9 Seiten, 38 Quellen
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ISSN:
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Coden:
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DOI:
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Medientyp:Aufsatz (Zeitschrift)
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Format:Print
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Sprache:Englisch
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Schlagwörter:
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Datenquelle:
Inhaltsverzeichnis – Band 86
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